JP2017539095A - フレキシブルプリント配線板、これを含む電子装置、およびフレキシブルプリント配線板の製造方法 - Google Patents

フレキシブルプリント配線板、これを含む電子装置、およびフレキシブルプリント配線板の製造方法 Download PDF

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Publication number
JP2017539095A
JP2017539095A JP2017533349A JP2017533349A JP2017539095A JP 2017539095 A JP2017539095 A JP 2017539095A JP 2017533349 A JP2017533349 A JP 2017533349A JP 2017533349 A JP2017533349 A JP 2017533349A JP 2017539095 A JP2017539095 A JP 2017539095A
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JP
Japan
Prior art keywords
protective layer
flexible printed
region
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017533349A
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English (en)
Japanese (ja)
Inventor
チュン リム，チェ
チュン リム，チェ
ウン ソン，トン
ウン ソン，トン
ウク チュン，チン
ウク チュン，チン
Original Assignee
ステムコ カンパニー リミテッド
ステムコ カンパニー リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ステムコ カンパニー リミテッド, ステムコ カンパニー リミテッド filed Critical ステムコ カンパニー リミテッド
Publication of JP2017539095A publication Critical patent/JP2017539095A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2017533349A 2014-12-15 2015-10-01 フレキシブルプリント配線板、これを含む電子装置、およびフレキシブルプリント配線板の製造方法 Pending JP2017539095A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020140180091A KR101547500B1 (ko) 2014-12-15 2014-12-15 연성 회로 기판과 이를 포함하는 전자 장치 및 연성 회로 기판의 제조 방법
KR10-2014-0180091 2014-12-15
PCT/KR2015/010354 WO2016099011A1 (fr) 2014-12-15 2015-10-01 Carte de circuit imprimé souple, dispositif électronique la comprenant et procédé de fabrication de carte de circuit imprimé souple

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020006000A Division JP7080912B2 (ja) 2014-12-15 2020-01-17 フレキシブルプリント配線板、これを含む電子装置、およびフレキシブルプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
JP2017539095A true JP2017539095A (ja) 2017-12-28

Family

ID=54061990

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017533349A Pending JP2017539095A (ja) 2014-12-15 2015-10-01 フレキシブルプリント配線板、これを含む電子装置、およびフレキシブルプリント配線板の製造方法
JP2020006000A Active JP7080912B2 (ja) 2014-12-15 2020-01-17 フレキシブルプリント配線板、これを含む電子装置、およびフレキシブルプリント配線板の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020006000A Active JP7080912B2 (ja) 2014-12-15 2020-01-17 フレキシブルプリント配線板、これを含む電子装置、およびフレキシブルプリント配線板の製造方法

Country Status (4)

Country Link
JP (2) JP2017539095A (fr)
KR (1) KR101547500B1 (fr)
CN (1) CN107006116B (fr)
WO (1) WO2016099011A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102257253B1 (ko) 2015-10-06 2021-05-28 엘지이노텍 주식회사 연성기판
KR101751390B1 (ko) * 2016-01-22 2017-07-11 스템코 주식회사 연성 회로 기판 및 그 제조 방법
KR101753692B1 (ko) * 2016-02-05 2017-07-19 스템코 주식회사 연성 회로 기판, 이를 포함하는 전자 장치 및 연성 회로 기판의 제조 방법
KR101915947B1 (ko) * 2016-07-20 2019-01-30 스템코 주식회사 연성 회로 기판 및 그 제조 방법
CN107645824B (zh) 2016-07-22 2022-07-01 Lg伊诺特有限公司 柔性电路板、覆晶薄膜模块和包括柔性电路板的电子设备
KR102621168B1 (ko) * 2016-08-12 2024-01-05 엘지이노텍 주식회사 연성 회로기판 및 이를 포함하는 전자 디바이스
WO2018235971A1 (fr) * 2017-06-20 2018-12-27 스템코 주식회사 Carte de circuit imprimé souple, dispositif électronique la comprenant et procédé de fabrication de carte de circuit imprimé souple
CN107743340A (zh) * 2017-11-20 2018-02-27 武汉华星光电半导体显示技术有限公司 柔性电路板及显示屏
CN108012413A (zh) * 2017-12-29 2018-05-08 武汉华星光电半导体显示技术有限公司 柔性电路板保护层及oled显示装置
CN111443770A (zh) * 2020-03-24 2020-07-24 维沃移动通信有限公司 显示屏及电子设备
JP2020127054A (ja) * 2020-05-14 2020-08-20 ステムコ カンパニー リミテッド フレキシブルプリント基板、これを含む電子装置、及びフレキシブルプリント基板の製造方法
KR102358393B1 (ko) * 2020-09-22 2022-02-08 (주)티에스이 연성인쇄회로기판 및 이의 제조방법
CN112566363A (zh) * 2020-12-25 2021-03-26 京东方科技集团股份有限公司 柔性电路板和显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5482962U (fr) * 1977-11-24 1979-06-12
JPH07321449A (ja) * 1994-05-25 1995-12-08 Sony Chem Corp 耐屈曲性可撓性回路基板およびその製造方法
JPH0964489A (ja) * 1995-08-25 1997-03-07 Olympus Optical Co Ltd フレキシブルプリント基板
JP2005049686A (ja) * 2003-07-30 2005-02-24 Nippon Seiki Co Ltd 表示装置
JP2005050971A (ja) * 2003-07-31 2005-02-24 Optrex Corp フレキシブル回路基板
JP2006108412A (ja) * 2004-10-06 2006-04-20 Alps Electric Co Ltd フレキシブルプリント基板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3341311B2 (ja) * 1992-10-05 2002-11-05 松下電器産業株式会社 フレキシブル配線板およびその製造方法
JP2001210919A (ja) 1999-11-17 2001-08-03 Sharp Corp フレキシブル配線板およびそれを用いた電子機器
KR101151473B1 (ko) * 2009-11-30 2012-06-01 엘지이노텍 주식회사 연성 인쇄회로기판 및 그 제조방법
CN201928515U (zh) * 2010-11-30 2011-08-10 金壬海 挠性电路板
KR101223701B1 (ko) * 2011-11-23 2013-01-21 스템코 주식회사 연성 회로 기판 및 이를 포함하는 표시 장치, 연성 회로 기판의 제조 방법
KR101402151B1 (ko) * 2013-02-27 2014-05-30 엘지디스플레이 주식회사 영상표시장치용 연성인쇄회로
KR102082133B1 (ko) * 2013-05-10 2020-02-27 엘지디스플레이 주식회사 연성 인쇄회로기판 및 표시소자

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5482962U (fr) * 1977-11-24 1979-06-12
JPH07321449A (ja) * 1994-05-25 1995-12-08 Sony Chem Corp 耐屈曲性可撓性回路基板およびその製造方法
JPH0964489A (ja) * 1995-08-25 1997-03-07 Olympus Optical Co Ltd フレキシブルプリント基板
JP2005049686A (ja) * 2003-07-30 2005-02-24 Nippon Seiki Co Ltd 表示装置
JP2005050971A (ja) * 2003-07-31 2005-02-24 Optrex Corp フレキシブル回路基板
JP2006108412A (ja) * 2004-10-06 2006-04-20 Alps Electric Co Ltd フレキシブルプリント基板

Also Published As

Publication number Publication date
KR101547500B1 (ko) 2015-08-26
CN107006116A (zh) 2017-08-01
JP7080912B2 (ja) 2022-06-06
WO2016099011A1 (fr) 2016-06-23
CN107006116B (zh) 2020-08-11
JP2020074437A (ja) 2020-05-14

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