JP2019057375A5 - - Google Patents

Download PDF

Info

Publication number
JP2019057375A5
JP2019057375A5 JP2017180030A JP2017180030A JP2019057375A5 JP 2019057375 A5 JP2019057375 A5 JP 2019057375A5 JP 2017180030 A JP2017180030 A JP 2017180030A JP 2017180030 A JP2017180030 A JP 2017180030A JP 2019057375 A5 JP2019057375 A5 JP 2019057375A5
Authority
JP
Japan
Prior art keywords
magnetic field
processing apparatus
power supply
plasma processing
field forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017180030A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019057375A (ja
JP6764383B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2017180030A priority Critical patent/JP6764383B2/ja
Priority claimed from JP2017180030A external-priority patent/JP6764383B2/ja
Priority to KR1020180004213A priority patent/KR102048304B1/ko
Priority to TW107101773A priority patent/TWI673759B/zh
Priority to US15/902,799 priority patent/US12347656B2/en
Publication of JP2019057375A publication Critical patent/JP2019057375A/ja
Publication of JP2019057375A5 publication Critical patent/JP2019057375A5/ja
Application granted granted Critical
Publication of JP6764383B2 publication Critical patent/JP6764383B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017180030A 2017-09-20 2017-09-20 プラズマ処理装置 Active JP6764383B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017180030A JP6764383B2 (ja) 2017-09-20 2017-09-20 プラズマ処理装置
KR1020180004213A KR102048304B1 (ko) 2017-09-20 2018-01-12 플라즈마 처리 장치
TW107101773A TWI673759B (zh) 2017-09-20 2018-01-18 電漿處理裝置
US15/902,799 US12347656B2 (en) 2017-09-20 2018-02-22 Plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017180030A JP6764383B2 (ja) 2017-09-20 2017-09-20 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2019057375A JP2019057375A (ja) 2019-04-11
JP2019057375A5 true JP2019057375A5 (enExample) 2019-07-11
JP6764383B2 JP6764383B2 (ja) 2020-09-30

Family

ID=65720687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017180030A Active JP6764383B2 (ja) 2017-09-20 2017-09-20 プラズマ処理装置

Country Status (4)

Country Link
US (1) US12347656B2 (enExample)
JP (1) JP6764383B2 (enExample)
KR (1) KR102048304B1 (enExample)
TW (1) TWI673759B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113348732B (zh) * 2019-12-18 2024-02-09 株式会社日立高新技术 等离子处理装置
CN113130287B (zh) * 2020-01-10 2025-02-18 汉民科技股份有限公司 线圈电流分配式的蚀刻机结构
US11328931B1 (en) * 2021-02-12 2022-05-10 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing a semiconductor device
JP2024147876A (ja) * 2023-04-04 2024-10-17 東京エレクトロン株式会社 プラズマ処理装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3200308A (en) * 1962-07-02 1965-08-10 Bell Telephone Labor Inc Current pulse generator exhibiting fast rise time
DE1487024B2 (de) * 1966-05-25 1970-09-10 Siemens AQ, 1000 Berlin u. 8000 München Schaltungsanordnung zum Erzeugen von Stromimpulsen großer Flankensteilheit
DE2311340C2 (de) * 1973-03-07 1974-04-04 Claude 8000 Muenchen Frantz Schaltung zur Verkürzung der Einschaltzeit von induktiven Verbrauchern
US4144751A (en) * 1977-09-06 1979-03-20 Honeywell Inc. Square wave signal generator
JPS6050923A (ja) 1983-08-31 1985-03-22 Hitachi Ltd プラズマ表面処理方法
JPH04154971A (ja) * 1990-10-16 1992-05-27 Ricoh Co Ltd Ecrプラズマ装置
JPH05136089A (ja) * 1991-03-12 1993-06-01 Hitachi Ltd マイクロ波プラズマエツチング装置及びエツチング方法
JP3236370B2 (ja) * 1992-10-29 2001-12-10 アネルバ株式会社 マイクロ波放電処理装置
JP3235299B2 (ja) * 1993-11-08 2001-12-04 株式会社日立製作所 マイクロ波プラズマ処理方法
JP2820070B2 (ja) * 1995-08-11 1998-11-05 日本電気株式会社 プラズマ化学気相成長法とその装置
JPH10199863A (ja) * 1997-01-14 1998-07-31 Sumitomo Metal Ind Ltd プラズマ処理方法、プラズマ処理装置及び半導体装置の製造方法
JP2000021871A (ja) * 1998-06-30 2000-01-21 Tokyo Electron Ltd プラズマ処理方法
JP2001110784A (ja) * 1999-10-12 2001-04-20 Hitachi Ltd プラズマ処理装置および処理方法
US7334918B2 (en) * 2003-05-07 2008-02-26 Bayco Products, Ltd. LED lighting array for a portable task light
JP2011242324A (ja) * 2010-05-20 2011-12-01 Seiko Epson Corp セルユニット及び磁場測定装置
JP6334369B2 (ja) * 2014-11-11 2018-05-30 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
JP2017091934A (ja) * 2015-11-16 2017-05-25 株式会社日立ハイテクノロジーズ プラズマ処理装置
CN110494589A (zh) * 2017-04-04 2019-11-22 堺显示器制品株式会社 蒸镀装置、蒸镀方法及有机el显示装置的制造方法
JP2025050923A (ja) 2023-09-25 2025-04-04 ソフトバンクグループ株式会社 システム

Similar Documents

Publication Publication Date Title
JP2019057375A5 (enExample)
JP2016032096A5 (enExample)
JP2020507678A5 (enExample)
MY207250A (en) A resonant circuit for an aerosol generating system
EP4609739A3 (en) Apparatus for aerosol generating device
JP2016092342A5 (enExample)
JP2017025407A5 (enExample)
MX2021014957A (es) Sistemas y metodos para obtener estabilidad de la posicion del plasma de frc.
EP4376061A3 (en) Spatial and temporal control of ion bias voltage for plasma processing
JP2014179576A5 (ja) プラズマ処理装置の制御方法、プラズマ処理方法及びプラズマ処理装置
JP2014060378A5 (ja) シリコン窒化膜の成膜方法、及びシリコン窒化膜の成膜装置
WO2008106448A3 (en) Ion sources and methods of operating an electromagnet of an ion source
CN102712057B (zh) 用于等离子切割和标记的气体流量的脉宽调制控制
WO2014146185A3 (en) Bucking circuit for annulling a magnetic field
JP6278414B2 (ja) 磁化同軸プラズマ生成装置
JP2016213358A5 (enExample)
JP2014135305A5 (enExample)
JP2019057547A5 (enExample)
SG10201803487XA (en) Substrate processing apparatus and method of controlling the same
JP6290063B2 (ja) 過熱水蒸気生成装置
SA518400399B1 (ar) تحكم بمدى منفصل باستخدام تحكم تكاملي تناسبي بصمامات التدفق
MY204611A (en) Method and apparatus for inflow control with vortex generation
WO2019117329A8 (en) Power factor adjustment method and apparatus through the phase control in a transformer circuit
JP2016519832A5 (enExample)
WO2009120000A3 (en) Substrate processing apparatus and method