JP2018037689A - バック・メタルを有する基板をダイシングするための方法 - Google Patents
バック・メタルを有する基板をダイシングするための方法 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 182
- 238000000034 method Methods 0.000 title claims abstract description 98
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 66
- 239000002184 metal Substances 0.000 title claims abstract description 66
- 239000012530 fluid Substances 0.000 claims abstract description 219
- 235000012431 wafers Nutrition 0.000 description 80
- 239000010409 thin film Substances 0.000 description 64
- 230000008569 process Effects 0.000 description 38
- 239000004065 semiconductor Substances 0.000 description 25
- 238000005530 etching Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 18
- 230000006378 damage Effects 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 239000012528 membrane Substances 0.000 description 10
- 238000001020 plasma etching Methods 0.000 description 10
- 238000000926 separation method Methods 0.000 description 9
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- 230000001070 adhesive effect Effects 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
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- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
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- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 238000009623 Bosch process Methods 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
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- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
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- 230000000873 masking effect Effects 0.000 description 1
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- 238000005459 micromachining Methods 0.000 description 1
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- 239000010980 sapphire Substances 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- 238000003631 wet chemical etching Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
- H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Dicing (AREA)
Abstract
【解決手段】本方法は、第1の表面及び第2の表面を有する基板を用意するステップであり、第2の表面が第1の表面に対して反対側であり、マスク層が基板の第1の表面の上にあり、金属層が基板の第2の表面の上にある、基板を用意するステップと、基板の第2の表面上の金属層を露出させるためにマスク層を介して基板の第1の表面をダイシングするステップと、金属層がダイシング・ステップによって露出された後で、基板の第2の表面上の金属層に複数の流体ジェットから流体を当てるステップとを含む。
【選択図】図3a
Description
1)破壊及びチッピングが減少する、
2)ダイ間のカーフ又はストリート寸法を20ミクロンよりもはるかに小さく減少させることが可能である、
3)ダイの数が増えても、処理時間は著しくは増加しない、
4)処理時間は、薄いウェハに対して減少する、及び
5)ダイの幾何学的形態は、直線で囲まれた形式に限定されない。
1.基板上のストリート幅よりも大きくする、
2.基板上の1つのダイ寸法よりも大きくする、
3.基板上の少なくとも1つのダイの一部をカバーする、又は
4.基板の寸法よりも小さくする
ことが可能である。
1.少なくとも一次元において対称、
2.円錐形−中空及び/若しくは中空でない円錐、
3.扇形、
4.少なくとも一次元において非対称、又は
5.直線状のカーテンとすることが可能なカーテン、
の形状にすることが可能である。
Claims (16)
- バック・メタルを有する基板をダイシングするための方法であって、
第1の表面及び第2の表面を有する前記基板を用意するステップであり、前記第2の表面が前記第1の表面に対して反対側であり、マスク層が前記基板の前記第1の表面の上にあり、金属層が前記基板の前記第2の表面の上にある、前記基板を用意するステップと、
前記基板の前記第2の表面上の前記金属層を露出させるために前記マスク層を介して前記基板の前記第1の表面をダイシングするステップと、
前記金属層が前記ダイシング・ステップによって露出された後で、前記基板の前記第2の表面上の前記金属層に複数の流体ジェットから流体を当てるステップと、
を含む方法。 - 前記金属層が、ほぼ1から5ミクロン厚である、請求項1に記載の方法。
- 前記複数の流体ジェットからの前記流体が、流体幅で、前記基板上に投与され、前記流体幅が前記基板上のストリート幅よりも大きい、請求項1に記載の方法。
- 前記複数の流体ジェットからの前記流体が、あるジェット直径を有し、前記ジェット直径が前記金属層上のダイ直径よりも大きい、請求項1に記載の方法。
- 前記流体ジェットが、前記金属層に前記流体を前記当てる間中、パルス化される、請求項1に記載の方法。
- 前記流体ジェットからの前記流体が、前記金属層に前記流体を前記当てる間中、ファンの形状に投与される、請求項1に記載の方法。
- 前記複数の流体ジェットは、線形アレイに配置されている、請求項1に記載の方法。
- 前記線形アレイは、不規則的に感覚の空いた二次元アレイである、請求項7に記載の方法。
- 前記線形アレイは、規則的に間隔の空いた二次元アレイである、請求項7に記載の方法。
- 前記複数の流体ジェットからの前記流体は、流体ジェット領域で投与され、前記流体ジェット領域は、基板領域よりも大きい、請求項1に記載の方法。
- 前記複数の流体ジェットからの前記流体は、流体ジェット領域で投与され、前記流体ジェット領域は、基板領域よりも小さい、請求項1に記載の方法。
- 前記基板に対して前記複数の流体ジェットを移動させるステップを更に含む、請求項1に記載の方法。
- 前記複数の流体ジェットに対して前記基板を移動させるステップを更に含む、請求項1に記載の方法。
- 少なくとも1つの方向に対照的に前記複数の流体から前記流体を投与するステップを更に含む、請求項1に記載の方法。
- 少なくとも1つの方向に非対称的に前記複数の流体ジェットから前記流体を投与するステップを更に含む、請求項1に記載の方法。
- 前記第1の表面から前記金属層を露出させるステップをさらに含む、請求項1に記載の方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261707464P | 2012-09-28 | 2012-09-28 | |
US61/707,464 | 2012-09-28 | ||
US14/034,164 | 2013-09-23 | ||
US14/034,164 US9368404B2 (en) | 2012-09-28 | 2013-09-23 | Method for dicing a substrate with back metal |
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JP2015534622A Division JP6254599B2 (ja) | 2012-09-28 | 2013-09-25 | バック・メタルを有する基板をダイシングするための方法 |
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JP2018037689A true JP2018037689A (ja) | 2018-03-08 |
JP6556813B2 JP6556813B2 (ja) | 2019-08-07 |
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JP2015534622A Active JP6254599B2 (ja) | 2012-09-28 | 2013-09-25 | バック・メタルを有する基板をダイシングするための方法 |
JP2017230543A Active JP6556813B2 (ja) | 2012-09-28 | 2017-11-30 | バック・メタルを有する基板をダイシングするための方法 |
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US (2) | US9368404B2 (ja) |
EP (1) | EP2901476B1 (ja) |
JP (2) | JP6254599B2 (ja) |
CN (1) | CN104737285B (ja) |
TW (1) | TWI600080B (ja) |
WO (1) | WO2014052445A1 (ja) |
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DE102012111358A1 (de) * | 2012-11-23 | 2014-05-28 | Osram Opto Semiconductors Gmbh | Verfahren zum Vereinzeln eines Verbundes in Halbleiterchips und Halbleiterchip |
US20150147850A1 (en) * | 2013-11-25 | 2015-05-28 | Infineon Technologies Ag | Methods for processing a semiconductor workpiece |
US9472458B2 (en) | 2014-06-04 | 2016-10-18 | Semiconductor Components Industries, Llc | Method of reducing residual contamination in singulated semiconductor die |
US9142459B1 (en) * | 2014-06-30 | 2015-09-22 | Applied Materials, Inc. | Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination |
CN105609555B (zh) * | 2014-11-14 | 2019-06-14 | 株式会社东芝 | 装置的制造方法 |
JP6370720B2 (ja) * | 2014-11-14 | 2018-08-08 | 株式会社東芝 | デバイスの製造方法 |
JP6325421B2 (ja) * | 2014-11-14 | 2018-05-16 | 株式会社東芝 | デバイスの製造方法 |
JP2016134433A (ja) * | 2015-01-16 | 2016-07-25 | 株式会社東芝 | ダイシング装置 |
KR20160057966A (ko) | 2014-11-14 | 2016-05-24 | 가부시끼가이샤 도시바 | 처리 장치, 노즐 및 다이싱 장치 |
US9337098B1 (en) | 2015-08-14 | 2016-05-10 | Semiconductor Components Industries, Llc | Semiconductor die back layer separation method |
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JP6824581B2 (ja) * | 2017-04-04 | 2021-02-03 | 株式会社ディスコ | 加工方法 |
JP6890885B2 (ja) * | 2017-04-04 | 2021-06-18 | 株式会社ディスコ | 加工方法 |
US10879212B2 (en) * | 2017-05-11 | 2020-12-29 | Invensas Bonding Technologies, Inc. | Processed stacked dies |
US10373869B2 (en) | 2017-05-24 | 2019-08-06 | Semiconductor Components Industries, Llc | Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus |
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US9368404B2 (en) | 2016-06-14 |
US20140094018A1 (en) | 2014-04-03 |
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CN104737285A (zh) | 2015-06-24 |
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EP2901476B1 (en) | 2018-07-25 |
US10497621B2 (en) | 2019-12-03 |
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US20180254215A9 (en) | 2018-09-06 |
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