JP2019024048A5 - - Google Patents

Download PDF

Info

Publication number
JP2019024048A5
JP2019024048A5 JP2017142910A JP2017142910A JP2019024048A5 JP 2019024048 A5 JP2019024048 A5 JP 2019024048A5 JP 2017142910 A JP2017142910 A JP 2017142910A JP 2017142910 A JP2017142910 A JP 2017142910A JP 2019024048 A5 JP2019024048 A5 JP 2019024048A5
Authority
JP
Japan
Prior art keywords
workpiece
dividing
holding
chip
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017142910A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019024048A (ja
JP6961297B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2017142910A priority Critical patent/JP6961297B2/ja
Priority claimed from JP2017142910A external-priority patent/JP6961297B2/ja
Priority to KR1020180081428A priority patent/KR102575795B1/ko
Priority to CN201810795006.0A priority patent/CN109300827B/zh
Priority to TW107125134A priority patent/TWI745606B/zh
Publication of JP2019024048A publication Critical patent/JP2019024048A/ja
Publication of JP2019024048A5 publication Critical patent/JP2019024048A5/ja
Application granted granted Critical
Publication of JP6961297B2 publication Critical patent/JP6961297B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017142910A 2017-07-24 2017-07-24 チップの製造方法 Active JP6961297B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017142910A JP6961297B2 (ja) 2017-07-24 2017-07-24 チップの製造方法
KR1020180081428A KR102575795B1 (ko) 2017-07-24 2018-07-13 칩의 제조 방법
CN201810795006.0A CN109300827B (zh) 2017-07-24 2018-07-19 芯片的制造方法
TW107125134A TWI745606B (zh) 2017-07-24 2018-07-20 晶片製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017142910A JP6961297B2 (ja) 2017-07-24 2017-07-24 チップの製造方法

Publications (3)

Publication Number Publication Date
JP2019024048A JP2019024048A (ja) 2019-02-14
JP2019024048A5 true JP2019024048A5 (enExample) 2020-03-05
JP6961297B2 JP6961297B2 (ja) 2021-11-05

Family

ID=65172593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017142910A Active JP6961297B2 (ja) 2017-07-24 2017-07-24 チップの製造方法

Country Status (4)

Country Link
JP (1) JP6961297B2 (enExample)
KR (1) KR102575795B1 (enExample)
CN (1) CN109300827B (enExample)
TW (1) TWI745606B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7189026B2 (ja) * 2019-01-07 2022-12-13 株式会社ディスコ 被加工物の加工方法
JP2021015823A (ja) * 2019-07-10 2021-02-12 株式会社ディスコ ウェーハの加工方法
JP7262904B2 (ja) * 2019-08-26 2023-04-24 株式会社ディスコ キャリア板の除去方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP2005135964A (ja) * 2003-10-28 2005-05-26 Disco Abrasive Syst Ltd ウエーハの分割方法
JP5791866B2 (ja) 2009-03-06 2015-10-07 株式会社ディスコ ワーク分割装置
JP5964580B2 (ja) * 2011-12-26 2016-08-03 株式会社ディスコ ウェーハの加工方法
JP2014199834A (ja) * 2013-03-29 2014-10-23 株式会社ディスコ 保持手段及び加工方法
JP2014236034A (ja) * 2013-05-31 2014-12-15 株式会社ディスコ ウェーハの加工方法
JP6223804B2 (ja) * 2013-12-09 2017-11-01 株式会社ディスコ ウェーハ加工装置
JP6391471B2 (ja) * 2015-01-06 2018-09-19 株式会社ディスコ ウエーハの生成方法

Similar Documents

Publication Publication Date Title
JP2019079917A5 (enExample)
JP5917677B1 (ja) ＳｉＣ材料の加工方法
JP2015516352A5 (enExample)
MY201423A (en) Wafer producing method and laser processing apparatus
KR102429205B1 (ko) 웨이퍼의 가공 방법
TWI468354B (zh) 用於一玻璃基板之切割方法及切割設備
JP2019024048A5 (enExample)
MY181072A (en) Holding table
JP2015053479A5 (enExample)
JP6278760B2 (ja) チップ整列方法
JP6457231B2 (ja) ウエーハの分割方法
JP2018206965A5 (enExample)
EP2962804A3 (en) Method of welding two substrate pieces together using a focused laser beam
JP2018206941A5 (enExample)
JP2015144197A5 (enExample)
JP6986393B2 (ja) 基板の加工方法
JP2008068319A5 (enExample)
CN108735666A (zh) 被加工物的加工方法
JP6494467B2 (ja) ウェーハの加工方法
JP2019220581A5 (enExample)
JP2017107903A (ja) ウェーハの加工方法
JP2019061980A5 (enExample)
TWI783029B (zh) 薄型化板狀構件之製造方法及製造裝置
JP2019040910A5 (enExample)
TW201804528A (zh) 雷射加工裝置