JP2017522738A5 - - Google Patents

Download PDF

Info

Publication number
JP2017522738A5
JP2017522738A5 JP2017521054A JP2017521054A JP2017522738A5 JP 2017522738 A5 JP2017522738 A5 JP 2017522738A5 JP 2017521054 A JP2017521054 A JP 2017521054A JP 2017521054 A JP2017521054 A JP 2017521054A JP 2017522738 A5 JP2017522738 A5 JP 2017522738A5
Authority
JP
Japan
Prior art keywords
substrate
ensure
screw
properly aligned
contact pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017521054A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017522738A (ja
Filing date
Publication date
Priority claimed from US14/476,224 external-priority patent/US9425076B2/en
Application filed filed Critical
Publication of JP2017522738A publication Critical patent/JP2017522738A/ja
Publication of JP2017522738A5 publication Critical patent/JP2017522738A5/ja
Pending legal-status Critical Current

Links

Images

JP2017521054A 2014-07-03 2015-06-05 基板移送ロボットエンドエフェクタ Pending JP2017522738A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462020769P 2014-07-03 2014-07-03
US62/020,769 2014-07-03
US14/476,224 2014-09-03
US14/476,224 US9425076B2 (en) 2014-07-03 2014-09-03 Substrate transfer robot end effector
PCT/US2015/034333 WO2016003598A1 (en) 2014-07-03 2015-06-05 Substrate transfer robot end effector

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020198010A Division JP7169334B2 (ja) 2014-07-03 2020-11-30 基板移送ロボットエンドエフェクタ

Publications (2)

Publication Number Publication Date
JP2017522738A JP2017522738A (ja) 2017-08-10
JP2017522738A5 true JP2017522738A5 (enExample) 2018-07-12

Family

ID=55017516

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017521054A Pending JP2017522738A (ja) 2014-07-03 2015-06-05 基板移送ロボットエンドエフェクタ
JP2020198010A Active JP7169334B2 (ja) 2014-07-03 2020-11-30 基板移送ロボットエンドエフェクタ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020198010A Active JP7169334B2 (ja) 2014-07-03 2020-11-30 基板移送ロボットエンドエフェクタ

Country Status (9)

Country Link
US (1) US9425076B2 (enExample)
EP (1) EP3164883A4 (enExample)
JP (2) JP2017522738A (enExample)
KR (1) KR102509442B1 (enExample)
CN (2) CN106489194B (enExample)
IL (1) IL249505A0 (enExample)
SG (1) SG11201610314UA (enExample)
TW (1) TWI628738B (enExample)
WO (1) WO2016003598A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10312127B2 (en) 2013-09-16 2019-06-04 Applied Materials, Inc. Compliant robot blade for defect reduction
US9536329B2 (en) * 2014-05-30 2017-01-03 Adobe Systems Incorporated Method and apparatus for performing sentiment analysis based on user reactions to displayable content
JP6276317B2 (ja) * 2016-03-31 2018-02-07 平田機工株式会社 ハンドユニットおよび移載方法
US10090188B2 (en) * 2016-05-05 2018-10-02 Applied Materials, Inc. Robot subassemblies, end effector assemblies, and methods with reduced cracking
JP6757646B2 (ja) * 2016-10-27 2020-09-23 川崎重工業株式会社 基板把持ハンド及びそれを備える基板搬送装置
US10781056B2 (en) 2016-12-22 2020-09-22 General Electric Company Adaptive apparatus and system for automated handling of components
US10773902B2 (en) 2016-12-22 2020-09-15 General Electric Company Adaptive apparatus and system for automated handling of components
USD822735S1 (en) * 2017-03-17 2018-07-10 Donald Dimattia, Jr. Positionable end effector link
US10399231B2 (en) * 2017-05-22 2019-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate handling contacts and methods
US11648738B2 (en) 2018-10-15 2023-05-16 General Electric Company Systems and methods of automated film removal
US11600580B2 (en) 2019-02-27 2023-03-07 Applied Materials, Inc. Replaceable end effector contact pads, end effectors, and maintenance methods
JP7415782B2 (ja) * 2020-05-11 2024-01-17 東京エレクトロン株式会社 基板搬送機構及び基板搬送方法
US20220063113A1 (en) * 2020-08-26 2022-03-03 WaferPath, Inc. Protective cap for a robot end effector
CN112060116B (zh) * 2020-09-02 2021-08-24 深圳市大族富创得科技有限公司 一种搬运机器人
JP7580333B2 (ja) * 2021-05-12 2024-11-11 三菱電機株式会社 ウエハハンド、半導体製造装置、および半導体装置の製造方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4558984A (en) * 1984-05-18 1985-12-17 Varian Associates, Inc. Wafer lifting and holding apparatus
JPH0189455U (enExample) * 1987-12-04 1989-06-13
JPH06151195A (ja) 1992-11-06 1994-05-31 Meidensha Corp 変圧器
US6322119B1 (en) * 1999-07-09 2001-11-27 Semitool, Inc. Robots for microelectronic workpiece handling
JPH10144758A (ja) * 1996-11-11 1998-05-29 Kokusai Electric Co Ltd 基板搬送用プレート
JPH10181878A (ja) * 1996-12-26 1998-07-07 Canon Inc 基板搬送用フィンガ
US5955858A (en) * 1997-02-14 1999-09-21 Applied Materials, Inc. Mechanically clamping robot wrist
DE29708315U1 (de) * 1997-05-09 1997-07-10 Leybold Systems GmbH, 63450 Hanau Vorrichtung für den Transport von scheibenförmigen Substraten in einer Vakuumbeschichtungsanlage oder für deren Magazinierung
US5985033A (en) * 1997-07-11 1999-11-16 Applied Materials, Inc. Apparatus and method for delivering a gas
US6722834B1 (en) * 1997-10-08 2004-04-20 Applied Materials, Inc. Robot blade with dual offset wafer supports
TW543079B (en) * 1999-06-03 2003-07-21 Applied Materials Inc Robot blade for semiconductor processing equipment
US6537011B1 (en) * 2000-03-10 2003-03-25 Applied Materials, Inc. Method and apparatus for transferring and supporting a substrate
JP2003065311A (ja) * 2001-08-24 2003-03-05 Nitto Seiko Co Ltd 流体排出用ねじ部品
JP3962609B2 (ja) * 2002-03-05 2007-08-22 東京エレクトロン株式会社 搬送装置
US7048316B1 (en) * 2002-07-12 2006-05-23 Novellus Systems, Inc. Compound angled pad end-effector
US7641247B2 (en) * 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
JP4275420B2 (ja) * 2003-01-28 2009-06-10 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4339615B2 (ja) 2003-03-04 2009-10-07 株式会社ダイヘン ワークピースの保持機構
US7654596B2 (en) * 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
KR100679269B1 (ko) * 2006-01-04 2007-02-06 삼성전자주식회사 멀티 챔버형 반도체 제조 장치
JP2008108991A (ja) * 2006-10-27 2008-05-08 Daihen Corp ワーク保持機構
US9437469B2 (en) * 2007-04-27 2016-09-06 Brooks Automation, Inc. Inertial wafer centering end effector and transport apparatus
DE112007003490T5 (de) * 2007-05-07 2010-04-15 Symyx Solutions, Inc., Santa Clara Vorrichtung und Verfahren zum Bewegen eines Substrats
US7669903B2 (en) * 2007-10-11 2010-03-02 Crossing Automation, Inc. Ultra low contact area end effector
US8382180B2 (en) * 2007-10-31 2013-02-26 Applied Material, Inc. Advanced FI blade for high temperature extraction
WO2009099107A1 (ja) * 2008-02-06 2009-08-13 Ulvac, Inc. 基板搬送用のロボットハンド
CN102341901B (zh) * 2009-01-11 2013-11-06 应用材料公司 用于移动基板的系统、设备与方法
JP2010239023A (ja) 2009-03-31 2010-10-21 Tokyo Electron Ltd 基板搬送装置及び基板処理装置
TWI616975B (zh) * 2011-12-14 2018-03-01 Nikon Corp Substrate holder and substrate bonding device
US10431489B2 (en) 2013-12-17 2019-10-01 Applied Materials, Inc. Substrate support apparatus having reduced substrate particle generation

Similar Documents

Publication Publication Date Title
JP2017522738A5 (enExample)
TWI628738B (zh) 基板傳送機械手端效器
KR102330713B1 (ko) 감소된 기판 입자 생성을 갖는 기판 지지 장치
USD763264S1 (en) Case for an electronic device
JP2016181494A5 (ja) コネクタと接続対象物との接続構造
JP2017028288A5 (ja) 半導体装置
TWD179672S (zh) 基板保持環之部分
JP2011091388A5 (ja) 半導体装置の作製方法
TWD179095S (zh) 基板保持環
JP6676340B2 (ja) 位置決め装置
WO2014122151A3 (en) Lithographic apparatus
JP2016164120A5 (enExample)
PH12015000319A1 (en) A molding press and a platen for a molding press
EP3933892A4 (en) DRY ETCHING METHOD, METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND ETCHING DEVICE
PH12020551113A1 (en) Apparatus for handling various sized substrates
JP2015026688A5 (enExample)
TW201612973A (en) Method for etching
CN104465877A (zh) 一种石墨钉装卸台
JP2014195062A5 (enExample)
USD812661S1 (en) Welding fixture
UA117236C2 (uk) Система подових плит для автомата для випікання вафель
JP6864913B2 (ja) 基板吸着装置
CN206118191U (zh) 充电器电路板的固定治具
TWD177006S (zh) 半導體製造裝置用附設研磨部之清洗刷之部分
TW201612083A (en) Substrate housing container and retainer