JP2014528161A5 - - Google Patents
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- Publication number
- JP2014528161A5 JP2014528161A5 JP2014527793A JP2014527793A JP2014528161A5 JP 2014528161 A5 JP2014528161 A5 JP 2014528161A5 JP 2014527793 A JP2014527793 A JP 2014527793A JP 2014527793 A JP2014527793 A JP 2014527793A JP 2014528161 A5 JP2014528161 A5 JP 2014528161A5
- Authority
- JP
- Japan
- Prior art keywords
- subassembly
- predetermined pattern
- providing
- conductor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 14
- 239000004020 conductor Substances 0.000 claims 8
- 229910000679 solder Inorganic materials 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- 238000005520 cutting process Methods 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000009966 trimming Methods 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP11180233.6 | 2011-09-06 | ||
| EP11180233 | 2011-09-06 | ||
| US201261596758P | 2012-02-09 | 2012-02-09 | |
| US61/596,758 | 2012-02-09 | ||
| PCT/IB2012/054458 WO2013035021A1 (en) | 2011-09-06 | 2012-08-30 | Method for manufacturing a component interconnect board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014528161A JP2014528161A (ja) | 2014-10-23 |
| JP2014528161A5 true JP2014528161A5 (enExample) | 2015-10-15 |
| JP6125504B2 JP6125504B2 (ja) | 2017-05-10 |
Family
ID=47831594
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014527789A Expired - Fee Related JP6032768B2 (ja) | 2011-09-06 | 2012-08-29 | Ｌｅｄマトリクスの製造方法及びｌｅｄマトリクスを有する装置 |
| JP2014527793A Active JP6125504B2 (ja) | 2011-09-06 | 2012-08-30 | コンポーネント・インターコネクト・ボードの製造方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014527789A Expired - Fee Related JP6032768B2 (ja) | 2011-09-06 | 2012-08-29 | Ｌｅｄマトリクスの製造方法及びｌｅｄマトリクスを有する装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9232663B2 (enExample) |
| EP (2) | EP2742782B1 (enExample) |
| JP (2) | JP6032768B2 (enExample) |
| CN (2) | CN103766008B (enExample) |
| IN (2) | IN2014CN01637A (enExample) |
| RU (1) | RU2596800C2 (enExample) |
| WO (2) | WO2013035017A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9541269B2 (en) * | 2013-07-23 | 2017-01-10 | Philips Lighting Holding B.V. | Method for manufacturing a lighting arrangement |
| DE102014110068A1 (de) * | 2014-07-17 | 2016-01-21 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement |
| KR101672781B1 (ko) | 2014-11-18 | 2016-11-07 | 피에스아이 주식회사 | 수평배열 어셈블리용 초소형 led 소자, 이의 제조방법 및 이를 포함하는 수평배열 어셈블리 |
| KR101713818B1 (ko) | 2014-11-18 | 2017-03-10 | 피에스아이 주식회사 | 초소형 led 소자를 포함하는 전극어셈블리 및 그 제조방법 |
| DE102015109764A1 (de) * | 2015-06-18 | 2016-12-22 | Infineon Technologies Ag | Eine Laminarstruktur, ein Halbleiterbauelementund Verfahren zum Bilden von Halbleiterbauelementen |
| DE202015104272U1 (de) * | 2015-08-13 | 2016-11-15 | Zumtobel Lighting Gmbh | Leiterplatte mit mindestens zwei Bereichen zum Bestücken mit Bauteilen |
| KR101730977B1 (ko) | 2016-01-14 | 2017-04-28 | 피에스아이 주식회사 | 초소형 led 전극어셈블리 |
| US10201093B2 (en) | 2016-03-30 | 2019-02-05 | GE Lighting Solutions, LLC | Variable width printed circuit board using surface mount technology jumpers |
| FR3054640B1 (fr) | 2016-07-28 | 2020-06-12 | Linxens Holding | Dispositif emetteur de lumiere |
| WO2019029979A1 (en) | 2017-08-11 | 2019-02-14 | Philips Lighting Holding B.V. | METHOD FOR MANUFACTURING A 3D ARTICLE HAVING AN ELECTROCONDUCTIVE COIL |
| CN116970893B (zh) * | 2023-04-25 | 2024-04-30 | 先之科半导体科技(东莞)有限公司 | 一种改良型拉直组件 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4746618A (en) | 1987-08-31 | 1988-05-24 | Energy Conversion Devices, Inc. | Method of continuously forming an array of photovoltaic cells electrically connected in series |
| JP2785646B2 (ja) * | 1993-05-20 | 1998-08-13 | トヨタ車体株式会社 | フレキシブル配線の製造方法 |
| US5385848A (en) | 1993-09-20 | 1995-01-31 | Iowa Thin Film Technologies, Inc | Method for fabricating an interconnected array of semiconductor devices |
| US5470644A (en) * | 1994-04-21 | 1995-11-28 | Durant; David | Apparatus and method for fabrication of printed circuit boards |
| JPH0936183A (ja) * | 1995-07-17 | 1997-02-07 | Hitachi Cable Ltd | ソルダレジスト及びｔａｂ用テープキャリア |
| US7507903B2 (en) | 1999-03-30 | 2009-03-24 | Daniel Luch | Substrate and collector grid structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays |
| JP2003142812A (ja) * | 2001-11-07 | 2003-05-16 | Alps Electric Co Ltd | チップ部品の実装方法 |
| TW533750B (en) | 2001-11-11 | 2003-05-21 | Solidlite Corp | LED lamp |
| TW558622B (en) * | 2002-01-24 | 2003-10-21 | Yuan Lin | Lamp on sheet and manufacturing method thereof |
| JP4203374B2 (ja) * | 2003-08-06 | 2008-12-24 | 豊田合成株式会社 | 発光装置 |
| JP2005063995A (ja) * | 2003-08-08 | 2005-03-10 | John Popovich | 発光ダイオードストリップランプ |
| US20050036311A1 (en) * | 2003-08-14 | 2005-02-17 | Li-Wen Liu | LED light string manufacturing method |
| US7427782B2 (en) | 2004-03-29 | 2008-09-23 | Articulated Technologies, Llc | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
| US7301174B1 (en) * | 2004-08-12 | 2007-11-27 | Popovich John M | Light emitting diode strip lamp |
| US7028909B2 (en) * | 2004-08-13 | 2006-04-18 | Ge Identicard Systems, Inc. | Laminate tabbed pouch identification card with an integrated circuit |
| US7416906B2 (en) * | 2005-05-18 | 2008-08-26 | Asahi Rubber Inc. | Soldering method for semiconductor optical device, and semiconductor optical device |
| DE102006033894B4 (de) * | 2005-12-16 | 2019-05-09 | Osram Gmbh | Beleuchtungseinrichtung und Anzeigegerät mit einer Beleuchtungseinrichtung |
| KR101412473B1 (ko) * | 2006-04-25 | 2014-06-30 | 코닌클리케 필립스 엔.브이. | Ｌｅｄ 어레이 그리드, ｌｅｄ 어레이 그리드의 제조를 위한 방법 및 장치 및 ｌｅｄ 어레이 그리드에서 사용하기 위한 ｌｅｄ 구성부품 |
| US7918702B2 (en) * | 2006-04-25 | 2011-04-05 | Koninklijke Philips Electronics N.V. | Large area LED array and method for its manufacture |
| ITRM20060237A1 (it) | 2006-05-03 | 2007-11-04 | Anabasis S R L | Uso dei probiotici nella prevenzione e nel trattamento delle congiuntiviti allergiche |
| DE102006033873A1 (de) * | 2006-07-21 | 2008-01-24 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Strahlungsemittierende Einrichtung mit mehreren strahlungs-emittierenden Bauelementen und Beleuchtungseinrichtung |
| WO2008143138A1 (ja) * | 2007-05-18 | 2008-11-27 | Toppan Printing Co., Ltd. | 配線基板、半導体パッケージ及び電子機器 |
| US20080295327A1 (en) * | 2007-06-01 | 2008-12-04 | 3M Innovative Properties Company | Flexible circuit |
| US8069559B2 (en) * | 2007-08-24 | 2011-12-06 | World Properties, Inc. | Method of assembling an insulated metal substrate |
| US8067777B2 (en) | 2008-05-12 | 2011-11-29 | Occam Portfolio Llc | Light emitting diode package assembly |
| TWI489599B (zh) * | 2008-06-02 | 2015-06-21 | 相豐科技股份有限公司 | 積體電路模組及其製造方法 |
| JP2009302239A (ja) * | 2008-06-12 | 2009-12-24 | Alps Electric Co Ltd | 光源モジュール |
| DE102008054288A1 (de) * | 2008-11-03 | 2010-05-06 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen eines flexiblen Leuchtbands |
| EP2339223B1 (en) * | 2009-12-23 | 2014-05-14 | Novabase Digital TV Technologies GmbH | LED Bulb |
| DE102010000758A1 (de) * | 2010-01-11 | 2011-07-14 | Robert Bosch GmbH, 70469 | Verfahren zur Herstellung eines LED-Moduls sowie LED-Modul |
| RU2416125C1 (ru) * | 2010-03-16 | 2011-04-10 | Общество С Ограниченной Ответственностью "Новые Энергетические Технологии" | Световая панель с торцевым вводом излучения и способ ее изготовления |
-
2012
- 2012-08-29 RU RU2014113355/07A patent/RU2596800C2/ru active
- 2012-08-29 WO PCT/IB2012/054436 patent/WO2013035017A1/en not_active Ceased
- 2012-08-29 US US14/241,187 patent/US9232663B2/en not_active Expired - Fee Related
- 2012-08-29 IN IN1637CHN2014 patent/IN2014CN01637A/en unknown
- 2012-08-29 CN CN201280043324.2A patent/CN103766008B/zh not_active Expired - Fee Related
- 2012-08-29 EP EP12778797.6A patent/EP2742782B1/en not_active Not-in-force
- 2012-08-29 JP JP2014527789A patent/JP6032768B2/ja not_active Expired - Fee Related
- 2012-08-30 IN IN1630CHN2014 patent/IN2014CN01630A/en unknown
- 2012-08-30 CN CN201280043238.1A patent/CN103782668B/zh not_active Expired - Fee Related
- 2012-08-30 JP JP2014527793A patent/JP6125504B2/ja active Active
- 2012-08-30 EP EP12778423.9A patent/EP2742784B1/en not_active Not-in-force
- 2012-08-30 WO PCT/IB2012/054458 patent/WO2013035021A1/en not_active Ceased
- 2012-08-30 US US14/239,549 patent/US9839141B2/en not_active Expired - Fee Related
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