JP2018206965A5 - - Google Patents

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Publication number
JP2018206965A5
JP2018206965A5 JP2017111044A JP2017111044A JP2018206965A5 JP 2018206965 A5 JP2018206965 A5 JP 2018206965A5 JP 2017111044 A JP2017111044 A JP 2017111044A JP 2017111044 A JP2017111044 A JP 2017111044A JP 2018206965 A5 JP2018206965 A5 JP 2018206965A5
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JP
Japan
Prior art keywords
workpiece
chip
dividing
holding
chips
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JP2017111044A
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English (en)
Japanese (ja)
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JP2018206965A (ja
JP6855127B2 (ja
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Priority to JP2017111044A priority Critical patent/JP6855127B2/ja
Priority claimed from JP2017111044A external-priority patent/JP6855127B2/ja
Priority to TW107115691A priority patent/TWI742276B/zh
Priority to KR1020180062571A priority patent/KR102553014B1/ko
Priority to CN201810554653.2A priority patent/CN108987341B/zh
Publication of JP2018206965A publication Critical patent/JP2018206965A/ja
Publication of JP2018206965A5 publication Critical patent/JP2018206965A5/ja
Application granted granted Critical
Publication of JP6855127B2 publication Critical patent/JP6855127B2/ja
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JP2017111044A 2017-06-05 2017-06-05 チップの製造方法 Active JP6855127B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017111044A JP6855127B2 (ja) 2017-06-05 2017-06-05 チップの製造方法
TW107115691A TWI742276B (zh) 2017-06-05 2018-05-09 晶片的製造方法
KR1020180062571A KR102553014B1 (ko) 2017-06-05 2018-05-31 칩의 제조 방법
CN201810554653.2A CN108987341B (zh) 2017-06-05 2018-06-01 芯片的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017111044A JP6855127B2 (ja) 2017-06-05 2017-06-05 チップの製造方法

Publications (3)

Publication Number Publication Date
JP2018206965A JP2018206965A (ja) 2018-12-27
JP2018206965A5 true JP2018206965A5 (enExample) 2020-03-05
JP6855127B2 JP6855127B2 (ja) 2021-04-07

Family

ID=64540366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017111044A Active JP6855127B2 (ja) 2017-06-05 2017-06-05 チップの製造方法

Country Status (4)

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JP (1) JP6855127B2 (enExample)
KR (1) KR102553014B1 (enExample)
CN (1) CN108987341B (enExample)
TW (1) TWI742276B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250078630A (ko) * 2019-04-19 2025-06-02 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
JP7427189B2 (ja) * 2020-01-31 2024-02-05 国立大学法人東海国立大学機構 レーザ加工方法、半導体部材製造方法、及び、レーザ加工装置
JP7405365B2 (ja) * 2020-01-31 2023-12-26 国立大学法人東海国立大学機構 レーザ加工方法、半導体部材製造方法、及び、レーザ加工装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
TWI520269B (zh) * 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
TWI256674B (en) * 2005-10-14 2006-06-11 Advanced Semiconductor Eng Method for dicing a wafer
JP5791866B2 (ja) 2009-03-06 2015-10-07 株式会社ディスコ ワーク分割装置
JP5686551B2 (ja) * 2010-08-31 2015-03-18 株式会社ディスコ ウエーハの加工方法
JP5964580B2 (ja) * 2011-12-26 2016-08-03 株式会社ディスコ ウェーハの加工方法
JP2013152987A (ja) * 2012-01-24 2013-08-08 Disco Abrasive Syst Ltd ウエーハの加工方法
JP5988601B2 (ja) * 2012-02-13 2016-09-07 株式会社ディスコ 光デバイスウェーハの分割方法
JP2013236001A (ja) * 2012-05-10 2013-11-21 Disco Abrasive Syst Ltd 板状物の分割方法
JP2014086611A (ja) * 2012-10-25 2014-05-12 Disco Abrasive Syst Ltd 板状物の分割方法
JP2014199834A (ja) * 2013-03-29 2014-10-23 株式会社ディスコ 保持手段及び加工方法
JP2014236034A (ja) * 2013-05-31 2014-12-15 株式会社ディスコ ウェーハの加工方法
JP6178724B2 (ja) * 2013-12-26 2017-08-09 株式会社ディスコ ウェーハの分割方法
JP2016092207A (ja) * 2014-11-05 2016-05-23 株式会社ディスコ フレームユニットの製造方法
JP6456766B2 (ja) * 2015-05-08 2019-01-23 株式会社ディスコ ウエーハの加工方法
JP6576212B2 (ja) * 2015-11-05 2019-09-18 株式会社ディスコ ウエーハの加工方法

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