JP2018032742A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2018032742A JP2018032742A JP2016164000A JP2016164000A JP2018032742A JP 2018032742 A JP2018032742 A JP 2018032742A JP 2016164000 A JP2016164000 A JP 2016164000A JP 2016164000 A JP2016164000 A JP 2016164000A JP 2018032742 A JP2018032742 A JP 2018032742A
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- JP
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- Prior art keywords
- electrode
- corners
- corner
- semiconductor element
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 85
- 229910000679 solder Inorganic materials 0.000 claims abstract description 37
- 230000008646 thermal stress Effects 0.000 abstract description 23
- 239000002184 metal Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000004020 conductor Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
10:半導体素子
12:エミッタ電極
14:半導体層
16:コレクタ電極
18:信号電極
20a、20b:リードフレーム
22a:本体部
24a:バスバー
30:金属ブロック
32、34、36:はんだ層
41、42、43、44:エミッタ電極の隅部
Claims (1)
- ほぼ矩形の表面を備えており、その表面の一辺に沿った位置に信号電極群が形成されており、その信号電極群を避けた位置に表面電極が形成されており、裏面に裏面電極が形成されている半導体素子と、
前記表面電極と前記裏面電極の少なくとも一方に導通しており、他の部材に向けて延びるバスバーを備えている導電板を備えており、
前記表面電極は円弧上に面取りされた四隅を備えており、前記四隅は、前記信号電極群からも遠くて前記バスバーからも遠い一隅と、前記一隅よりも前記信号電極群または前記バスバーに近い三隅に分類可能であり、
前記一隅の曲率半径が前記三隅の曲率半径より大きく、
前記表面電極を接合するはんだ層の輪郭が前記表面電極の輪郭に対応していることを特徴とする半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016164000A JP6673100B2 (ja) | 2016-08-24 | 2016-08-24 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016164000A JP6673100B2 (ja) | 2016-08-24 | 2016-08-24 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018032742A true JP2018032742A (ja) | 2018-03-01 |
JP6673100B2 JP6673100B2 (ja) | 2020-03-25 |
Family
ID=61303590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016164000A Expired - Fee Related JP6673100B2 (ja) | 2016-08-24 | 2016-08-24 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6673100B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020013923A (ja) * | 2018-07-19 | 2020-01-23 | 株式会社デンソー | 半導体装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61177762A (ja) * | 1985-02-01 | 1986-08-09 | Toshiba Corp | 半導体装置 |
JP2002198456A (ja) * | 2000-12-25 | 2002-07-12 | Toshiba Corp | セラミックス回路基板およびパワーモジュール |
JP2011129662A (ja) * | 2009-12-17 | 2011-06-30 | Sanyo Electric Co Ltd | 半導体装置 |
WO2012157584A1 (ja) * | 2011-05-13 | 2012-11-22 | 富士電機株式会社 | 半導体装置とその製造方法 |
JP2013074264A (ja) * | 2011-09-29 | 2013-04-22 | Renesas Electronics Corp | 半導体装置 |
-
2016
- 2016-08-24 JP JP2016164000A patent/JP6673100B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61177762A (ja) * | 1985-02-01 | 1986-08-09 | Toshiba Corp | 半導体装置 |
JP2002198456A (ja) * | 2000-12-25 | 2002-07-12 | Toshiba Corp | セラミックス回路基板およびパワーモジュール |
JP2011129662A (ja) * | 2009-12-17 | 2011-06-30 | Sanyo Electric Co Ltd | 半導体装置 |
WO2012157584A1 (ja) * | 2011-05-13 | 2012-11-22 | 富士電機株式会社 | 半導体装置とその製造方法 |
JP2013074264A (ja) * | 2011-09-29 | 2013-04-22 | Renesas Electronics Corp | 半導体装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020013923A (ja) * | 2018-07-19 | 2020-01-23 | 株式会社デンソー | 半導体装置 |
JP7099115B2 (ja) | 2018-07-19 | 2022-07-12 | 株式会社デンソー | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JP6673100B2 (ja) | 2020-03-25 |
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