JP2018510449A - 親水性ナノ粒子を含む放射線硬化性組成物 - Google Patents
親水性ナノ粒子を含む放射線硬化性組成物 Download PDFInfo
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- JP2018510449A JP2018510449A JP2017531574A JP2017531574A JP2018510449A JP 2018510449 A JP2018510449 A JP 2018510449A JP 2017531574 A JP2017531574 A JP 2017531574A JP 2017531574 A JP2017531574 A JP 2017531574A JP 2018510449 A JP2018510449 A JP 2018510449A
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- 239000000203 mixture Substances 0.000 title claims abstract description 154
- 230000005855 radiation Effects 0.000 title claims abstract description 50
- 239000002105 nanoparticle Substances 0.000 title claims abstract description 44
- 230000004888 barrier function Effects 0.000 claims abstract description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 128
- 239000012044 organic layer Substances 0.000 claims description 43
- 239000002245 particle Substances 0.000 claims description 37
- 239000010410 layer Substances 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 29
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims description 12
- 230000009977 dual effect Effects 0.000 claims description 10
- 239000000395 magnesium oxide Substances 0.000 claims description 9
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 9
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 9
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000005062 Polybutadiene Substances 0.000 claims description 6
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000292 calcium oxide Substances 0.000 claims description 6
- KBPLFHHGFOOTCA-UHFFFAOYSA-N caprylic alcohol Natural products CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 claims description 6
- 239000003085 diluting agent Substances 0.000 claims description 6
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 6
- 229920002857 polybutadiene Polymers 0.000 claims description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 5
- 238000009835 boiling Methods 0.000 claims description 5
- 239000003999 initiator Substances 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 229910021536 Zeolite Inorganic materials 0.000 claims description 4
- 230000001747 exhibiting effect Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 239000010457 zeolite Substances 0.000 claims description 4
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 3
- 230000005693 optoelectronics Effects 0.000 claims description 3
- 239000011342 resin composition Substances 0.000 claims description 3
- 230000005669 field effect Effects 0.000 claims description 2
- 235000013305 food Nutrition 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 claims description 2
- 238000005192 partition Methods 0.000 claims description 2
- 230000000379 polymerizing effect Effects 0.000 claims 1
- -1 metalloid nitride Chemical class 0.000 description 66
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 14
- 238000002360 preparation method Methods 0.000 description 13
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 12
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 12
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 12
- 229910052752 metalloid Inorganic materials 0.000 description 12
- 239000000600 sorbitol Substances 0.000 description 12
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 9
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000006185 dispersion Substances 0.000 description 8
- 150000002738 metalloids Chemical class 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 150000003254 radicals Chemical group 0.000 description 8
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 7
- 229910044991 metal oxide Inorganic materials 0.000 description 7
- 150000004706 metal oxides Chemical class 0.000 description 7
- 239000007983 Tris buffer Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- HYQASEVIBPSPMK-UHFFFAOYSA-N 12-(2-methylprop-2-enoyloxy)dodecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCCCOC(=O)C(C)=C HYQASEVIBPSPMK-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 206010027146 Melanoderma Diseases 0.000 description 4
- 206010064127 Solar lentigo Diseases 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 239000002270 dispersing agent Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920005862 polyol Polymers 0.000 description 4
- 150000003077 polyols Chemical class 0.000 description 4
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 3
- OADIZUFHUPTFAG-UHFFFAOYSA-N 2-[2-(2-ethylhexoxy)ethoxy]ethanol Chemical compound CCCCC(CC)COCCOCCO OADIZUFHUPTFAG-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000000149 argon plasma sintering Methods 0.000 description 3
- 125000000732 arylene group Chemical group 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- XTJDUBPOTVNQPI-UHFFFAOYSA-N (2-nonylphenyl) 2-methylprop-2-enoate Chemical class CCCCCCCCCC1=CC=CC=C1OC(=O)C(C)=C XTJDUBPOTVNQPI-UHFFFAOYSA-N 0.000 description 2
- PJAKWOZHTFWTNF-UHFFFAOYSA-N (2-nonylphenyl) prop-2-enoate Chemical class CCCCCCCCCC1=CC=CC=C1OC(=O)C=C PJAKWOZHTFWTNF-UHFFFAOYSA-N 0.000 description 2
- VRIINBPYPJEAHP-UHFFFAOYSA-N 1-(2-methylprop-2-enoyloxy)cyclohexane-1,2-dicarboxylic acid Chemical compound CC(=C)C(=O)OC1(C(O)=O)CCCCC1C(O)=O VRIINBPYPJEAHP-UHFFFAOYSA-N 0.000 description 2
- KFQPRNVTVMCYEH-UHFFFAOYSA-N 1-amino-3-(4-methoxyphenoxy)propan-2-ol Chemical compound COC1=CC=C(OCC(O)CN)C=C1 KFQPRNVTVMCYEH-UHFFFAOYSA-N 0.000 description 2
- LRZPQLZONWIQOJ-UHFFFAOYSA-N 10-(2-methylprop-2-enoyloxy)decyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCOC(=O)C(C)=C LRZPQLZONWIQOJ-UHFFFAOYSA-N 0.000 description 2
- RHNJVKIVSXGYBD-UHFFFAOYSA-N 10-prop-2-enoyloxydecyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCCOC(=O)C=C RHNJVKIVSXGYBD-UHFFFAOYSA-N 0.000 description 2
- WBELHNUIWMNAFH-UHFFFAOYSA-N 12-prop-2-enoyloxydodecyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCCCCOC(=O)C=C WBELHNUIWMNAFH-UHFFFAOYSA-N 0.000 description 2
- PYLRGSOFJMYQNO-UHFFFAOYSA-N 14-(2-methylprop-2-enoyloxy)tetradecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCCCCCOC(=O)C(C)=C PYLRGSOFJMYQNO-UHFFFAOYSA-N 0.000 description 2
- HSTNFGPCVDQWMQ-UHFFFAOYSA-N 14-prop-2-enoyloxytetradecyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCCCCCCOC(=O)C=C HSTNFGPCVDQWMQ-UHFFFAOYSA-N 0.000 description 2
- QTKPMCIBUROOGY-UHFFFAOYSA-N 2,2,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)F QTKPMCIBUROOGY-UHFFFAOYSA-N 0.000 description 2
- VBHXIMACZBQHPX-UHFFFAOYSA-N 2,2,2-trifluoroethyl prop-2-enoate Chemical compound FC(F)(F)COC(=O)C=C VBHXIMACZBQHPX-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 2
- LBNDGEZENJUBCO-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethyl]butanedioic acid Chemical compound CC(=C)C(=O)OCCC(C(O)=O)CC(O)=O LBNDGEZENJUBCO-UHFFFAOYSA-N 0.000 description 2
- VLJFHOQFPSGZPC-UHFFFAOYSA-N 2-[2-hydroxy-5-(2-methylprop-2-enoyloxy)pentoxy]carbonylbenzoic acid Chemical compound CC(=C)C(=O)OCCCC(O)COC(=O)C1=CC=CC=C1C(O)=O VLJFHOQFPSGZPC-UHFFFAOYSA-N 0.000 description 2
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- QUKRIOLKOHUUBM-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl prop-2-enoate Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCOC(=O)C=C QUKRIOLKOHUUBM-UHFFFAOYSA-N 0.000 description 2
- HTWRFCRQSLVESJ-UHFFFAOYSA-N 3-(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCOC(=O)C(C)=C HTWRFCRQSLVESJ-UHFFFAOYSA-N 0.000 description 2
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 2
- XAMCLRBWHRRBCN-UHFFFAOYSA-N 5-prop-2-enoyloxypentyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCOC(=O)C=C XAMCLRBWHRRBCN-UHFFFAOYSA-N 0.000 description 2
- UTJKTXBLDXPMIW-UHFFFAOYSA-N 7-(2-methylprop-2-enoyloxy)heptyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCOC(=O)C(C)=C UTJKTXBLDXPMIW-UHFFFAOYSA-N 0.000 description 2
- CKDIBPOOPFHEAK-UHFFFAOYSA-N 7-prop-2-enoyloxyheptyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCOC(=O)C=C CKDIBPOOPFHEAK-UHFFFAOYSA-N 0.000 description 2
- IHNQLRURNALWRJ-UHFFFAOYSA-N 8-prop-2-enoyloxyoctyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCOC(=O)C=C IHNQLRURNALWRJ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 2
- 125000005336 allyloxy group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 150000005690 diesters Chemical class 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 238000002296 dynamic light scattering Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- RXRHXOLQBOFMDI-UHFFFAOYSA-N methoxymethane;2-methylprop-2-enoic acid Chemical compound COC.CC(=C)C(O)=O RXRHXOLQBOFMDI-UHFFFAOYSA-N 0.000 description 2
- FCFDFAVHZMMDEO-UHFFFAOYSA-N methoxymethane;prop-2-enoic acid Chemical compound COC.OC(=O)C=C FCFDFAVHZMMDEO-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002808 molecular sieve Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical class CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 2
- 125000003566 oxetanyl group Chemical group 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- SVBNSYHPWOJNGN-UHFFFAOYSA-N (2,3,4,5-tetramethylphenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=C(C)C(C)=C(C)C(C)=C1 SVBNSYHPWOJNGN-UHFFFAOYSA-N 0.000 description 1
- HCRRDXHCFBIHEO-UHFFFAOYSA-N (2,3,4,5-tetramethylphenyl) prop-2-enoate Chemical compound C(C=C)(=O)OC1=C(C(=C(C(=C1)C)C)C)C HCRRDXHCFBIHEO-UHFFFAOYSA-N 0.000 description 1
- QGZHYFIQDSBZCB-UHFFFAOYSA-N (2-ethylphenyl)-(2,4,6-trimethylbenzoyl)phosphinic acid Chemical compound CCC1=CC=CC=C1P(O)(=O)C(=O)C1=C(C)C=C(C)C=C1C QGZHYFIQDSBZCB-UHFFFAOYSA-N 0.000 description 1
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- QRWAIZJYJNLOPG-UHFFFAOYSA-N (2-oxo-1,2-diphenylethyl) acetate Chemical compound C=1C=CC=CC=1C(OC(=O)C)C(=O)C1=CC=CC=C1 QRWAIZJYJNLOPG-UHFFFAOYSA-N 0.000 description 1
- IAXXETNIOYFMLW-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) 2-methylprop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C(=C)C)CC1C2(C)C IAXXETNIOYFMLW-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- KGHLETQCOQYUFR-UHFFFAOYSA-N (4-butylcyclohexyl) 2-methylprop-2-enoate Chemical compound CCCCC1CCC(OC(=O)C(C)=C)CC1 KGHLETQCOQYUFR-UHFFFAOYSA-N 0.000 description 1
- VQWCARKIMUWGBF-UHFFFAOYSA-N (4-butylphenyl) 2-methylprop-2-enoate Chemical compound CCCCC1=CC=C(OC(=O)C(C)=C)C=C1 VQWCARKIMUWGBF-UHFFFAOYSA-N 0.000 description 1
- KAKXARUWYFOIBF-UHFFFAOYSA-N (4-butylphenyl) prop-2-enoate Chemical compound CCCCC1=CC=C(OC(=O)C=C)C=C1 KAKXARUWYFOIBF-UHFFFAOYSA-N 0.000 description 1
- SIADNYSYTSORRE-UHFFFAOYSA-N (4-chlorophenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=C(Cl)C=C1 SIADNYSYTSORRE-UHFFFAOYSA-N 0.000 description 1
- XSQUPVXOENTCJV-UHFFFAOYSA-N (6-phenylpyridin-3-yl)boronic acid Chemical compound N1=CC(B(O)O)=CC=C1C1=CC=CC=C1 XSQUPVXOENTCJV-UHFFFAOYSA-N 0.000 description 1
- KUGVQHLGVGPAIZ-UHFFFAOYSA-N 1,1,1,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-henicosafluorodecan-2-yl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(F)(C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F KUGVQHLGVGPAIZ-UHFFFAOYSA-N 0.000 description 1
- MJYFYGVCLHNRKB-UHFFFAOYSA-N 1,1,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(F)(F)CF MJYFYGVCLHNRKB-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- ZANRHLGMHYOWQU-UHFFFAOYSA-N 1,5-bis[4-(2-hydroxyethoxy)phenyl]-2,4-dimethylpentan-3-one Chemical compound C=1C=C(OCCO)C=CC=1CC(C)C(=O)C(C)CC1=CC=C(OCCO)C=C1 ZANRHLGMHYOWQU-UHFFFAOYSA-N 0.000 description 1
- IFWOFRICKCJBGV-UHFFFAOYSA-N 1-butoxy-2-(2-hydroxyethoxy)ethanol;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CCCCOC(O)COCCO IFWOFRICKCJBGV-UHFFFAOYSA-N 0.000 description 1
- YOEMVISUZWXAEX-UHFFFAOYSA-N 1-butoxy-2-(2-hydroxyethoxy)ethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCCCOC(O)COCCO YOEMVISUZWXAEX-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- OWQCUVRSJUABCB-UHFFFAOYSA-N 16-methylheptadecyl 2-methylprop-2-enoate Chemical compound CC(C)CCCCCCCCCCCCCCCOC(=O)C(C)=C OWQCUVRSJUABCB-UHFFFAOYSA-N 0.000 description 1
- STFXXRRQKFUYEU-UHFFFAOYSA-N 16-methylheptadecyl prop-2-enoate Chemical compound CC(C)CCCCCCCCCCCCCCCOC(=O)C=C STFXXRRQKFUYEU-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- CERJZAHSUZVMCH-UHFFFAOYSA-N 2,2-dichloro-1-phenylethanone Chemical compound ClC(Cl)C(=O)C1=CC=CC=C1 CERJZAHSUZVMCH-UHFFFAOYSA-N 0.000 description 1
- LNBMZFHIYRDKNS-UHFFFAOYSA-N 2,2-dimethoxy-1-phenylethanone Chemical compound COC(OC)C(=O)C1=CC=CC=C1 LNBMZFHIYRDKNS-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- FDUFQLNPPGRIKX-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CC(C)(CO)CO FDUFQLNPPGRIKX-UHFFFAOYSA-N 0.000 description 1
- LZSBMCHNGLCMPD-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)CC(C)(C)C LZSBMCHNGLCMPD-UHFFFAOYSA-N 0.000 description 1
- BUZAXYQQRMDUTM-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yl prop-2-enoate Chemical compound CC(C)(C)CC(C)(C)OC(=O)C=C BUZAXYQQRMDUTM-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- QGTBRAFPWNISIJ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl 2-methylprop-2-enoate Chemical compound CCCCOCCOCCOC(=O)C(C)=C QGTBRAFPWNISIJ-UHFFFAOYSA-N 0.000 description 1
- ZKLMKZINKNMVKA-UHFFFAOYSA-N 2-(2-hydroxypropoxy)propan-1-ol;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CC(O)COC(C)CO ZKLMKZINKNMVKA-UHFFFAOYSA-N 0.000 description 1
- YATYDCQGPUOZGZ-UHFFFAOYSA-N 2-(2-hydroxypropoxy)propan-1-ol;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(O)COC(C)CO YATYDCQGPUOZGZ-UHFFFAOYSA-N 0.000 description 1
- DAVVKEZTUOGEAK-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl 2-methylprop-2-enoate Chemical compound COCCOCCOC(=O)C(C)=C DAVVKEZTUOGEAK-UHFFFAOYSA-N 0.000 description 1
- HZMXJTJBSWOCQB-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl prop-2-enoate Chemical compound COCCOCCOC(=O)C=C HZMXJTJBSWOCQB-UHFFFAOYSA-N 0.000 description 1
- SJIXRGNQPBQWMK-UHFFFAOYSA-N 2-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 1
- QHVBLSNVXDSMEB-UHFFFAOYSA-N 2-(diethylamino)ethyl prop-2-enoate Chemical compound CCN(CC)CCOC(=O)C=C QHVBLSNVXDSMEB-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- QWDCNUDLDABORJ-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCC1CO1 QWDCNUDLDABORJ-UHFFFAOYSA-N 0.000 description 1
- OSINGWYNQLVGLN-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCC1CO1 OSINGWYNQLVGLN-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- PTJDGKYFJYEAOK-UHFFFAOYSA-N 2-butoxyethyl prop-2-enoate Chemical compound CCCCOCCOC(=O)C=C PTJDGKYFJYEAOK-UHFFFAOYSA-N 0.000 description 1
- SZTBMYHIYNGYIA-UHFFFAOYSA-M 2-chloroacrylate Chemical compound [O-]C(=O)C(Cl)=C SZTBMYHIYNGYIA-UHFFFAOYSA-M 0.000 description 1
- GPOGMJLHWQHEGF-UHFFFAOYSA-N 2-chloroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCl GPOGMJLHWQHEGF-UHFFFAOYSA-N 0.000 description 1
- 125000001340 2-chloroethyl group Chemical group [H]C([H])(Cl)C([H])([H])* 0.000 description 1
- WHBAYNMEIXUTJV-UHFFFAOYSA-N 2-chloroethyl prop-2-enoate Chemical compound ClCCOC(=O)C=C WHBAYNMEIXUTJV-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- IEVADDDOVGMCSI-UHFFFAOYSA-N 2-hydroxybutyl 2-methylprop-2-enoate Chemical compound CCC(O)COC(=O)C(C)=C IEVADDDOVGMCSI-UHFFFAOYSA-N 0.000 description 1
- NJRHMGPRPPEGQL-UHFFFAOYSA-N 2-hydroxybutyl prop-2-enoate Chemical compound CCC(O)COC(=O)C=C NJRHMGPRPPEGQL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- AXYQEGMSGMXGGK-UHFFFAOYSA-N 2-phenoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(=O)C(C=1C=CC=CC=1)OC1=CC=CC=C1 AXYQEGMSGMXGGK-UHFFFAOYSA-N 0.000 description 1
- CEXQWAAGPPNOQF-UHFFFAOYSA-N 2-phenoxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC1=CC=CC=C1 CEXQWAAGPPNOQF-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- HBZFBSFGXQBQTB-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F HBZFBSFGXQBQTB-UHFFFAOYSA-N 0.000 description 1
- HGUISJWNHSGWTP-UHFFFAOYSA-N 3-(2-hydroxypropyl)-4-[2-(2-methylprop-2-enoyloxy)ethyl]phthalic acid Chemical compound CC(O)CC1=C(CCOC(=O)C(C)=C)C=CC(C(O)=O)=C1C(O)=O HGUISJWNHSGWTP-UHFFFAOYSA-N 0.000 description 1
- KEPGNQLKWDULGD-UHFFFAOYSA-N 3-(3-prop-2-enoyloxypropoxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCCCOCCCOC(=O)C=C KEPGNQLKWDULGD-UHFFFAOYSA-N 0.000 description 1
- PCUPXNDEQDWEMM-UHFFFAOYSA-N 3-(diethylamino)propyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCCOC(=O)C(C)=C PCUPXNDEQDWEMM-UHFFFAOYSA-N 0.000 description 1
- XUYDVDHTTIQNMB-UHFFFAOYSA-N 3-(diethylamino)propyl prop-2-enoate Chemical compound CCN(CC)CCCOC(=O)C=C XUYDVDHTTIQNMB-UHFFFAOYSA-N 0.000 description 1
- WWJCRUKUIQRCGP-UHFFFAOYSA-N 3-(dimethylamino)propyl 2-methylprop-2-enoate Chemical compound CN(C)CCCOC(=O)C(C)=C WWJCRUKUIQRCGP-UHFFFAOYSA-N 0.000 description 1
- UFQHFMGRRVQFNA-UHFFFAOYSA-N 3-(dimethylamino)propyl prop-2-enoate Chemical compound CN(C)CCCOC(=O)C=C UFQHFMGRRVQFNA-UHFFFAOYSA-N 0.000 description 1
- UBKOBOIZDIWIFU-UHFFFAOYSA-N 3-(oxiran-2-ylmethoxy)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCOCC1CO1 UBKOBOIZDIWIFU-UHFFFAOYSA-N 0.000 description 1
- GEDOVYSTEQZNIS-UHFFFAOYSA-N 3-(oxiran-2-ylmethoxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCCCOCC1CO1 GEDOVYSTEQZNIS-UHFFFAOYSA-N 0.000 description 1
- AXEOCMRRJYBQKV-UHFFFAOYSA-N 3-[3-(2-methylprop-2-enoyloxy)propoxy]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCOCCCOC(=O)C(C)=C AXEOCMRRJYBQKV-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- NWKKCUWIMOZYOO-UHFFFAOYSA-N 3-methoxybutyl 2-methylprop-2-enoate Chemical compound COC(C)CCOC(=O)C(C)=C NWKKCUWIMOZYOO-UHFFFAOYSA-N 0.000 description 1
- NPYMXLXNEYZTMQ-UHFFFAOYSA-N 3-methoxybutyl prop-2-enoate Chemical compound COC(C)CCOC(=O)C=C NPYMXLXNEYZTMQ-UHFFFAOYSA-N 0.000 description 1
- ULYIFEQRRINMJQ-UHFFFAOYSA-N 3-methylbutyl 2-methylprop-2-enoate Chemical compound CC(C)CCOC(=O)C(C)=C ULYIFEQRRINMJQ-UHFFFAOYSA-N 0.000 description 1
- ZVYGIPWYVVJFRW-UHFFFAOYSA-N 3-methylbutyl prop-2-enoate Chemical compound CC(C)CCOC(=O)C=C ZVYGIPWYVVJFRW-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- YFICSDVNKFLZRQ-UHFFFAOYSA-N 3-trimethylsilylpropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](C)(C)C YFICSDVNKFLZRQ-UHFFFAOYSA-N 0.000 description 1
- IQGSOFGPPDPEQW-UHFFFAOYSA-N 3-trimethylsilylpropyl prop-2-enoate Chemical compound C[Si](C)(C)CCCOC(=O)C=C IQGSOFGPPDPEQW-UHFFFAOYSA-N 0.000 description 1
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 1
- USWANRSZMQLWTG-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)butyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOCC1CO1 USWANRSZMQLWTG-UHFFFAOYSA-N 0.000 description 1
- BYBORNQRJVLEFV-UHFFFAOYSA-N 4-bromobutyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCBr BYBORNQRJVLEFV-UHFFFAOYSA-N 0.000 description 1
- WEHSKQWLOHYQNH-UHFFFAOYSA-N 4-bromobutyl prop-2-enoate Chemical compound BrCCCCOC(=O)C=C WEHSKQWLOHYQNH-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- YKXAYLPDMSGWEV-UHFFFAOYSA-N 4-hydroxybutyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCO YKXAYLPDMSGWEV-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- ITKPVVYFLWFFGA-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C.CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C ITKPVVYFLWFFGA-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- UBRPGRAGAZVZKQ-UHFFFAOYSA-N 8-(2-methylprop-2-enoyloxy)octyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCOC(=O)C(C)=C UBRPGRAGAZVZKQ-UHFFFAOYSA-N 0.000 description 1
- COCLLEMEIJQBAG-UHFFFAOYSA-N 8-methylnonyl 2-methylprop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C(C)=C COCLLEMEIJQBAG-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
- YJVIKVWFGPLAFS-UHFFFAOYSA-N 9-(2-methylprop-2-enoyloxy)nonyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCOC(=O)C(C)=C YJVIKVWFGPLAFS-UHFFFAOYSA-N 0.000 description 1
- SDRGWAPOOAMWAH-UHFFFAOYSA-N C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(CC)(=O)O Chemical compound C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(CC)(=O)O SDRGWAPOOAMWAH-UHFFFAOYSA-N 0.000 description 1
- GFBKYLUEVRKSCW-UHFFFAOYSA-N C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(CC)(=O)O Chemical compound C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(CC)(=O)O GFBKYLUEVRKSCW-UHFFFAOYSA-N 0.000 description 1
- MCAWCMPOYXXFDO-UHFFFAOYSA-N C(C=C)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(CC)(=O)O Chemical compound C(C=C)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(CC)(=O)O MCAWCMPOYXXFDO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- AIJULSRZWUXGPQ-UHFFFAOYSA-N Methylglyoxal Chemical compound CC(=O)C=O AIJULSRZWUXGPQ-UHFFFAOYSA-N 0.000 description 1
- HLJYBXJFKDDIBI-UHFFFAOYSA-N O=[PH2]C(=O)C1=CC=CC=C1 Chemical class O=[PH2]C(=O)C1=CC=CC=C1 HLJYBXJFKDDIBI-UHFFFAOYSA-N 0.000 description 1
- QOMSYEJPHQODNQ-UHFFFAOYSA-N OC(=O)C=C.CCCCOCCOC(=O)C(C)=C Chemical compound OC(=O)C=C.CCCCOCCOC(=O)C(C)=C QOMSYEJPHQODNQ-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-OPQQBVKSSA-N [(1s,3r,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] prop-2-enoate Chemical compound C1C[C@]2(C)[C@H](OC(=O)C=C)C[C@H]1C2(C)C PSGCQDPCAWOCSH-OPQQBVKSSA-N 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
- SWHLOXLFJPTYTL-UHFFFAOYSA-N [2-methyl-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(COC(=O)C(C)=C)COC(=O)C(C)=C SWHLOXLFJPTYTL-UHFFFAOYSA-N 0.000 description 1
- HSZUHSXXAOWGQY-UHFFFAOYSA-N [2-methyl-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(C)(COC(=O)C=C)COC(=O)C=C HSZUHSXXAOWGQY-UHFFFAOYSA-N 0.000 description 1
- KGBBDBRJXGILTQ-UHFFFAOYSA-N [3-(2-methylprop-2-enoyloxy)-2,2-bis(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical class CC(=C)C(=O)OCC(COC(=O)C(C)=C)(COC(=O)C(C)=C)COC(=O)C(C)=C KGBBDBRJXGILTQ-UHFFFAOYSA-N 0.000 description 1
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 description 1
- BIYCENIDAPREGT-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] propanoate Chemical compound CCC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C BIYCENIDAPREGT-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 150000001251 acridines Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000012382 advanced drug delivery Methods 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000004848 alkoxyethyl group Chemical group 0.000 description 1
- 125000004849 alkoxymethyl group Chemical group 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 229940027998 antiseptic and disinfectant acridine derivative Drugs 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- JVASZXZJOJUKDT-UHFFFAOYSA-N bis(1-aminocyclohexa-2,4-dien-1-yl)methanone Chemical class C1C=CC=CC1(N)C(=O)C1(N)CC=CC=C1 JVASZXZJOJUKDT-UHFFFAOYSA-N 0.000 description 1
- CQAIBOSCGCTHPV-UHFFFAOYSA-N bis(1-hydroxycyclohexa-2,4-dien-1-yl)methanone Chemical class C1C=CC=CC1(O)C(=O)C1(O)CC=CC=C1 CQAIBOSCGCTHPV-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- PCELSSNUBBRCHW-UHFFFAOYSA-N butoxymethyl 2-methylprop-2-enoate Chemical compound CCCCOCOC(=O)C(C)=C PCELSSNUBBRCHW-UHFFFAOYSA-N 0.000 description 1
- ZYDJUVQDVSXIJY-UHFFFAOYSA-N butoxymethyl prop-2-enoate Chemical compound CCCCOCOC(=O)C=C ZYDJUVQDVSXIJY-UHFFFAOYSA-N 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000012952 cationic photoinitiator Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- GTBGXKPAKVYEKJ-UHFFFAOYSA-N decyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C(C)=C GTBGXKPAKVYEKJ-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- PODOEQVNFJSWIK-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethoxyphenyl)methanone Chemical compound COC1=CC(OC)=CC(OC)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 PODOEQVNFJSWIK-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009509 drug development Methods 0.000 description 1
- 238000007876 drug discovery Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000007046 ethoxylation reaction Methods 0.000 description 1
- MHCLJIVVJQQNKQ-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical compound CCOC(N)=O.CC(=C)C(O)=O MHCLJIVVJQQNKQ-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- ZYMKZMDQUPCXRP-UHFFFAOYSA-N fluoro prop-2-enoate Chemical compound FOC(=O)C=C ZYMKZMDQUPCXRP-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 229950003188 isovaleryl diethylamide Drugs 0.000 description 1
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 description 1
- HRDXJKGNWSUIBT-UHFFFAOYSA-N methoxybenzene Chemical group [CH2]OC1=CC=CC=C1 HRDXJKGNWSUIBT-UHFFFAOYSA-N 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- ZZSKMNCIAKKVRB-UHFFFAOYSA-N morpholin-4-yl-(2-nitrophenyl)methanone Chemical compound [O-][N+](=O)C1=CC=CC=C1C(=O)N1CCOCC1 ZZSKMNCIAKKVRB-UHFFFAOYSA-N 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical class OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 125000003854 p-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Cl 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000002988 phenazines Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- SRCPVJOXUNHZNU-UHFFFAOYSA-N phenoxymethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCOC1=CC=CC=C1 SRCPVJOXUNHZNU-UHFFFAOYSA-N 0.000 description 1
- MOOIKAPBEQACLF-UHFFFAOYSA-N phenoxymethyl prop-2-enoate Chemical compound C=CC(=O)OCOC1=CC=CC=C1 MOOIKAPBEQACLF-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- SOGFHWHHBILCSX-UHFFFAOYSA-J prop-2-enoate silicon(4+) Chemical compound [Si+4].[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C SOGFHWHHBILCSX-UHFFFAOYSA-J 0.000 description 1
- 150000003252 quinoxalines Chemical class 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000007764 slot die coating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- BMCSMTYIIHFTAL-UHFFFAOYSA-N tris(2-methylprop-2-enoyloxy)silyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)O[Si](OC(=O)C(C)=C)(OC(=O)C(C)=C)OC(=O)C(C)=C BMCSMTYIIHFTAL-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 150000007964 xanthones Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L35/02—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
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Abstract
Description
湿気は、有機発光ダイオード及び有機薄膜太陽電池のような感湿デバイスの性能に対して有害効果を有することが周知である。それ故、そのような敏感なデバイスを封入し、それらを湿気の浸透から保護するために、有機及び無機層を含むバリアスタックが使用される。
本発明の目的は、可視光に対してヘイズを引き起こさないが、特に感湿光電デバイスに対して、優れたバリア性能を提供するバリアスタックのための有機層を製造するための材料組成物を提供することである。
− 1重量%乃至99.98重量%の重合性アクリラート及び/又はメタクリラート材料;
− 重合性材料の重量に対して0.01重量%乃至0.9重量%、好ましくは0.05重量%乃至0.5重量%、より好ましくは0.05重量%乃至0.2重量%、最も好ましくは0.05重量%乃至0.1重量%の比率の親水性ナノ粒子;並びに
− 0.01%乃至10重量%のラジカル光開始剤。
− 重合性材料の重量に対して0.01重量%乃至0.9重量%、好ましくは0.05重量%乃至0.5重量%、より好ましくは0.05重量%乃至0.2重量%、最も好ましくは0.05重量%乃至0.1重量%の比率の親水性ナノ粒子;
− 少なくとも1種の光開始剤、好ましくはラジカル光開始剤;
− 成分A:2より高い、好ましくは4より高い、より好ましくは5より高いclogPを有する、少なくとも1種のアクリラート又はメタクリラート成分;
− 成分B:好ましくは20℃で40mPa・s未満の粘度を有する、少なくとも1種の単官能性アクリラート又はメタクリラート希釈剤成分;
− 成分C:3以上、好ましくは3又は4官能性を有する、少なくとも1種のアクリラート又はメタクリラート成分。
− 成分D:ポリブタジエンアクリラート若しくはメタクリラート、シリコーンアクリラート若しくはメタクリラート、又は2モルエトキシル化ビスフェノールAジ(メタ)アクリラート、又はそれらの任意の混合物(それによって、そのような成分Dは、好ましくは2の(メタ)アクリラート官能性を示す)。
−重合性材料の重量に対して0.01重量%乃至0.9重量%、好ましくは0.05重量%乃至0.5重量%、より好ましくは0.05重量%乃至0.2重量%、最も好ましくは0.05重量%乃至0.1重量%の比率の親水性ナノ粒子;
組成物の総重量に基づいて、
− 0.1乃至10重量%の光開始剤;
− 30乃至80重量%の成分A(好ましくは、2の(メタ)アクリラート官能性を示す);
− 5乃至40重量%の単官能性(メタ)アクリラート希釈剤成分B;
− 5乃至30重量%の3以上の官能性を有する(メタ)アクリラート成分C;及び任意選択的に
− 0.1乃至30重量%の成分D
を含む。
− 重合性材料の重量に対して0.01重量%乃至0.9重量%、好ましくは0.05重量%乃至0.5重量%、より好ましくは0.05重量%乃至0.2重量%、最も好ましくは0.05重量%乃至0.1重量%の比率の親水性ナノ粒子;
組成物の総重量に基づいて、
− 0.1乃至5重量%の光開始剤;
− 40乃至70重量%の成分A(好ましくは、2の(メタ)アクリラート官能性を示す);
− 10乃至30重量%の単官能性(メタ)アクリラート希釈剤成分B;
− 7乃至20重量%の3以上の官能性を有する(メタ)アクリラート成分C;及び任意選択的に
− 0.3乃至25重量%の成分D
を含む。
− 組成物をリジット若しくはフレキシブル基板又は無機層上に付着させる工程、任意選択的に該組成物を加熱する工程、及び;
− 該組成物を放射線、好ましくは化学線で重合する工程。
本発明に係る組成物は極めて少量の親水性ナノ粒子を含むにもかかわらず、優れた水吸収特性が観測される。
組成物1の調製
予備組成物を、表2の重量%に従って、SR595、SR351、SR307、SR421A及びOmnirad248と一緒に混合し、300rpmにて室温で2時間撹拌することによって調製する。次に、混合物を4Åのモレキュラーシーブ(真空オーブン中140℃で24時間予備活性化した)で24時間乾燥させ、次に、最終組成物の調製に使用する前に濾過する。
組成物2の調製
組成物2を、表2のとおり組成物の総重量の0.1%の酸化カルシウム粒子を使用する以外は、例1と同様にして調製する。
組成物3の調製
組成物3を、表2のとおり組成物の総重量の0.05%の酸化カルシウム粒子を使用する以外は、例1と同様にして調製する。
組成物4の調製
組成物4を、表3のとおり成分を混合し、酸化バリウム粒子を使用する以外は、例1と同様にして調製する。
組成物5の調製
組成物5を、表3のとおり組成物の総重量の0.1%の酸化バリウム粒子を使用する以外は、例4と同様にして調製する。
組成物6の調製
組成物6を、表3のとおり組成物の総重量の0.05%の酸化バリウム粒子を使用する以外は、例4と同様にして調製する。
組成物7の調製
組成物7を、表4のとおり成分を混合し、酸化マグネシウム粒子を使用する以外は、例1と同様にして調製する。
組成物8の調製
組成物8を、表4のとおり組成物の総重量の0.1%の酸化マグネシウム粒子を使用する以外は、例7と同様にして調製する。
組成物9の調製
組成物9を、表4のとおり組成物の総重量の0.05%の酸化マグネシウム粒子を使用する以外は、例7と同様にして調製する。
組成物1乃至9中の粒子分散物の平均径は、動的光散乱装置(DLS)であるマルバーン社(malvern instruments)社のゼータサイザーNano Sを使用して測定される。粒径を測定するこの方法に関する詳細については、以下に見いだすことができる:“Nanomaterials: Processing and Characterization with Lasers”, Chapter 8, Size determination of Nanoparticles by Dynamic Light Scattering from S. C. Singh,H. Zeng, C. Guo and W. Cai; DOI:10.1002/9783527646821.ch8。
ヘイズ及び水吸収は、組成物1乃至9を使用して調製された膜について測定される。組成物を、50μmのワイヤバーを有するバーコーターを使用してガラス基板上に適用し、次に、均質な薄膜コーティングを、不活性雰囲気中、4J/cm2の照射線量のUV光(395nm)で硬化すると、測定可能な30μm乃至35μmの層厚を有する硬化薄膜を生じる。その結果を表6にまとめる。
測定は、標準ASTM D1003“Standard Test Method for Haze and Luminous Transmittance of Transparent Plastics”に従って行われる。透過ヘイズは、入射ビームの方向から2.5°超散乱された透過光のパーセントである。30%を超えるヘイズ値を有する材料が拡散的と認められる。
各材料が吸収できる水の量を求めるために、組成物1乃至9の硬化された試料の水吸収を測定した。組成物1乃至9の試料を異なるアルミニウムカップに入れ(組成物およそ1.5g)、不活性雰囲気下、4J/cm2のUV線量を有する395nmのUV LEDを使用して硬化した。次に、硬化された固体部分を40℃/90%RHの保存条件に置いた。水吸収に起因して、試料の重量は経時的に増加した。重量が一定(飽和レベルに相当する)になるまで試料の重量を経時的にモニタリングし、そこから水吸収(重量%)を算出した。これは、分散物の水獲得能を求めていることにほかならない。
湿気がOLEDデバイス内に浸透すると、図3に示すように黒点30が出現し、これが例えば光強度の低下によってデバイスの性能に影響を及ぼす。良好なOLEDは、60℃/90%RHで長期間の信頼性試験に供した場合に、黒点不良が極めて低くなければならない。
図2のような二重対構成を有する下面発光型OLEDデバイス20を調製する。ここで、二重対構成中の有機層24は組成物2から作られる。
組成物10の調製
予備組成物を、表7の重量%に従って、CN9010EU、SR595、SR351、Omnirad248と一緒に混合し、300rpmにて室温で2時間撹拌することによって調製する。次に、混合物を4Åのモレキュラーシーブ(真空オーブン中140℃で24時間予備活性化した)で24時間乾燥し、次に、最終組成物の調製に使用する前に濾過する。
組成物11の調製
組成物11を、表7のとおり組成物の総重量の0.2%のゼオライト粒子を使用する以外は、例13と同様にして調製する。
組成物12の調製
組成物12を、表7のとおり組成物の総重量の0.1%のゼオライト粒子を使用する以外は、例13と同様にして調製する。
Claims (20)
- 湿気に敏感なデバイスの保護のためのバリアスタックにおける使用のための放射線硬化性組成物であって、硬化性材料及び親水性ナノ粒子を含み、親水性ナノ粒子の割合が硬化性材料の重量の0.01重量%乃至0.9重量%の範囲にある、放射線硬化性組成物。
- 親水性ナノ粒子の割合が、硬化性材料の重量の0.05重量%乃至0.2重量%、好ましくは硬化性材料の重量の0.05重量%乃至0.1重量%の範囲にある、請求項1に記載の放射線硬化性組成物。
- − 少なくとも1種のモノマー
− 少なくとも1種の放射線活性開始剤。
を含む、請求項1又は2に記載の放射線硬化性組成物。 - モノマーが単官能性及び/又は多官能性である、請求項3に記載の放射線硬化性組成物。
- − 重合性材料の重量に対して0.01重量%乃至0.9重量%、好ましくは0.05重量%乃至0.5重量%、より好ましくは0.05重量%乃至0.2重量%、最も好ましくは0.05重量%乃至0.1重量%の比率の親水性ナノ粒子;
− 少なくとも1種の光開始剤、好ましくはラジカル光開始剤;
− 成分A:2より高い、好ましくは4より高い、より好ましくは5より高いclogPを有する、少なくとも1種のアクリラート又はメタクリラート成分;
− 成分B:好ましくは20℃で40mPa・s未満の粘度を有する、少なくとも1種の単官能性アクリラート又はメタクリラート希釈剤成分;
− 成分C:3以上、好ましくは3又は4官能性を有する、少なくとも1種のアクリラート又はメタクリラート成分
を含む、請求項1乃至4のいずれか一項に記載の放射線硬化性組成物。 - ポリブタジエンアクリラート若しくはメタクリラート、シリコーンアクリラート若しくはメタクリラート、又は2モルのエトキシル化ビスフェノールAジ(メタ)アクリラート、又はそれらの任意の混合物(それによって、そのような成分Dは、好ましくは2つの(メタ)アクリラート官能性を示す)の少なくとも1つである成分Dをさらに含む、請求項5に記載の放射線硬化性組成物。
- − 重合性材料の重量に対して0.01重量%乃至0.9重量%、好ましくは0.05重量%乃至0.5重量%、より好ましくは0.05重量%乃至0.2重量%、最も好ましくは0.05重量%乃至0.1重量%の比率の親水性ナノ粒子;
組成物の総重量に基づいて、
− 0.1乃至10重量%の光開始剤;
− 30乃至80重量%の成分A(好ましくは、2つの(メタ)アクリラート官能性を示す);
− 5乃至40重量%の単官能性(メタ)アクリラート希釈剤成分B;
− 5乃至30重量%の3以上の官能性を有する(メタ)アクリラート成分C;及び任意選択的に
− 0.1乃至30重量%の成分D
を含む、請求項5又は6に記載の放射線硬化性組成物。 - − 重合性材料の重量に対して0.01重量%乃至0.9重量%、好ましくは0.05重量%乃至0.5重量%、より好ましくは0.05重量%乃至0.2重量%、最も好ましくは0.05重量%乃至0.1重量%の比率の親水性ナノ粒子;
組成物の総重量に基づいて、
− 0.1乃至5重量%の光開始剤;
− 40乃至70重量%の成分A(好ましくは、2つの(メタ)アクリラート官能性を示す);
− 10乃至30重量%の単官能性(メタ)アクリラート希釈剤成分B;
− 7乃至20重量%の3以上の官能性を有する(メタ)アクリラート成分C;及び任意選択的に
− 0.3乃至25重量%の成分D
を含む、請求項5又は6に記載の放射線硬化性組成物。 - 組成物の80重量%超が、760mmHgで180℃より高い、より好ましくは760mmHgで200℃より高い、最も好ましくは760mmHgで220℃より高い沸点を有する成分であることを特徴とする、請求項1乃至8のいずれか一項に記載の放射線硬化性組成物。
- 溶媒を含有しないことを特徴とする、請求項1乃至9のいずれか一項に記載の放射線硬化性組成物。
- 親水性ナノ粒子が200nm未満の平均粒径を有する、請求項1乃至10のいずれか一項に記載の放射線硬化性組成物。
- 親水性ナノ粒子がゼオライトを含む、請求項1乃至11のいずれか一項に記載の放射線硬化性組成物。
- 親水性ナノ粒子が、0乃至+0.5の範囲にあるn−オクタノールと水との間の分配係数の算出された対数を有する、請求項1乃至12のいずれか一項に記載の放射線硬化性組成物。
- 親水性ナノ粒子が、酸化カルシウム又は酸化バリウム又は酸化マグネシウム又はそれらの混合物である、請求項12に記載の放射線硬化性組成物。
- 請求項1乃至14のいずれか一項に記載の放射線硬化性組成物を使用して有機層(12、24)を製造する方法であって、
− 組成物をリジット若しくはフレキシブル基板又は無機層と接触させること、任意選択的に該組成物を加熱すること、及び;
− 該組成物を放射線、好ましくは化学線で重合すること
を含む方法。 - 請求項1乃至14のいずれか一項に記載の組成物から製造された有機層。
- 層厚が1μm乃至100μmである、請求項16に記載の有機層。
- 請求項1乃至14のいずれか一項に記載の放射線硬化性樹脂組成物の、感湿オプトエレクトロニクス素子又はデバイスを保護するためのバリアスタックの一部として有機層(12、24)を製造するための使用。
- 請求項1乃至14のいずれか一項に記載の放射線硬化性樹脂組成物の、オプトエレクトロニクス素子又はデバイスを多重対構成、好ましくは単対構成、より好ましくは二重対構成で封入するための有機層(12、24)を製造するための使用。
- 請求項16乃至17のいずれか一項に記載の有機層の、有機発光ダイオード、有機薄膜太陽電池、有機電界効果トランジスタ、フレキシブルエレクトロニクス、フレキシブル基板、電池、医療包装、食品包装及び液晶ディスプレイにおける使用。
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