JP2018120991A5 - - Google Patents

Download PDF

Info

Publication number
JP2018120991A5
JP2018120991A5 JP2017012266A JP2017012266A JP2018120991A5 JP 2018120991 A5 JP2018120991 A5 JP 2018120991A5 JP 2017012266 A JP2017012266 A JP 2017012266A JP 2017012266 A JP2017012266 A JP 2017012266A JP 2018120991 A5 JP2018120991 A5 JP 2018120991A5
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
main surface
resin material
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017012266A
Other languages
English (en)
Japanese (ja)
Other versions
JP6989264B2 (ja
JP2018120991A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2017012266A priority Critical patent/JP6989264B2/ja
Priority claimed from JP2017012266A external-priority patent/JP6989264B2/ja
Publication of JP2018120991A publication Critical patent/JP2018120991A/ja
Publication of JP2018120991A5 publication Critical patent/JP2018120991A5/ja
Priority to JP2021152123A priority patent/JP2022003688A/ja
Application granted granted Critical
Publication of JP6989264B2 publication Critical patent/JP6989264B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017012266A 2017-01-26 2017-01-26 半導体装置およびその製造方法 Active JP6989264B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017012266A JP6989264B2 (ja) 2017-01-26 2017-01-26 半導体装置およびその製造方法
JP2021152123A JP2022003688A (ja) 2017-01-26 2021-09-17 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017012266A JP6989264B2 (ja) 2017-01-26 2017-01-26 半導体装置およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021152123A Division JP2022003688A (ja) 2017-01-26 2021-09-17 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2018120991A JP2018120991A (ja) 2018-08-02
JP2018120991A5 true JP2018120991A5 (enExample) 2019-10-31
JP6989264B2 JP6989264B2 (ja) 2022-01-05

Family

ID=63045437

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017012266A Active JP6989264B2 (ja) 2017-01-26 2017-01-26 半導体装置およびその製造方法
JP2021152123A Pending JP2022003688A (ja) 2017-01-26 2021-09-17 半導体装置の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021152123A Pending JP2022003688A (ja) 2017-01-26 2021-09-17 半導体装置の製造方法

Country Status (1)

Country Link
JP (2) JP6989264B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019215523A1 (de) 2019-10-10 2021-04-15 Vitesco Technologies GmbH Leistungshalbleiterbauteil sowie Verfahren zur Herstellung eines Leistungshalbleiterbauteils
DE102019215503A1 (de) 2019-10-10 2021-04-15 Vitesco Technologies GmbH Leistungshalbleiterbauteil sowie Verfahren zur Herstellung eines Leistungshalbleiterbauteils

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05327163A (ja) * 1992-05-20 1993-12-10 Fujitsu Ltd 電子部品の実装構造
JP2000332473A (ja) * 1999-05-17 2000-11-30 Toshiba Corp 電子機器
JP2005340684A (ja) * 2004-05-31 2005-12-08 Calsonic Kansei Corp 基板への電子素子の取付構造
US20090085227A1 (en) * 2005-05-17 2009-04-02 Matsushita Electric Industrial Co., Ltd. Flip-chip mounting body and flip-chip mounting method
JP2008226983A (ja) * 2007-03-09 2008-09-25 Seiko Epson Corp プリント基板および電子機器
JP2010267869A (ja) * 2009-05-15 2010-11-25 Autonetworks Technologies Ltd 配線基板
JP2018046225A (ja) * 2016-09-16 2018-03-22 株式会社豊田自動織機 基板装置

Similar Documents

Publication Publication Date Title
TWI534916B (zh) 晶片封裝基板和結構及其製作方法
US20100319974A1 (en) Printed wiring board, electronic device, and method for manufacturing electronic device
JP2014127706A5 (ja) 半導体装置の製造方法
TWI536879B (zh) 軟性電路板及其製造方法
CN107846779A (zh) 柔性电路板的制备方法、柔性电路板及移动终端
JP2018120991A5 (enExample)
TWI530240B (zh) 電路板及其製作方法
JP2014188712A (ja) 印刷物の製造方法、電子部品実装構造体の製造方法、マスクおよび電子部品実装構造体
CN203691751U (zh) 印刷电路板和显示装置
JP2011238730A (ja) チップ抵抗器およびその実装構造
CN106852009B (zh) 带电路的悬挂基板和带电路的悬挂基板的制造方法
TWI538597B (zh) 電路板及電路板的製造方法
JP6570728B2 (ja) 電子装置およびその製造方法
JP5168156B2 (ja) Ｂｇａ搭載用基板
CN104066271B (zh) 印刷电路板与在其电路板上配置集成电路封装元件的方法
TWI630767B (zh) 印刷基板之製造方法及導電性構件之接合方法
CN218183656U (zh) 背板和电子装置
CN114284174B (zh) 印刷网、显示装置的制作方法及显示装置
TWI507108B (zh) 柔性電路板及其製作方法
JP2012094681A (ja) プリント配線基板
TW201440583A (zh) 具有對應焊墊結構設計之線路板
TWI625077B (zh) Chip package structure
TWI549234B (zh) 用於接置半導體裝置之層結構及其製法
JP2003309353A (ja) 電子回路ユニット
JP2003066861A5 (enExample)