JP2018025789A - レジスト材料及びパターン形成方法 - Google Patents
レジスト材料及びパターン形成方法 Download PDFInfo
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- JP2018025789A JP2018025789A JP2017149258A JP2017149258A JP2018025789A JP 2018025789 A JP2018025789 A JP 2018025789A JP 2017149258 A JP2017149258 A JP 2017149258A JP 2017149258 A JP2017149258 A JP 2017149258A JP 2018025789 A JP2018025789 A JP 2018025789A
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- carbon atoms
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- 0 CC(C[U]C(C(*)=C)=[U])(C(F)(F)F)O Chemical compound CC(C[U]C(C(*)=C)=[U])(C(F)(F)F)O 0.000 description 27
- WLOQLWBIJZDHET-UHFFFAOYSA-N c(cc1)ccc1[S+](c1ccccc1)c1ccccc1 Chemical compound c(cc1)ccc1[S+](c1ccccc1)c1ccccc1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Cc1ccccc1 Chemical compound Cc1ccccc1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- QVLLTVALUYGYIX-UHFFFAOYSA-N CC(C)(C)Oc(cc1)ccc1[S+](c1ccccc1)c1ccccc1 Chemical compound CC(C)(C)Oc(cc1)ccc1[S+](c1ccccc1)c1ccccc1 QVLLTVALUYGYIX-UHFFFAOYSA-N 0.000 description 1
- ZTDBKBVIDLURBR-UHFFFAOYSA-O CCCc1cc(C([Rh])=C)cc([F]c(cccc2)c2[S+](c2ccccc2)c2ccccc2)c1S(O)(=O)=O Chemical compound CCCc1cc(C([Rh])=C)cc([F]c(cccc2)c2[S+](c2ccccc2)c2ccccc2)c1S(O)(=O)=O ZTDBKBVIDLURBR-UHFFFAOYSA-O 0.000 description 1
- GMEXDATVSHAMEP-UHFFFAOYSA-N C[S+](C)c1ccccc1 Chemical compound C[S+](C)c1ccccc1 GMEXDATVSHAMEP-UHFFFAOYSA-N 0.000 description 1
- RCOCMILJXXUEHU-UHFFFAOYSA-N Cc(cc1)ccc1[S+](c1ccccc1)c1ccccc1 Chemical compound Cc(cc1)ccc1[S+](c1ccccc1)c1ccccc1 RCOCMILJXXUEHU-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
1.ベースポリマー、及び下記式(1−1)で表されるスルホニウム塩又は下記式(1−2)で表されるヨードニウム塩を含む酸発生剤を含むレジスト材料。
2.更に、有機溶剤を含む1のレジスト材料。
3.前記ベースポリマーが、下記式(a1)で表される繰り返し単位、又は下記式(a2)で表される繰り返し単位を含むものである1又は2のレジスト材料。
4.更に、溶解阻止剤を含む3のレジスト材料。
5.化学増幅ポジ型レジスト材料である3又は4のレジスト材料。
6.前記ベースポリマーが、酸不安定基を含まないものである1又は2のレジスト材料。
7.更に、架橋剤を含む6のレジスト材料。
8.化学増幅ネガ型レジスト材料である6又は7のレジスト材料。
9.更に、界面活性剤を含む1〜8のいずれかのレジスト材料。
10.前記ベースポリマーが、更に、下記式(f1)〜(f3)で表される繰り返し単位から選ばれる少なくとも1種を含む1〜9のいずれかのレジスト材料。
11.1〜10のいずれかのレジスト材料を基板上に塗布し、加熱処理をしてレジスト膜を形成する工程と、前記レジスト膜を高エネルギー線で露光する工程と、現像液を用いて露光したレジスト膜を現像する工程とを含むパターン形成方法。
12.前記高エネルギー線が、波長193nmのArFエキシマレーザー又は波長248nmのKrFエキシマレーザーである11のパターン形成方法。
13.前記高エネルギー線が、電子線(EB)又は波長3〜15nmのEUVである11のパターン形成方法。
本発明のレジスト材料は、ベースポリマー、及びヨウ素化フェノキシ基又はヨウ素化フェニルアルコキシ基含有フッ素化スルホン酸のスルホニウム塩又はヨードニウム塩を含む酸発生剤を含む。前記スルホニウム塩及びヨードニウム塩は、光照射によってヨウ素化フェノキシ基又はヨウ素化フェニルアルコキシ基含有フルオロスルホン酸を発生する酸発生剤である。本発明のレジスト材料には、これとは異なるスルホン酸、イミド酸又はメチド酸を発生させる酸発生剤を添加してもよいし、ベースポリマーに結合しているバウンド型の酸発生剤と組み合わせてもよい。
本発明のレジスト材料に含まれるスルホニウム塩及びヨードニウム塩は、それぞれ下記式(1−1)及び(1−2)で表されるものである。
本発明のレジスト材料に含まれるベースポリマーは、ポジ型レジスト材料の場合、酸不安定基を含む繰り返し単位を含む。酸不安定基を含む繰り返し単位としては、下記式(a1)で表される繰り返し単位(以下、繰り返し単位a1という。)、又は式(a2)で表される繰り返し単位(以下、繰り返し単位a2という。)が好ましい。
式(1−1)で表されるスルホニウム塩又は式(1−2)で表されるヨードニウム塩、及びベースポリマーを含むレジスト材料に、有機溶剤、界面活性剤、溶解阻止剤、架橋剤等を目的に応じて適宜組み合わせて配合してポジ型レジスト材料及びネガ型レジスト材料を構成することによって、露光部では前記ベースポリマーが触媒反応により現像液に対する溶解速度が加速されるので、極めて高感度のポジ型レジスト材料及びネガ型レジスト材料とすることができる。この場合、レジスト膜の溶解コントラスト及び解像性が高く、露光余裕度があり、プロセス適応性に優れ、露光後のパターン形状が良好でありながら、特に酸拡散を抑制できることから粗密寸法差が小さく、これらのことから実用性が高く、超LSI用レジスト材料として非常に有効なものとすることができる。特に、酸触媒反応を利用した化学増幅ポジ型レジスト材料とすると、より高感度のものとすることができるとともに、諸特性が一層優れたものとなり極めて有用なものとなる。
本発明のレジスト材料を種々の集積回路製造に用いる場合は、公知のリソグラフィー技術を適用することができる。
各々のモノマーを組み合わせてテトラヒドロフラン(THF)溶剤下で共重合反応を行い、メタノールに晶出し、更にヘキサンで洗浄を繰り返した後に単離、乾燥して、以下に示す組成のベースポリマー(ポリマー1〜4)を得た。得られたベースポリマーの組成は1H−NMRにより、Mw及び分散度(Mw/Mn)はGPC(溶剤:THF、標準:ポリスチレン)により確認した。
界面活性剤としてスリーエム社製FC-4430を100ppm溶解させた溶剤に、表1及び2に示される組成で各成分を溶解させた溶液を、0.2μmサイズのフィルターで濾過してレジスト材料を調製した。
有機溶剤:PGMEA(プロピレングリコールモノメチルエーテルアセテート)
GBL(γ−ブチロラクトン)
CyH(シクロヘキサノン)
PGME(プロピレングリコールモノメチルエーテル)
DAA(ジアセトンアルコール)
[実施例1−1〜1−12、比較例1−1〜1−4]
表1に示す各レジスト材料を、シリコンウエハーに信越化学工業(株)製スピンオンカーボン膜ODL-102(カーボンの含有量が80質量%)を200nm、その上にケイ素含有スピンオンハードマスクSHB-A940(ケイ素の含有量が43質量%)を35nmの膜厚で成膜したトライレイヤープロセス用の基板上にスピンコーティングし、ホットプレートを用いて100℃で60秒間ベークし、厚み80nmのレジスト膜を作製した。これをArFエキシマレーザースキャナー((株)ニコン製NSR-S610C、NA1.30、σ0.98/0.78、35度クロスポール照明、Azimuthally偏光照明、6%ハーフトーン位相シフトマスク)を用いて、ウエハー上寸法が50nmライン、100nmピッチのマスクを用いて露光し、表1に記載の温度で60秒間PEBを行った。実施例1−1〜1−11及び比較例1−1〜1−3では、酢酸n−ブチルで30秒間現像を行い、実施例1−12及び比較例1−4では、2.38質量%TMAH水溶液で現像を行い、寸法が50nmスペース、100nmピッチのラインアンドスペースのネガパターンを形成した。(株)日立ハイテクノロジーズ製測長SEM(CG-4000)でラインアンドスペースパターンが1:1で形成されている露光量(感度)とエッジラフネス(LWR)を測定した。
結果を表1に示す。
[実施例2−1〜2−13、比較例2−1]
表2に示す各レジスト材料を、ケイ素含有スピンオンハードマスクSHB-A940(ケイ素の含有量が43質量%)を20nm膜厚で形成したSi基板上にスピンコートし、ホットプレートを用いて105℃で60秒間プリベークして膜厚60nmのレジスト膜を作製した。これに、ASML社製EUVスキャナーNXE3300(NA0.33、σ0.9/0.6、クアドルポール照明、ウエハー上寸法がピッチ46nm、+20%バイアスのホールパターンのマスク)を用いて露光し、ホットプレート上で表2記載の温度で60秒間PEBを行い、2.38質量%TMAH水溶液で30秒間現像を行って、寸法23nmのホールパターンを得た。
得られたレジストパターンについて次の評価を行った。
(株)日立ハイテクノロジーズ製測長SEM(CG5000)を用いて、ホール寸法が23nmで形成されるときの露光量を求めてこれを感度とし、このときのホール50個の寸法を測定し、CDU(寸法バラツキ3σ)を求めた。
結果を表2に示す。
Claims (13)
- ベースポリマー、及び下記式(1−1)で表されるスルホニウム塩又は下記式(1−2)で表されるヨードニウム塩を含む酸発生剤を含むレジスト材料。
- 更に、有機溶剤を含む請求項1記載のレジスト材料。
- 前記ベースポリマーが、下記式(a1)で表される繰り返し単位、又は下記式(a2)で表される繰り返し単位を含むものである請求項1又は2記載のレジスト材料。
- 更に、溶解阻止剤を含む請求項3記載のレジスト材料。
- 化学増幅ポジ型レジスト材料である請求項3又は4記載のレジスト材料。
- 前記ベースポリマーが、酸不安定基を含まないものである請求項1又は2記載のレジスト材料。
- 更に、架橋剤を含む請求項6記載のレジスト材料。
- 化学増幅ネガ型レジスト材料である請求項6又は7記載のレジスト材料。
- 更に、界面活性剤を含む請求項1〜8のいずれか1項記載のレジスト材料。
- 前記ベースポリマーが、更に、下記式(f1)〜(f3)で表される繰り返し単位から選ばれる少なくとも1種を含む請求項1〜9のいずれか1項記載のレジスト材料。
- 請求項1〜10のいずれか1項記載のレジスト材料を基板上に塗布し、加熱処理をしてレジスト膜を形成する工程と、前記レジスト膜を高エネルギー線で露光する工程と、現像液を用いて露光したレジスト膜を現像する工程とを含むパターン形成方法。
- 前記高エネルギー線が、波長193nmのArFエキシマレーザー又は波長248nmのKrFエキシマレーザーである請求項11記載のパターン形成方法。
- 前記高エネルギー線が、電子線又は波長3〜15nmの極端紫外線である請求項11記載のパターン形成方法。
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Cited By (17)
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JP2018005224A (ja) * | 2016-06-28 | 2018-01-11 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
JP2019094323A (ja) * | 2017-11-20 | 2019-06-20 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | ヨウ素含有光酸発生剤及びそれを含む組成物 |
JP2020075919A (ja) * | 2018-11-09 | 2020-05-21 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
JP2020075910A (ja) * | 2018-10-22 | 2020-05-21 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
JP2021012360A (ja) * | 2019-07-04 | 2021-02-04 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
JPWO2019203140A1 (ja) * | 2018-04-20 | 2021-04-22 | 富士フイルム株式会社 | Euv光用感光性組成物、パターン形成方法、電子デバイスの製造方法 |
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US20180039173A1 (en) | 2018-02-08 |
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KR101960605B1 (ko) | 2019-03-20 |
CN107703716A (zh) | 2018-02-16 |
JP6743781B2 (ja) | 2020-08-19 |
TWI633080B (zh) | 2018-08-21 |
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CN107703716B (zh) | 2020-10-23 |
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