JP2018152541A - 振動デバイス - Google Patents
振動デバイス Download PDFInfo
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- JP2018152541A JP2018152541A JP2017161354A JP2017161354A JP2018152541A JP 2018152541 A JP2018152541 A JP 2018152541A JP 2017161354 A JP2017161354 A JP 2017161354A JP 2017161354 A JP2017161354 A JP 2017161354A JP 2018152541 A JP2018152541 A JP 2018152541A
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- main surface
- piezoelectric element
- conductors
- diaphragm
- wiring board
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- 239000004020 conductor Substances 0.000 claims abstract description 125
- 239000011248 coating agent Substances 0.000 claims abstract description 47
- 238000000576 coating method Methods 0.000 claims abstract description 47
- 239000011347 resin Substances 0.000 claims abstract description 39
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 52
- 230000001070 adhesive effect Effects 0.000 description 52
- 238000006073 displacement reaction Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000011231 conductive filler Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229910001252 Pd alloy Inorganic materials 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
- H10N30/874—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices embedded within piezoelectric or electrostrictive material, e.g. via connections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
Description
Claims (6)
- 第一主面を有する振動板と、
前記第一主面に接合された圧電素子と、
前記第一主面に接合され、かつ、前記圧電素子と電気的に接続された配線基板と、を備え、
前記圧電素子は、
圧電材料からなり、互いに対向している第二主面及び第三主面と、前記第二主面及び前記第三主面に隣り合う側面と、を有する圧電素体と、
前記圧電素体内に配置され、前記第二主面及び前記第三主面の対向方向において互いに対向する複数の内部電極と、
前記第二主面上に配置され、対応する内部電極と電気的に接続された複数の外部電極と、を有すると共に、第三主面及び前記側面で前記第一主面に接合されており、
前記配線基板は、
樹脂膜と、
前記樹脂膜上に延在して配置された複数の導体と、
前記複数の導体を覆うように前記前記複数の導体上に配置された被覆膜と、を有しており、
前記複数の導体の延在方向の一端部は、前記被覆膜から露出しており、対応する前記外部電極と電気的に接続されている、振動デバイス。 - 前記配線基板は、前記被覆膜が前記第一主面と対向するように配置されており、
前記被覆膜は、前記第一主面に接合され、前記一端部は、対応する前記外部電極上に配置されている、請求項1に記載の振動デバイス。 - 前記被覆膜は、前記対向方向から見て前記圧電素子と重なる重複領域を有している、請求項2に記載の振動デバイス。
- 前記重複領域は、前記対向方向において前記圧電素子から離間している、請求項3に記載の振動デバイス。
- 前記重複領域は、前記対向方向から見て前記内部電極から離間している、請求項3又は4に記載の振動デバイス。
- 前記圧電素子は第一接合部材によって前記第一主面に接合されていると共に、前記被覆膜は第二接合部材によって前記第一主面に接合されており、
前記第一接合部材及び前記第二接合部材は、互いに離間している、請求項2〜5のいずれか一項に記載の振動デバイス。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017161354A JP6933054B2 (ja) | 2017-02-13 | 2017-08-24 | 振動デバイス |
US15/894,315 US10825980B2 (en) | 2017-02-13 | 2018-02-12 | Vibrating device |
CN201810145023.XA CN108428784B (zh) | 2017-02-13 | 2018-02-12 | 振动器件 |
CN202210498811.3A CN114864804A (zh) | 2017-02-13 | 2018-02-12 | 振动器件 |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017024314A JP6825404B2 (ja) | 2017-02-13 | 2017-02-13 | 振動デバイス |
JP2017046267 | 2017-03-10 | ||
JP2017046267 | 2017-03-10 | ||
JP2017161354A JP6933054B2 (ja) | 2017-02-13 | 2017-08-24 | 振動デバイス |
JP2017161352A JP7006017B2 (ja) | 2017-03-10 | 2017-08-24 | 振動デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018152541A true JP2018152541A (ja) | 2018-09-27 |
JP6933054B2 JP6933054B2 (ja) | 2021-09-08 |
Family
ID=63105461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017161354A Active JP6933054B2 (ja) | 2017-02-13 | 2017-08-24 | 振動デバイス |
Country Status (3)
Country | Link |
---|---|
US (1) | US10825980B2 (ja) |
JP (1) | JP6933054B2 (ja) |
CN (2) | CN108428784B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020153289A1 (ja) * | 2019-01-25 | 2020-07-30 | Tdk株式会社 | 圧電素子 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1565481S (ja) * | 2016-05-25 | 2016-12-19 | ||
USD857020S1 (en) * | 2016-05-25 | 2019-08-20 | Tdk Corporation | Piezoelectric element |
US10897005B2 (en) * | 2017-02-09 | 2021-01-19 | Tdk Corporation | Vibrating device |
JP6933054B2 (ja) * | 2017-02-13 | 2021-09-08 | Tdk株式会社 | 振動デバイス |
JP6825404B2 (ja) * | 2017-02-13 | 2021-02-03 | Tdk株式会社 | 振動デバイス |
CN112780532A (zh) * | 2019-11-04 | 2021-05-11 | 科际精密股份有限公司 | 致动装置 |
Citations (5)
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JPS5725798A (en) * | 1980-07-24 | 1982-02-10 | Nippon Telegr & Teleph Corp <Ntt> | Piezoelectric sound generator and receiver |
JP2010103977A (ja) * | 2008-09-25 | 2010-05-06 | Kyocera Corp | 振動体 |
WO2013171916A1 (ja) * | 2012-05-14 | 2013-11-21 | 京セラ株式会社 | 圧電アクチュエータ、圧電振動装置および携帯端末 |
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JP6933054B2 (ja) * | 2017-02-13 | 2021-09-08 | Tdk株式会社 | 振動デバイス |
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-
2017
- 2017-08-24 JP JP2017161354A patent/JP6933054B2/ja active Active
-
2018
- 2018-02-12 CN CN201810145023.XA patent/CN108428784B/zh active Active
- 2018-02-12 CN CN202210498811.3A patent/CN114864804A/zh active Pending
- 2018-02-12 US US15/894,315 patent/US10825980B2/en active Active
Patent Citations (5)
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JPS5725798A (en) * | 1980-07-24 | 1982-02-10 | Nippon Telegr & Teleph Corp <Ntt> | Piezoelectric sound generator and receiver |
JP2010103977A (ja) * | 2008-09-25 | 2010-05-06 | Kyocera Corp | 振動体 |
WO2013171916A1 (ja) * | 2012-05-14 | 2013-11-21 | 京セラ株式会社 | 圧電アクチュエータ、圧電振動装置および携帯端末 |
JP2015162728A (ja) * | 2014-02-26 | 2015-09-07 | 京セラ株式会社 | 圧電アクチュエータおよびこれを備えた圧電振動装置、携帯端末、音響発生器、電子機器 |
JP2016092400A (ja) * | 2014-11-04 | 2016-05-23 | 株式会社リコー | 配線部材の保持構造、液体吐出ヘッド及び液体を吐出する装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020153289A1 (ja) * | 2019-01-25 | 2020-07-30 | Tdk株式会社 | 圧電素子 |
JP2020120028A (ja) * | 2019-01-25 | 2020-08-06 | Tdk株式会社 | 圧電素子 |
JP7010247B2 (ja) | 2019-01-25 | 2022-01-26 | Tdk株式会社 | 圧電素子 |
Also Published As
Publication number | Publication date |
---|---|
JP6933054B2 (ja) | 2021-09-08 |
US20180233653A1 (en) | 2018-08-16 |
CN108428784B (zh) | 2022-08-26 |
CN108428784A (zh) | 2018-08-21 |
CN114864804A (zh) | 2022-08-05 |
US10825980B2 (en) | 2020-11-03 |
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