JP2018060958A - 加工装置 - Google Patents
加工装置 Download PDFInfo
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- JP2018060958A JP2018060958A JP2016198614A JP2016198614A JP2018060958A JP 2018060958 A JP2018060958 A JP 2018060958A JP 2016198614 A JP2016198614 A JP 2016198614A JP 2016198614 A JP2016198614 A JP 2016198614A JP 2018060958 A JP2018060958 A JP 2018060958A
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- 238000012545 processing Methods 0.000 title claims abstract description 135
- 238000007689 inspection Methods 0.000 claims abstract description 28
- 238000005259 measurement Methods 0.000 claims abstract description 19
- 235000012431 wafers Nutrition 0.000 claims description 234
- 238000012546 transfer Methods 0.000 claims description 21
- 238000003860 storage Methods 0.000 claims description 9
- 230000007547 defect Effects 0.000 abstract description 5
- 238000003780 insertion Methods 0.000 abstract description 5
- 238000000227 grinding Methods 0.000 description 27
- 238000004140 cleaning Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
12 カセット載置ユニット
14 搬出ユニット
16 搬送ユニット
18 中心合わせユニット
20 ウェーハ検査ユニット
22a 粗研削ユニット(加工ユニット)
22b 仕上げ研削ユニット(加工ユニット)
22c レーザー加工ユニット(加工ユニット)
24 洗浄ユニット
26 制御ユニット
46 載置テーブル
48 当接部
50 保持テーブル
52 測定手段
76 記憶部
78 判断部
80 報知手段
Claims (3)
- 複数のウェーハを収容したカセットを載置するカセット載置ユニットと、該カセット載置ユニットに載置されたカセットからウェーハを搬出する搬出ユニットと、該搬出ユニットによって搬出されたウェーハを搬送する搬送ユニットと、該搬送ユニットに隣接して配設されウェーハにそれぞれ異なる加工を施す複数の加工ユニットと、該各ユニットを制御する制御ユニットと、を少なくとも備え、該制御ユニットには少なくともウェーハ厚み及びウェーハ外径を含むウェーハ特性に対応して設定された加工条件を予め記憶する記憶部を備えた加工装置であって、
該搬送ユニットに隣接して配設され、該搬送ユニットで搬送されたウェーハが該加工条件に対応するウェーハか否かを判断するために検査するウェーハ検査ユニットを備え、
該ウェーハ検査ユニットは、該搬送ユニットから搬送されたウェーハを保持する保持テーブルと、該保持テーブルに保持された該ウェーハ特性を測定する測定手段と、を備え、
該制御ユニットは、該測定手段で測定された該ウェーハ特性の実測値と該加工条件に対応するウェーハ特性の設定値とを比較して、搬送されたウェーハが該加工条件に対応するウェーハか否かを判断する判断部を備え、
該判断部は、搬送されたウェーハが該加工条件に対応するウェーハであると判断した場合には、当該ウェーハは該加工ユニットへ搬送され加工が施され、
該判断部は、搬送されたウェーハが該加工条件に対応するウェーハではないと判断した場合には、報知手段によりエラーが報知されること、
を特徴とする加工装置。 - 該ウェーハ特性は、ウェーハ外径、ウェーハ厚み、インデックスサイズ及びアライメント用キーパターン画像のいずれかを含むことを特徴とする、請求項1記載の加工装置。
- 該搬出ユニットによって搬出されたウェーハを上面に載置する載置テーブルと、該載置テーブルを中心として径方向に移動可能に構成された3以上の当接部を備えたウェーハの中心を合わせる中心合わせ手段を備え、
該中心合わせ手段は該ウェーハ検査ユニットを兼ね、該載置テーブルに載置された該ウェーハ特性を測定する測定手段を備え、
該載置テーブルに載置されたウェーハは該当接部により中心合わせされると共に該測定手段において該ウェーハ特性を実測することを特徴とする、請求項1又は2記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016198614A JP6765926B2 (ja) | 2016-10-07 | 2016-10-07 | 加工装置 |
TW106131124A TWI732933B (zh) | 2016-10-07 | 2017-09-12 | 加工裝置 |
CN201710910368.5A CN107919310B (zh) | 2016-10-07 | 2017-09-29 | 加工装置 |
US15/725,443 US10964567B2 (en) | 2016-10-07 | 2017-10-05 | Processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016198614A JP6765926B2 (ja) | 2016-10-07 | 2016-10-07 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018060958A true JP2018060958A (ja) | 2018-04-12 |
JP6765926B2 JP6765926B2 (ja) | 2020-10-07 |
Family
ID=61829064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016198614A Active JP6765926B2 (ja) | 2016-10-07 | 2016-10-07 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10964567B2 (ja) |
JP (1) | JP6765926B2 (ja) |
CN (1) | CN107919310B (ja) |
TW (1) | TWI732933B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020138286A (ja) * | 2019-02-28 | 2020-09-03 | 株式会社ディスコ | 加工装置 |
KR20240016873A (ko) | 2022-07-29 | 2024-02-06 | 가부시기가이샤 디스코 | 반송 장치 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6887722B2 (ja) * | 2016-10-25 | 2021-06-16 | 株式会社ディスコ | ウェーハの加工方法及び切削装置 |
JP2019198940A (ja) * | 2018-05-18 | 2019-11-21 | 株式会社ディスコ | 加工装置 |
JP2021126744A (ja) * | 2020-02-17 | 2021-09-02 | 株式会社ディスコ | 加工装置 |
JP2022097831A (ja) * | 2020-12-21 | 2022-07-01 | 株式会社ディスコ | 研削装置及び研削装置の駆動方法 |
CN114659456A (zh) * | 2020-12-23 | 2022-06-24 | 中国科学院微电子研究所 | 一种软刷辊轴间距检测装置、调整系统及方法 |
TWI790591B (zh) * | 2021-04-12 | 2023-01-21 | 環球晶圓股份有限公司 | 晶圓加工系統及其重工方法 |
US20230039611A1 (en) * | 2021-08-06 | 2023-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Sandpaper replacement system |
Citations (10)
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JPH0637170A (ja) * | 1992-07-15 | 1994-02-10 | Fujitsu Ltd | ウェーハアライメント方法及び装置 |
JP2002050597A (ja) * | 2000-08-03 | 2002-02-15 | Okamoto Machine Tool Works Ltd | 基板の裏面研削装置 |
JP2002177861A (ja) * | 2000-12-18 | 2002-06-25 | Toray Ind Inc | 塗液の塗布装置および方法並びにプラズマディスプレイ用部材の製造装置および方法 |
JP2003243474A (ja) * | 2002-02-15 | 2003-08-29 | Tokyo Electron Ltd | 無人搬送車システム |
JP2005150324A (ja) * | 2003-11-14 | 2005-06-09 | Ulvac Japan Ltd | 枚葉式真空処理方法及び枚葉式真空処理装置 |
JP2008277478A (ja) * | 2007-04-27 | 2008-11-13 | Fujifilm Corp | 基板クランプ機構及び描画システム |
JP2011096843A (ja) * | 2009-10-29 | 2011-05-12 | Hitachi High-Tech Control Systems Corp | ウェーハ搬送装置及びウェーハサイズの判別方法 |
JP2015038944A (ja) * | 2013-08-19 | 2015-02-26 | 株式会社ディスコ | 加工装置 |
JP2015170689A (ja) * | 2014-03-06 | 2015-09-28 | 株式会社ディスコ | 切削装置 |
JP2016027671A (ja) * | 2015-10-14 | 2016-02-18 | 東京エレクトロン株式会社 | 剥離装置、剥離システムおよび剥離方法 |
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JP6242603B2 (ja) * | 2013-06-25 | 2017-12-06 | 株式会社ディスコ | ウエーハ加工装置 |
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-
2016
- 2016-10-07 JP JP2016198614A patent/JP6765926B2/ja active Active
-
2017
- 2017-09-12 TW TW106131124A patent/TWI732933B/zh active
- 2017-09-29 CN CN201710910368.5A patent/CN107919310B/zh active Active
- 2017-10-05 US US15/725,443 patent/US10964567B2/en active Active
Patent Citations (10)
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JPH0637170A (ja) * | 1992-07-15 | 1994-02-10 | Fujitsu Ltd | ウェーハアライメント方法及び装置 |
JP2002050597A (ja) * | 2000-08-03 | 2002-02-15 | Okamoto Machine Tool Works Ltd | 基板の裏面研削装置 |
JP2002177861A (ja) * | 2000-12-18 | 2002-06-25 | Toray Ind Inc | 塗液の塗布装置および方法並びにプラズマディスプレイ用部材の製造装置および方法 |
JP2003243474A (ja) * | 2002-02-15 | 2003-08-29 | Tokyo Electron Ltd | 無人搬送車システム |
JP2005150324A (ja) * | 2003-11-14 | 2005-06-09 | Ulvac Japan Ltd | 枚葉式真空処理方法及び枚葉式真空処理装置 |
JP2008277478A (ja) * | 2007-04-27 | 2008-11-13 | Fujifilm Corp | 基板クランプ機構及び描画システム |
JP2011096843A (ja) * | 2009-10-29 | 2011-05-12 | Hitachi High-Tech Control Systems Corp | ウェーハ搬送装置及びウェーハサイズの判別方法 |
JP2015038944A (ja) * | 2013-08-19 | 2015-02-26 | 株式会社ディスコ | 加工装置 |
JP2015170689A (ja) * | 2014-03-06 | 2015-09-28 | 株式会社ディスコ | 切削装置 |
JP2016027671A (ja) * | 2015-10-14 | 2016-02-18 | 東京エレクトロン株式会社 | 剥離装置、剥離システムおよび剥離方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020138286A (ja) * | 2019-02-28 | 2020-09-03 | 株式会社ディスコ | 加工装置 |
JP7201478B2 (ja) | 2019-02-28 | 2023-01-10 | 株式会社ディスコ | 加工装置 |
KR20240016873A (ko) | 2022-07-29 | 2024-02-06 | 가부시기가이샤 디스코 | 반송 장치 |
Also Published As
Publication number | Publication date |
---|---|
JP6765926B2 (ja) | 2020-10-07 |
CN107919310B (zh) | 2023-03-28 |
CN107919310A (zh) | 2018-04-17 |
US10964567B2 (en) | 2021-03-30 |
TWI732933B (zh) | 2021-07-11 |
TW201816873A (zh) | 2018-05-01 |
US20180102268A1 (en) | 2018-04-12 |
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