TW201701428A - 真空相容的發光二極體基板加熱器 - Google Patents

真空相容的發光二極體基板加熱器 Download PDF

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Publication number
TW201701428A
TW201701428A TW105117295A TW105117295A TW201701428A TW 201701428 A TW201701428 A TW 201701428A TW 105117295 A TW105117295 A TW 105117295A TW 105117295 A TW105117295 A TW 105117295A TW 201701428 A TW201701428 A TW 201701428A
Authority
TW
Taiwan
Prior art keywords
light emitting
recess
emitting diodes
disposed
light
Prior art date
Application number
TW105117295A
Other languages
English (en)
Chinese (zh)
Inventor
羅伯特 布然特 寶佩特
蓋瑞 Ｅ‧ 維卡
大衛 伯拉尼克
傑森 Ｍ‧ 夏勒
威廉 Ｔ‧ 維弗
Original Assignee
瓦里安半導體設備公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瓦里安半導體設備公司 filed Critical 瓦里安半導體設備公司
Publication of TW201701428A publication Critical patent/TW201701428A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Control Of Resistance Heating (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
TW105117295A 2015-06-29 2016-06-02 真空相容的發光二極體基板加熱器 TW201701428A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/753,991 US20160379854A1 (en) 2015-06-29 2015-06-29 Vacuum Compatible LED Substrate Heater

Publications (1)

Publication Number Publication Date
TW201701428A true TW201701428A (zh) 2017-01-01

Family

ID=57602729

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105117295A TW201701428A (zh) 2015-06-29 2016-06-02 真空相容的發光二極體基板加熱器

Country Status (6)

Country Link
US (1) US20160379854A1 (cg-RX-API-DMAC7.html)
JP (1) JP6886928B2 (cg-RX-API-DMAC7.html)
KR (1) KR102553101B1 (cg-RX-API-DMAC7.html)
CN (1) CN107710395A (cg-RX-API-DMAC7.html)
TW (1) TW201701428A (cg-RX-API-DMAC7.html)
WO (1) WO2017003866A1 (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI868169B (zh) * 2019-06-24 2025-01-01 美商蘭姆研究公司 基板表面的蒸氣清潔
TWI918268B (zh) 2019-06-24 2026-03-11 美商蘭姆研究公司 基板表面的蒸氣清潔

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
JP6947914B2 (ja) 2017-08-18 2021-10-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧高温下のアニールチャンバ
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
CN111095524B (zh) 2017-09-12 2023-10-03 应用材料公司 用于使用保护阻挡物层制造半导体结构的设备和方法
KR102585074B1 (ko) 2017-11-11 2023-10-04 마이크로머티어리얼즈 엘엘씨 고압 프로세싱 챔버를 위한 가스 전달 시스템
SG11202003438QA (en) 2017-11-16 2020-05-28 Applied Materials Inc High pressure steam anneal processing apparatus
JP2021503714A (ja) 2017-11-17 2021-02-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧処理システムのためのコンデンサシステム
FR3076431A1 (fr) * 2017-12-28 2019-07-05 Aeroform France Dispositif de chauffage sans contact
CN111902929B (zh) 2018-03-09 2025-09-19 应用材料公司 用于含金属材料的高压退火处理
KR102078157B1 (ko) * 2018-04-16 2020-02-17 세메스 주식회사 기판 가열 유닛 및 이를 갖는 기판 처리 장치
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
KR101961864B1 (ko) 2018-08-17 2019-03-26 남윤종 폐엘이디 칩 분리 장치
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
JP7077989B2 (ja) 2019-02-20 2022-05-31 株式会社デンソー 車両用空調ユニット
JP7198434B2 (ja) * 2019-03-27 2023-01-04 ウシオ電機株式会社 加熱処理方法及び光加熱装置
KR102747715B1 (ko) * 2019-10-15 2024-12-31 주식회사 케이씨텍 복사 열원을 이용한 기판 처리 장치
JP7398935B2 (ja) 2019-11-25 2023-12-15 東京エレクトロン株式会社 載置台、及び、検査装置
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
WO2021202171A1 (en) * 2020-04-01 2021-10-07 Lam Research Corporation Rapid and precise temperature control for thermal etching
JP7677797B2 (ja) * 2021-01-07 2025-05-15 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
KR20230132361A (ko) 2021-01-25 2023-09-15 램 리써치 코포레이션 열적 에칭에 의한 선택적인 실리콘 트리밍

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5937142A (en) * 1996-07-11 1999-08-10 Cvc Products, Inc. Multi-zone illuminator for rapid thermal processing
US6067931A (en) * 1996-11-04 2000-05-30 General Electric Company Thermal processor for semiconductor wafers
US6818864B2 (en) * 2002-08-09 2004-11-16 Asm America, Inc. LED heat lamp arrays for CVD heating
JP3776092B2 (ja) * 2003-03-25 2006-05-17 株式会社ルネサステクノロジ エッチング装置、エッチング方法および半導体装置の製造方法
US20070013057A1 (en) * 2003-05-05 2007-01-18 Joseph Mazzochette Multicolor LED assembly with improved color mixing
JP4442171B2 (ja) * 2003-09-24 2010-03-31 東京エレクトロン株式会社 熱処理装置
US8071882B2 (en) * 2005-04-19 2011-12-06 Denki Kagaku Kogyo Kabushiki Kaisha Metal base circuit board, LED, and LED light source unit
JP5055756B2 (ja) * 2005-09-21 2012-10-24 東京エレクトロン株式会社 熱処理装置及び記憶媒体
CN101846247B (zh) * 2005-12-22 2013-04-17 松下电器产业株式会社 具有led的照明器具
KR100855065B1 (ko) * 2007-04-24 2008-08-29 삼성전기주식회사 발광 다이오드 패키지
TWI429731B (zh) * 2007-07-16 2014-03-11 路明納森公司 由４價錳離子活化之發紅光錯合氟化磷光體
JP5084420B2 (ja) * 2007-09-21 2012-11-28 東京エレクトロン株式会社 ロードロック装置および真空処理システム
JP2009099925A (ja) * 2007-09-27 2009-05-07 Tokyo Electron Ltd アニール装置
JP2010129861A (ja) * 2008-11-28 2010-06-10 Tokyo Electron Ltd 熱処理装置
KR20110039080A (ko) * 2009-10-09 2011-04-15 알티반도체 주식회사 백라이트 유닛 및 그 제조 방법
US20110217848A1 (en) * 2010-03-03 2011-09-08 Bergman Eric J Photoresist removing processor and methods
JP5526876B2 (ja) * 2010-03-09 2014-06-18 東京エレクトロン株式会社 加熱装置及びアニール装置
CN102214766A (zh) * 2010-04-02 2011-10-12 游森溢 发光二极管封装结构
JP2012023330A (ja) * 2010-06-14 2012-02-02 Tokyo Electron Ltd 加熱源装置及びアニール装置
US10211380B2 (en) * 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US9842753B2 (en) * 2013-04-26 2017-12-12 Applied Materials, Inc. Absorbing lamphead face
US20150085466A1 (en) * 2013-09-24 2015-03-26 Intematix Corporation Low profile led-based lighting arrangements
JP6469680B2 (ja) * 2013-11-22 2019-02-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ アクセスが容易なランプヘッド
KR101458963B1 (ko) * 2014-02-18 2014-11-12 민정은 급속 열처리장치용 히터장치
US9728430B2 (en) * 2015-06-29 2017-08-08 Varian Semiconductor Equipment Associates, Inc. Electrostatic chuck with LED heating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI868169B (zh) * 2019-06-24 2025-01-01 美商蘭姆研究公司 基板表面的蒸氣清潔
US12467147B2 (en) 2019-06-24 2025-11-11 Lam Research Corporation Vapor cleaning of substrate surfaces
TWI918268B (zh) 2019-06-24 2026-03-11 美商蘭姆研究公司 基板表面的蒸氣清潔

Also Published As

Publication number Publication date
US20160379854A1 (en) 2016-12-29
KR102553101B1 (ko) 2023-07-07
CN107710395A (zh) 2018-02-16
JP2018523305A (ja) 2018-08-16
KR20180014436A (ko) 2018-02-08
WO2017003866A1 (en) 2017-01-05
JP6886928B2 (ja) 2021-06-16

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