JP2019089978A5 - - Google Patents

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Publication number
JP2019089978A5
JP2019089978A5 JP2017220965A JP2017220965A JP2019089978A5 JP 2019089978 A5 JP2019089978 A5 JP 2019089978A5 JP 2017220965 A JP2017220965 A JP 2017220965A JP 2017220965 A JP2017220965 A JP 2017220965A JP 2019089978 A5 JP2019089978 A5 JP 2019089978A5
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JP
Japan
Prior art keywords
core material
flattening
clad laminate
copper
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017220965A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019089978A (ja
JP7062331B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2017220965A external-priority patent/JP7062331B2/ja
Priority to JP2017220965A priority Critical patent/JP7062331B2/ja
Priority to KR1020180136472A priority patent/KR102633608B1/ko
Priority to CN201811338968.XA priority patent/CN109795208B/zh
Priority to US16/189,478 priority patent/US20190144619A1/en
Priority to DE102018219425.4A priority patent/DE102018219425A1/de
Priority to TW107140502A priority patent/TWI805646B/zh
Publication of JP2019089978A publication Critical patent/JP2019089978A/ja
Publication of JP2019089978A5 publication Critical patent/JP2019089978A5/ja
Publication of JP7062331B2 publication Critical patent/JP7062331B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017220965A 2017-11-16 2017-11-16 芯材の製造方法及び銅張積層板の製造方法 Active JP7062331B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2017220965A JP7062331B2 (ja) 2017-11-16 2017-11-16 芯材の製造方法及び銅張積層板の製造方法
KR1020180136472A KR102633608B1 (ko) 2017-11-16 2018-11-08 심재의 제조 방법 및 구리 피복 적층판의 제조 방법
CN201811338968.XA CN109795208B (zh) 2017-11-16 2018-11-12 芯材的制造方法和覆铜层叠板的制造方法
US16/189,478 US20190144619A1 (en) 2017-11-16 2018-11-13 Method of manufacturing core material and method of manufacturing copper clad laminate
DE102018219425.4A DE102018219425A1 (de) 2017-11-16 2018-11-14 Herstellungsverfahren eines Kernmaterials und Herstellungsverfahren für eine kupferüberzogene Schichtstruktur
TW107140502A TWI805646B (zh) 2017-11-16 2018-11-15 芯材的製造方法及覆銅層積板的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017220965A JP7062331B2 (ja) 2017-11-16 2017-11-16 芯材の製造方法及び銅張積層板の製造方法

Publications (3)

Publication Number Publication Date
JP2019089978A JP2019089978A (ja) 2019-06-13
JP2019089978A5 true JP2019089978A5 (enExample) 2019-09-19
JP7062331B2 JP7062331B2 (ja) 2022-05-06

Family

ID=66335883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017220965A Active JP7062331B2 (ja) 2017-11-16 2017-11-16 芯材の製造方法及び銅張積層板の製造方法

Country Status (6)

Country Link
US (1) US20190144619A1 (enExample)
JP (1) JP7062331B2 (enExample)
KR (1) KR102633608B1 (enExample)
CN (1) CN109795208B (enExample)
DE (1) DE102018219425A1 (enExample)
TW (1) TWI805646B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020070386A (ja) * 2018-11-01 2020-05-07 株式会社ディスコ 芯材の製造方法及び銅張積層板の製造方法
CN120439623A (zh) * 2019-01-11 2025-08-08 株式会社力森诺科 覆金属层叠板的制造方法、覆金属层叠板、印刷布线板及半导体封装体、以及无芯基板形成用支承体及半导体再布线层形成用支承体

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56118853A (en) 1980-02-25 1981-09-18 Fujitsu Ltd Manufacture of copper lined laminate
JPS5856276B2 (ja) * 1980-03-31 1983-12-14 日立化成工業株式会社 難燃耐熱性銅張り積層板の製造法
JPS5939546A (ja) * 1982-08-30 1984-03-03 東芝ケミカル株式会社 銅張積層板
JPH0641063B2 (ja) * 1987-05-28 1994-06-01 雅博 今川 Ｆｒｐパイプの内面研削装置
JPH04346494A (ja) * 1991-05-24 1992-12-02 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法
JPH0556355U (ja) * 1991-12-30 1993-07-27 有限会社村上技研 ネットディスクの保持具
US5439164A (en) * 1992-06-05 1995-08-08 Matsushita Electric Industrial Co., Ltd. Methods for joining copper or its alloys
JPH1134221A (ja) * 1997-07-15 1999-02-09 Matsushita Electric Works Ltd 銅張り積層板の製造方法
TW453141B (en) * 1998-09-28 2001-09-01 Ibiden Co Ltd Printed circuit board and its manufacture method
ES2305058T3 (es) * 2000-03-03 2008-11-01 Hitachi Chemical Company, Ltd. Procedimiento de reparacion de una preimpregnacion.
JP2002232135A (ja) * 2001-01-30 2002-08-16 Matsushita Electric Ind Co Ltd 積層用両面回路基板とその製造方法及びそれを用いた多層プリント配線板
US7874937B2 (en) * 2007-12-19 2011-01-25 Taylor Made Golf Company, Inc. Composite articles and methods for making the same
JP5492577B2 (ja) 2010-01-25 2014-05-14 旭化成イーマテリアルズ株式会社 印刷原版及び印刷版の製造方法
JP2012174874A (ja) * 2011-02-21 2012-09-10 Fujitsu Ltd プリント配線板の製造方法及びプリント配線板
CN103649185B (zh) * 2011-06-28 2017-06-09 住友电木株式会社 半固化片、层压板、半导体封装件及层压板的制造方法
TW201400294A (zh) * 2012-03-30 2014-01-01 Sumitomo Bakelite Co 被研磨物保持材及用於此之積層板
JP6015303B2 (ja) * 2012-09-27 2016-10-26 日立化成株式会社 プリプレグ、積層板及びプリント配線板
JP2016060031A (ja) 2014-09-22 2016-04-25 株式会社ディスコ 研削ホイール
CN105619841A (zh) * 2015-12-29 2016-06-01 东华大学 一种热塑性复合材料成型方法

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