WO2018013901A3 - Material processing utilizing a laser having a variable beam shape - Google Patents

Material processing utilizing a laser having a variable beam shape Download PDF

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Publication number
WO2018013901A3
WO2018013901A3 PCT/US2017/042089 US2017042089W WO2018013901A3 WO 2018013901 A3 WO2018013901 A3 WO 2018013901A3 US 2017042089 W US2017042089 W US 2017042089W WO 2018013901 A3 WO2018013901 A3 WO 2018013901A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser
material processing
beam shape
variable beam
processing utilizing
Prior art date
Application number
PCT/US2017/042089
Other languages
French (fr)
Other versions
WO2018013901A2 (en
Inventor
Parviz Tayebati
Francisco Villarreal-Saucedo
Wang-Long Zhou
Bien Chann
Robin Huang
Original Assignee
TeraDiode, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/261,096 external-priority patent/US11204506B2/en
Application filed by TeraDiode, Inc. filed Critical TeraDiode, Inc.
Priority to JP2019501655A priority Critical patent/JP6783374B2/en
Priority to CN201780043627.7A priority patent/CN109791303A/en
Priority to DE112017003592.9T priority patent/DE112017003592T5/en
Publication of WO2018013901A2 publication Critical patent/WO2018013901A2/en
Publication of WO2018013901A3 publication Critical patent/WO2018013901A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0734—Shaping the laser spot into an annular shape
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3083—Birefringent or phase retarding elements

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)

Abstract

In various embodiments, workpieces are processed, e.g., via welding or cutting, while the shape and/or one or more other parameters of the laser processing beam are altered. The shape and/or one or more other parameters of the laser processing beam may be varied based on one or more characteristics of the workpiece.
PCT/US2017/042089 2016-07-15 2017-07-14 Material processing utilizing a laser having a variable beam shape WO2018013901A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019501655A JP6783374B2 (en) 2016-07-15 2017-07-14 Material handling using a laser with a variable beam shape
CN201780043627.7A CN109791303A (en) 2016-07-15 2017-07-14 It is processed using the material of the laser of variable beam shape
DE112017003592.9T DE112017003592T5 (en) 2016-07-15 2017-07-14 Material processing using a laser with variable beam shape

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201662362824P 2016-07-15 2016-07-15
US62/362,824 2016-07-15
US15/261,096 US11204506B2 (en) 2014-03-05 2016-09-09 Polarization-adjusted and shape-adjusted beam operation for materials processing
US15/261,096 2016-09-09

Publications (2)

Publication Number Publication Date
WO2018013901A2 WO2018013901A2 (en) 2018-01-18
WO2018013901A3 true WO2018013901A3 (en) 2018-07-26

Family

ID=60953351

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2017/042089 WO2018013901A2 (en) 2016-07-15 2017-07-14 Material processing utilizing a laser having a variable beam shape

Country Status (4)

Country Link
JP (2) JP6783374B2 (en)
CN (1) CN109791303A (en)
DE (1) DE112017003592T5 (en)
WO (1) WO2018013901A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019108837A1 (en) * 2019-04-04 2020-10-08 Baosteel Tailored Blanks Gmbh Method for fusion welding one or more steel sheets made of press-hardenable steel
CN110614446A (en) * 2019-09-24 2019-12-27 上海精测半导体技术有限公司 Cutting equipment and cutting method
CN114633018A (en) * 2020-12-16 2022-06-17 阳程科技股份有限公司 Optical lens module for optical axis inclination processing

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US5583342A (en) * 1993-06-03 1996-12-10 Hamamatsu Photonics K.K. Laser scanning optical system and laser scanning optical apparatus
US20020000428A1 (en) * 1999-01-20 2002-01-03 Lsp Technologies, Inc. Oblique angle laser shock processing
JP2011119026A (en) * 2011-03-22 2011-06-16 Panasonic Corp Optical pickup device and objective lens used for the same
US20130161312A1 (en) * 2003-09-16 2013-06-27 The Trustees Of Columbia University In The City Of New York Laser-irradiated thin films having variable thickness
US20150253676A1 (en) * 2014-03-07 2015-09-10 Kabushiki Kaisha Toshiba Adjusting method of pattern transferring plate, laser application machine and pattern transferring plate

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US6208679B1 (en) 1998-09-08 2001-03-27 Massachusetts Institute Of Technology High-power multi-wavelength external cavity laser
US6192062B1 (en) 1998-09-08 2001-02-20 Massachusetts Institute Of Technology Beam combining of diode laser array elements for high brightness and power
DE59900005D1 (en) * 1999-01-28 2000-06-15 Leister Process Technologies S Laser joining method and device for connecting various workpieces made of plastic or plastic with other materials
JP2000263257A (en) * 1999-03-15 2000-09-26 Hitachi Cable Ltd Laser beam cleaving method of non-metal material and device therefor
JP3722731B2 (en) 2000-09-13 2005-11-30 浜松ホトニクス株式会社 Laser processing method
JP2005230834A (en) * 2004-02-18 2005-09-02 Campus Create Co Ltd Machining method and machining device using laser beam
JP4350558B2 (en) 2004-03-09 2009-10-21 三菱電機株式会社 Laser beam optical system and laser processing apparatus
JP2005314198A (en) * 2004-04-26 2005-11-10 Lemi Ltd Laser apparatus for cutting glass
JP2006061954A (en) * 2004-08-27 2006-03-09 Sony Corp Substrate working device and substrate working method
JP4753048B2 (en) * 2007-04-16 2011-08-17 トヨタ自動車株式会社 Laser welding method for stacked workpieces
US8053704B2 (en) * 2008-05-27 2011-11-08 Corning Incorporated Scoring of non-flat materials
FR2935916B1 (en) * 2008-09-12 2011-08-26 Air Liquide METHOD AND INSTALLATION FOR LASER CUTTING WITH MODIFICATION OF THE QUALITY FACTOR OF THE LASER BEAM
US8670180B2 (en) 2010-03-05 2014-03-11 TeraDiode, Inc. Wavelength beam combining laser with multiple outputs
WO2011109760A2 (en) 2010-03-05 2011-09-09 TeraDiode, Inc. Wavelength beam combining system and method
JP2012094591A (en) * 2010-10-25 2012-05-17 Disco Abrasive Syst Ltd Processing method of veer hole and laser processing device
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US9339890B2 (en) * 2011-12-13 2016-05-17 Hypertherm, Inc. Optimization and control of beam quality for material processing
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US9335551B2 (en) 2012-11-28 2016-05-10 TeraDiode, Inc. Welding techniques using multi-wavelength beam combining systems
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5583342A (en) * 1993-06-03 1996-12-10 Hamamatsu Photonics K.K. Laser scanning optical system and laser scanning optical apparatus
US20020000428A1 (en) * 1999-01-20 2002-01-03 Lsp Technologies, Inc. Oblique angle laser shock processing
US20130161312A1 (en) * 2003-09-16 2013-06-27 The Trustees Of Columbia University In The City Of New York Laser-irradiated thin films having variable thickness
JP2011119026A (en) * 2011-03-22 2011-06-16 Panasonic Corp Optical pickup device and objective lens used for the same
US20150253676A1 (en) * 2014-03-07 2015-09-10 Kabushiki Kaisha Toshiba Adjusting method of pattern transferring plate, laser application machine and pattern transferring plate

Also Published As

Publication number Publication date
JP2021007985A (en) 2021-01-28
JP7098696B2 (en) 2022-07-11
JP6783374B2 (en) 2020-11-11
JP2019523137A (en) 2019-08-22
CN109791303A (en) 2019-05-21
DE112017003592T5 (en) 2019-03-28
WO2018013901A2 (en) 2018-01-18

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