JP2016029748A5 - - Google Patents

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Publication number
JP2016029748A5
JP2016029748A5 JP2015235803A JP2015235803A JP2016029748A5 JP 2016029748 A5 JP2016029748 A5 JP 2016029748A5 JP 2015235803 A JP2015235803 A JP 2015235803A JP 2015235803 A JP2015235803 A JP 2015235803A JP 2016029748 A5 JP2016029748 A5 JP 2016029748A5
Authority
JP
Japan
Prior art keywords
shield
insulating layer
shield film
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015235803A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016029748A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2015235803A priority Critical patent/JP2016029748A/ja
Priority claimed from JP2015235803A external-priority patent/JP2016029748A/ja
Publication of JP2016029748A publication Critical patent/JP2016029748A/ja
Publication of JP2016029748A5 publication Critical patent/JP2016029748A5/ja
Pending legal-status Critical Current

Links

JP2015235803A 2015-12-02 2015-12-02 シールドプリント配線板の製造方法 Pending JP2016029748A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015235803A JP2016029748A (ja) 2015-12-02 2015-12-02 シールドプリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015235803A JP2016029748A (ja) 2015-12-02 2015-12-02 シールドプリント配線板の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2012278551A Division JP2014123630A (ja) 2012-12-20 2012-12-20 シールドプリント配線板の製造方法、シールドフィルム、及び、シールドプリント配線板

Publications (2)

Publication Number Publication Date
JP2016029748A JP2016029748A (ja) 2016-03-03
JP2016029748A5 true JP2016029748A5 (enExample) 2016-11-10

Family

ID=55435491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015235803A Pending JP2016029748A (ja) 2015-12-02 2015-12-02 シールドプリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JP2016029748A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7228330B2 (ja) * 2017-02-10 2023-02-24 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
WO2018147429A1 (ja) * 2017-02-13 2018-08-16 タツタ電線株式会社 グランド部材、シールドプリント配線板及びシールドプリント配線板の製造方法
WO2018147423A1 (ja) * 2017-02-13 2018-08-16 タツタ電線株式会社 グランド部材、シールドプリント配線板及びシールドプリント配線板の製造方法
WO2018147426A1 (ja) * 2017-02-13 2018-08-16 タツタ電線株式会社 シールドフィルム、シールドプリント配線板及びシールドプリント配線板の製造方法
CN115243477B (zh) * 2022-07-27 2024-07-26 北京八度阳光科技有限公司 一种基于分层叠加生产电子线路板的方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3498386B2 (ja) * 1994-10-19 2004-02-16 住友電気工業株式会社 シールド付きフレキシブル配線板及びその製造方法
JP2005056906A (ja) * 2003-08-05 2005-03-03 Reiko Co Ltd 電磁波遮蔽性転写フイルム
JP4914262B2 (ja) * 2006-03-29 2012-04-11 タツタ電線株式会社 シールドフィルム及びシールドプリント配線板
JP2011171523A (ja) * 2010-02-19 2011-09-01 Toyo Ink Sc Holdings Co Ltd 硬化性電磁波シールド性接着性フィルムおよびその製造方法

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