JP2018523305A5 - - Google Patents

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Publication number
JP2018523305A5
JP2018523305A5 JP2017567324A JP2017567324A JP2018523305A5 JP 2018523305 A5 JP2018523305 A5 JP 2018523305A5 JP 2017567324 A JP2017567324 A JP 2017567324A JP 2017567324 A JP2017567324 A JP 2017567324A JP 2018523305 A5 JP2018523305 A5 JP 2018523305A5
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JP
Japan
Prior art keywords
leds
led substrate
recess
heater according
pattern
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JP2017567324A
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English (en)
Japanese (ja)
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JP6886928B2 (ja
JP2018523305A (ja
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Priority claimed from US14/753,991 external-priority patent/US20160379854A1/en
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Publication of JP2018523305A5 publication Critical patent/JP2018523305A5/ja
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Publication of JP6886928B2 publication Critical patent/JP6886928B2/ja
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JP2017567324A 2015-06-29 2016-06-24 真空対応式ｌｅｄ基板ヒータ Active JP6886928B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/753,991 2015-06-29
US14/753,991 US20160379854A1 (en) 2015-06-29 2015-06-29 Vacuum Compatible LED Substrate Heater
PCT/US2016/039262 WO2017003866A1 (en) 2015-06-29 2016-06-24 Vacuum compatible led substrate heater

Publications (3)

Publication Number Publication Date
JP2018523305A JP2018523305A (ja) 2018-08-16
JP2018523305A5 true JP2018523305A5 (cg-RX-API-DMAC7.html) 2019-07-25
JP6886928B2 JP6886928B2 (ja) 2021-06-16

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Family Applications (1)

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JP2017567324A Active JP6886928B2 (ja) 2015-06-29 2016-06-24 真空対応式ｌｅｄ基板ヒータ

Country Status (6)

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US (1) US20160379854A1 (cg-RX-API-DMAC7.html)
JP (1) JP6886928B2 (cg-RX-API-DMAC7.html)
KR (1) KR102553101B1 (cg-RX-API-DMAC7.html)
CN (1) CN107710395A (cg-RX-API-DMAC7.html)
TW (1) TW201701428A (cg-RX-API-DMAC7.html)
WO (1) WO2017003866A1 (cg-RX-API-DMAC7.html)

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CN111373519B (zh) 2017-11-16 2021-11-23 应用材料公司 高压蒸气退火处理设备
WO2019099255A2 (en) 2017-11-17 2019-05-23 Applied Materials, Inc. Condenser system for high pressure processing system
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US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
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