JP6989264B2 - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
JP6989264B2
JP6989264B2 JP2017012266A JP2017012266A JP6989264B2 JP 6989264 B2 JP6989264 B2 JP 6989264B2 JP 2017012266 A JP2017012266 A JP 2017012266A JP 2017012266 A JP2017012266 A JP 2017012266A JP 6989264 B2 JP6989264 B2 JP 6989264B2
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circuit board
printed circuit
semiconductor device
solder
circuit component
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Japanese (ja)
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JP2018120991A5 (enExample
JP2018120991A (ja
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義一 角田
隆 熊谷
康博 貫里
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2021152123A priority patent/JP2022003688A/ja
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP2017012266A 2017-01-26 2017-01-26 半導体装置およびその製造方法 Active JP6989264B2 (ja)

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JP2017012266A JP6989264B2 (ja) 2017-01-26 2017-01-26 半導体装置およびその製造方法
JP2021152123A JP2022003688A (ja) 2017-01-26 2021-09-17 半導体装置の製造方法

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JP2017012266A JP6989264B2 (ja) 2017-01-26 2017-01-26 半導体装置およびその製造方法

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JP2018120991A JP2018120991A (ja) 2018-08-02
JP2018120991A5 JP2018120991A5 (enExample) 2019-10-31
JP6989264B2 true JP6989264B2 (ja) 2022-01-05

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JP2021152123A Pending JP2022003688A (ja) 2017-01-26 2021-09-17 半導体装置の製造方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019215503A1 (de) * 2019-10-10 2021-04-15 Vitesco Technologies GmbH Leistungshalbleiterbauteil sowie Verfahren zur Herstellung eines Leistungshalbleiterbauteils
DE102019215523A1 (de) 2019-10-10 2021-04-15 Vitesco Technologies GmbH Leistungshalbleiterbauteil sowie Verfahren zur Herstellung eines Leistungshalbleiterbauteils

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05327163A (ja) * 1992-05-20 1993-12-10 Fujitsu Ltd 電子部品の実装構造
JP2000332473A (ja) * 1999-05-17 2000-11-30 Toshiba Corp 電子機器
JP2005340684A (ja) * 2004-05-31 2005-12-08 Calsonic Kansei Corp 基板への電子素子の取付構造
JP4402718B2 (ja) * 2005-05-17 2010-01-20 パナソニック株式会社 フリップチップ実装方法
JP2008226983A (ja) * 2007-03-09 2008-09-25 Seiko Epson Corp プリント基板および電子機器
JP2010267869A (ja) * 2009-05-15 2010-11-25 Autonetworks Technologies Ltd 配線基板
JP2018046225A (ja) * 2016-09-16 2018-03-22 株式会社豊田自動織機 基板装置

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JP2022003688A (ja) 2022-01-11
JP2018120991A (ja) 2018-08-02

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