JP2018531403A - アレイ基板、その製造方法、対応する表示パネル及び電子装置 - Google Patents
アレイ基板、その製造方法、対応する表示パネル及び電子装置 Download PDFInfo
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- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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Abstract
Description
107 パッシベーション層
108 データ線
108’ ソースドレイン金属層薄膜
109 画素電極
110 薄膜トランジスター
112 ゲート
114 ゲート絶縁層
116 能動層
118 ソース電極
119 ドレイン電極
126 能動層
200 アレイ基板
201 ベース基板
202 ゲート線
202a 先端構造
204 絶縁層
206 能動層
206’ 能動層薄膜
208 データ線
208’ ソースドレイン金属層薄膜
209 画素電極
210 薄膜トランジスター
212 ゲート
216 第1能動層
216a 先端構造
218 ソース電極
219 ドレイン電極
226 第二能動層
300 対向基板
350 シーラント剤
400 液晶材
408 データ線層
1091 透過孔
2021 縁部
2022 縁部
Claims (20)
- ベース基板、ゲート線、絶縁層、データ線及び第1能動層を備え、前記ゲート線、前記絶縁層、前記データ線及び前記第1能動層が前記ベース基板に設けられるアレイ基板であって、
前記絶縁層は前記ゲート線に設けられ、前記データ線は前記絶縁層を介して前記ゲート線と交差するように前記ゲート線に設けられ、前記第1能動層は前記絶縁層を介して前記ゲート線と重なり合うように前記ゲート線に設けられ、前記第1能動層は前記ゲート線と前記データ線とが互いに重なり合う領域以外の領域に設けられる、
アレイ基板。 - 前記第1能動層は不規則な形状を有する、
請求項1に記載のアレイ基板。 - 前記第1能動層は先端構造を有する、
請求項1又は2に記載のアレイ基板。 - 前記ゲート線と前記第1能動層とが重なり合う部分の縁部は先端構造を有する、
請求項1〜3のいずれかに記載のアレイ基板。 - データ線層を更に備え、
前記データ線層は前記第1能動層と交差するように前記第1能動層に設けられる、
請求項1〜4のいずれかに記載のアレイ基板。 - 前記データ線層と前記データ線とは電気的に絶縁される、
請求項1〜5のいずれかに記載のアレイ基板。 - 前記データ線層は鋸歯状の縁部を有する、
請求項1〜6のいずれかに記載のアレイ基板。 - 第二能動層をさらに備え、
前記第二能動層が前記絶縁層と前記データ線との間に設けられ、前記ゲート線と前記データ線とが重なり合う領域に位置する、
請求項1〜7のいずれかに記載のアレイ基板。 - 少なくとももう一つの第1能動層を更に備える、
請求項1〜8のいずれかに記載のアレイ基板。 - ベース基板、ゲート線、絶縁層、データ線及び第1能動層を備え、前記ゲート線、前記絶縁層、前記データ線及び前記第1能動層が前記ベース基板に設けられるアレイ基板の製造方法であって、
前記ゲート線を前記ベース基板に形成し、
前記絶縁層を前記ゲート線に形成し、
前記データ線を前記絶縁層を介して前記ゲート線と交差するように前記ゲート線に設置し、
前記第1能動層を前記絶縁層を介して前記ゲート線と重なり合うように前記ゲート線に設置し、前記第1能動層を前記ゲート線と前記データ線とが互いに重なり合う領域以外の領域に設置する、
アレイ基板の製造方法。 - 前記第1能動層は不規則な形状を有するように形成される、
請求項10に記載のアレイ基板の製造方法。 - 前記第1能動層は先端構造を有するように形成される、
請求項10〜11のいずれかに記載のアレイ基板の製造方法。 - 前記ゲート線と前記第1能動層とが重なり合う部分の縁部は先端構造を有するように形成される
請求項10〜12のいずれかに記載のアレイ基板の製造方法。 - データ線層をさらに形成し、
前記データ線層は前記第1能動層と重なり合うように前記第1能動層に設けられる、
請求項10〜13のいずれかに記載のアレイ基板の製造方法。 - 前記データ線層は前記データ線と電気的に絶縁するように形成される、
請求項10〜14のいずれかに記載のアレイ基板の製造方法。 - 前記データ線層は鋸歯状の縁部を有するように形成される、
請求項10〜15のいずれかに記載のアレイ基板の製造方法。 - 第二能動層を形成することをさらに含み、
前記第二能動層は前記絶縁層と前記データ線との間に形成され、前記ゲート線と前記データ線とが重なり合う領域に位置する、
請求項10〜16のいずれかに記載のアレイ基板の製造方法。 - すくなくとももう一つの第1能動層を形成することをさらに含み、
請求項10〜17のいずれかに記載のアレイ基板の製造方法。 - 請求項1〜9のいずれかに記載のアレイ基板を含む表示パネル。
- 請求項19に記載の表示パネルを含む電子装置。
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CN201510627008.5A CN105093762B (zh) | 2015-09-28 | 2015-09-28 | 阵列基板、制造方法以及相应的显示面板和电子装置 |
PCT/CN2016/072168 WO2017054381A1 (zh) | 2015-09-28 | 2016-01-26 | 阵列基板、制造方法以及相应的显示面板和电子装置 |
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CN110854135B (zh) * | 2019-10-29 | 2023-09-26 | 武汉华星光电技术有限公司 | 一种阵列基板、显示面板及阵列基板的制造方法 |
CN112034656B (zh) * | 2020-09-11 | 2022-08-26 | 合肥鑫晟光电科技有限公司 | 阵列基板和显示装置 |
CN113611699A (zh) * | 2021-07-20 | 2021-11-05 | 深圳市华星光电半导体显示技术有限公司 | 显示面板 |
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US10598995B2 (en) | 2020-03-24 |
US20170269444A1 (en) | 2017-09-21 |
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KR102011315B1 (ko) | 2019-08-16 |
CN105093762B (zh) | 2019-01-11 |
WO2017054381A1 (zh) | 2017-04-06 |
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