TWI628738B - 基板傳送機械手端效器 - Google Patents
基板傳送機械手端效器 Download PDFInfo
- Publication number
- TWI628738B TWI628738B TW104117843A TW104117843A TWI628738B TW I628738 B TWI628738 B TW I628738B TW 104117843 A TW104117843 A TW 104117843A TW 104117843 A TW104117843 A TW 104117843A TW I628738 B TWI628738 B TW I628738B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- contact surface
- contact
- support member
- angle
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
於此揭露用於支撐基板的設備之實施例。在一些實施例中,用於支撐一基板的設備包含:一支撐構件;及複數個基板接觸元件,該複數個基板接觸元件由該支撐構件突出,其中該複數個基板接觸元件之每一者包含:一第一接觸表面,在一基板放置於該第一接觸表面上時支撐該基板;及一第二接觸表面,該第二接觸表面由該第一接觸表面延伸;其中該第二接觸表面鄰近該基板的一周邊以防止該基板的徑向移動;其中該第一接觸表面相對於該支撐構件處於一第一角度,且該第二接觸表面相對於該支撐構件處於一第二角度;且其中該第一角度介於約3度及5度之間。
Description
本揭示案的實施例一般相關於半導體處理設施。
在半導體基板上的微電子裝置之製作中,在製造處理期間多次於基板邊緣及背側上處置半導體基板。該處置可引起污染物黏著於基板背側且於處理組件之間移動,例如,由腔室至腔室、FOUP(前開式晶圓傳送盒)至FOUP、或處理工具至處理工具與基板、或不同基板之間、用於維持之所不欲的增加的工具停機時間,以移除污染物。該等污染物也可轉移至基板前側,而導致減低的裝置效能及/或良率損失。
上述問題的典型解法意圖藉由減低基板及基板傳送/處置裝置之間的接觸面積來減低背側顆粒的產生。然而,減低接觸面積可減輕顆粒產生的同時,發明人觀察到:即便使用最小的考量的接觸面積,仍舊產生大數量的顆粒。
因此,發明人提供以減低的顆粒產生來支撐及處置基板的改良設備之實施例。
於此揭露用於支撐基板的設備之實施例。在一些實施例中,用於支撐一基板的設備包含:一支撐構件;及複數個基板接觸元件,該複數個基板接觸元件由該支撐構件突出,其中該複數個基板接觸元件之每一者包含:一第一接觸表面,在一基板放置於該第一接觸表面上時支撐該基板;及一第二接觸表面,該第二接觸表面由該第一接觸表面延伸;其中該第二接觸表面鄰近該基板的一周邊以防止該基板的徑向移動;其中該第一接觸表面相對於該支撐構件處於一第一角度,且該第二接觸表面相對於該支撐構件處於一第二角度;且其中該第一角度介於約3度及5度之間。
在一些實施例中,用於傳送一基板的基板傳送機械手包含:一臂,該臂包含一葉片;及複數個基板接觸元件,該複數個基板接觸元件由該葉片的一上方表面突出。該複數個基板接觸元件之每一者包含:一第一接觸表面,在一基板放置於該第一接觸表面上時支撐該基板;及一第二接觸表面,該第二接觸表面由該第一接觸表面延伸;其中該第二接觸表面鄰近該基板的一周邊以防止該基板的徑向移動;其中該第一接觸表面相對於該上方表面處於一第一角度,且該第二接觸表面相對於該上方表面處於一第二角度;且其中該第一角度介於約3度及5度之間。
在一些實施例中,用於傳送一基板的基板傳送機械手包含:一臂,該臂包含一葉片,其中該葉片由一電性傳導摻鈦陶瓷形成;及複數個基板接觸元件,該複數個基板接觸元件由該葉片的一上方表面突出。該複數個基板接觸元件之每一者包含:一第一接觸表面,在一基板放置於該第一接觸表面上時支撐該基板;及一第二接觸表面,該第二接觸表面由該第一接觸表面延伸;其中該第二接觸表面鄰近該基板的一周邊以防止該基板的徑向移動;其中該第一接觸表面相對於該上方表面處於一第一角度,且該第二接觸表面相對於該上方表面處於一第二角度,其中該第一角度介於約3度及5度之間,且其中該第二角度較該第一角度大。
下方描述本揭示案之其他及進一步之實施例。
100‧‧‧基板傳送機械手
102‧‧‧葉片
104‧‧‧臂
106‧‧‧第一端
108‧‧‧第一鏈結
110‧‧‧第二鏈結
112‧‧‧軸
114‧‧‧第二端
116‧‧‧腕部
118‧‧‧接觸墊
120‧‧‧升降銷
150‧‧‧基板
202‧‧‧端效器
204‧‧‧支撐構件
206‧‧‧特徵
210‧‧‧邊緣接觸墊
302‧‧‧第一接觸表面
304‧‧‧第二接觸表面
306‧‧‧螺釘
308‧‧‧墊片
402‧‧‧第一接觸表面
404‧‧‧第二接觸表面
500‧‧‧端效器
502‧‧‧支撐構件
506‧‧‧螺釘
510‧‧‧背側接觸墊
可藉由參考描繪於所附圖式中的圖示的本揭示案之實施例以理解本揭示案之實施例(簡短總結於上方且更詳細描述於下方)。然而,所附圖式僅圖示本揭示案典型的實施例,因此不考慮限制其範圍,因為本揭示案可允許其他等效實施例。
第1圖根據本揭示案的一些實施例描繪用於傳送基板的基板傳送機械手之示意視圖,該基板安置於基板支撐件的升降銷上。
第2圖根據本揭示案的一些實施例描繪基板傳送機械手之端效器的等角視圖。
第3圖根據本揭示案的一些實施例描繪基板傳送機械手葉片之部分的側截面視圖。
第4圖根據本揭示案的一些實施例描繪基板傳送機械手葉片之部分的側截面視圖。
第5圖根據本揭示案的一些實施例描繪基板傳送機械手之端效器的平面視圖。
第6圖根據本揭示案的一些實施例描繪基板傳送機械手葉片之部分的側截面視圖。
為了便於理解,盡可能使用相同元件符號,以標示圖式中常見的相同元件。圖式並未按比例繪製且可為了清晰而簡化。一個實施例中的元件及特徵可有利地併入於其他實施例,而無須進一步敘述。
本揭示案之實施例提供改良的基板處置設備,提供相較於傳統基板支撐設備而言減低的顆粒產生。本揭示案之實施例可有優勢地在製造處理期間避免或減低累積於基板上的污染物,例如,在處理步驟之間處置基板時,而可進一步限制或防止污染物到達基板前側且引起裝置效能問題及/或良率損失。可使用本揭示案之實施例於處理中接觸基板的廣泛多樣的表面中,該等處理需要非常低的增加的顆粒,例
如,於顯示處理、矽晶圓處理、光學元件製造,諸如此類。
第1圖根據本揭示案的一些實施例描繪基板傳送機械手100。例如,基板傳送機械手100可包括在第一端106處用於垂直及旋轉位移的機械人臂(臂104)。臂104可包括一個或更多個鏈結,例如第一鏈結108及在軸112處釘在一起的第二鏈結110。臂104的第二端114可包含腕部116,葉片102的第一端耦合至腕部116。葉片102可包含由葉片之上方表面突出的接觸墊118以支撐基板。下方相關於第2至6圖更詳細描述接觸墊118。
在操作中,可控制基板傳送機械手100使得葉片102被放置於基板150下方,於複數個升降銷120上支撐基板150。經由基板傳送機械手100及臂104的操縱,葉片102由基板150下方的位置升起,以使接觸墊118與基板150的邊緣或背側之至少一者接觸,及以升高基板150離開升降銷120。在接觸基板150時,通常在接觸墊118及基板150之間的接觸面積處產生顆粒。
發明人發現:當接觸基板的任何元件材料較基板材料(例如,矽)硬時、具有對於基板材料的高黏著性時、無法防止基板滑動時、具有粗糙表面時、及非傳導性時,將產生顆粒。例如,若初始藉由黏性材料形成的元件接觸基板,且隨後藉由由硬材料
形成的另一元件接觸基板,將惡化基板上顆粒的產生。相似地,若有電流於基板及傳導性材料之間流動且基板藉由非傳導性材料升高,可發生電弧而惡化基板上顆粒的產生。
發明人發現:可使用一材料防止或實質最小化顆粒的產生,該材料展示接觸基板的元件(例如,接觸墊118)中的一組事先決定的特性。該組事先決定的特性包含:小於或等於欲支撐基板的硬度之硬度(例如,矽)、非黏著性、高至足以防止基板於接觸基板之元件上滑動的靜磨擦係數、電性傳導性、及小於或等於10Ra的表面粗糙度。該材料可包含:例如,氧化鋁、氮化矽、不鏽鋼、及電性傳導性塑膠,例如kapton®、kalrez®、vespel®、及celazole®之其中一者或多者。可使用其他處理可相容的材料展示上方註記的特性。
傳統邊緣接觸墊包含相對於水平面處於一陡峭的角度(約60度)之邊緣支撐表面。發明人發現:在升高基板後,基板滑入一最終安置位置,因為邊緣支撐表面角度的陡峭度,造成基板邊緣上的顆粒產生。因此,發明人發現:可藉由提供邊緣接觸墊一小角度斜面以防止或實質最小化顆粒的產生。
例如,第2圖根據本揭示案的一些實施例描繪端效器202。效端器202包含耦合至支撐構件204的複數個邊緣接觸墊210(第2圖中展示了四
個)。可使用邊緣接觸墊210如第1圖中所描繪的接觸墊118。在一些實施例中,支撐構件204為實質平面的,或包含足以支撐基板的實質平面區域。在一些實施例中,支撐構件204由陶瓷材料形成且可使用鈦來摻雜。摻鈦陶瓷材料相較於傳統基板傳送機械手葉片對於下垂優勢地提供更多阻抗。此外,摻鈦陶瓷支撐構件優勢地為電性傳導性。端效器202也可包含特徵206,例如一孔洞,而可使用以針對基板對齊的目的及/或端效器202的重量減低。前及後邊緣接觸墊210之間的距離L較被處理的基板之直徑稍大。例如,針對處置具有300mm直徑的基板,距離L可為約304mm。然而,距離L將依據被處置基板的大小。
第3圖根據本揭示案的一些實施例描繪邊緣接觸墊210的側視圖。邊緣接觸墊210包含第一接觸表面302及第二接觸表面304。第一接觸表面302相對於支撐構件204具有第一角度θ。第二接觸表面304相對於支撐構件204具有第二角度α。由於基板150的重量及基板傳送機械手100所造成的基板150移動引發的慣性力,各個邊緣接觸墊210給予基板上的垂直(摩擦)力及徑向力。徑向力被引導朝向基板150中央以確保基板150保持靜止。為了確保基板上足夠強度的摩擦及徑向力,第一角度θ可介於約3度及5度之間。第一角度θ足夠小以確保存在被引導朝向基板中央的徑向力,同時保持足夠的摩擦力以
防止基板滑動。第一接觸表面302的水平長度可介於約4mm至約7mm之間,較佳約5.8mm。第二角度α較第一角度θ大,使得第二接觸表面304實質垂直。第二接觸表面304如同一緩衝器以免放置期間基板滑動。
邊緣接觸墊210耦合至端效器202的支撐構件204。在一些實施例中,可使用一個或更多個螺釘306以耦合邊緣接觸墊210至支撐構件204。螺釘306包含一穿孔,以確保抽空螺釘306及邊緣接觸墊210之間的任何空氣袋。在一些實施例中,可使用一個或更多個墊片308以控制支撐構件204上方的邊緣接觸墊210之高度,因此優勢地確保基板正確地對準所有邊緣接觸墊。
第4圖根據本揭示案的一些實施例描繪邊緣接觸墊210的透視視圖。第4圖中所描繪的邊緣接觸墊210與第3圖中所展示的邊緣接觸墊210相似,除了第4圖中的邊緣接觸墊210包含彎曲的第一接觸表面402及第二接觸表面404(相較於第3圖中展示的線性表面)。發明人發現:藉由提供彎曲的接觸表面,應用至基板的摩擦及徑向力依據基板位置而改變。如此,若基板滑動,作用於基板上的徑向力依據相對於邊緣接觸墊210的基板位置而增加或減少。例如,徑向力在基板處於較高角度時較高而在基板處於較低角度時較低。結果,限制或防止了特定方
向上基板的進一步滑動。第一及第二接觸表面402、404及水平平面之間的角度θ在第一接觸表面402的起始處由0度或接近0度改變至在第二接觸表面404的末端處之90度或接近90度。第一接觸表面402(例如,更小角度處且更徑向朝內的彎曲表面部分)功能如同用於放置於支撐表面上的基板之支撐表面,且第二接觸表面404(例如,更大角度處且更徑向朝外的彎曲表面部分)功能如同緩衝器以防止基板滑動。第一及第二接觸表面402、404形成一連續彎曲表面。選擇地,可使用彎曲及線性表面的組合而提供更小角度的角度以支撐基板及更大角度以防止若打滑時基板進一步的移動。
第5圖根據本揭示案的一些實施例描繪端效器500。端效器500包含耦合至端效器500的支撐構件502的背側接觸墊510,以藉由基板背側支撐基板,而非如上述相關於第2至4圖之邊緣。可使用背側接觸墊510如同第1圖中所描繪的接觸墊118。當基板傳送機械手升高基板150離開升降銷120時,基板150由速度0加速到傳送速度。該加速導致對應於接觸墊118的位置的接觸面積之一力F,如第6圖中所圖示。結果,背側接觸墊510及基板150之間的接觸面積處產生顆粒。
相似於邊緣接觸墊210,可使用螺釘506將背側接觸墊510耦合至端效器500的支撐構
件502。可排出螺釘506以便於排出螺釘及背側接觸墊510之間的任何空氣空隙。雖然未顯示,可使用相似於第3及4圖中所描繪的該等墊片以提高任何背側接觸墊510,以在基板150放置於上時確保基板150合適的整平。
因此,已於此揭露用於避免於基板上產生顆粒的改良之設備及材料。發明的設備可優勢地在製造處理期間(例如,在處理步驟之間處置基板期間及在處理腔室內部支撐基板時)允許累積於基板上之污染物的減低或防止,因而防止或減低污染物的發生率而免於達到基板前側且引發減低的裝置效能及/或良率損失。
前述係本揭示案之實施例,可修改本揭示案之其他及進一步的實施例而不遠離其基本範圍。
Claims (18)
- 一種用於支撐一基板的設備,包括:一支撐構件;及複數個基板接觸元件,該複數個基板接觸元件由該支撐構件突出,其中該複數個基板接觸元件之每一者包括:一第一接觸表面,在一基板放置於該第一接觸表面上時支撐該基板;及一第二接觸表面,該第二接觸表面由該第一接觸表面延伸;其中該第二接觸表面鄰近該基板的一周邊以防止該基板的徑向移動;其中該第一接觸表面相對於該支撐構件處於一第一角度,且該第二接觸表面相對於該支撐構件處於一第二角度;及其中該第一角度介於約3度及5度之間,其中該複數個基板接觸元件使用複數個螺釘耦合至該支撐構件,及其中該複數個螺釘之每一者包含一穿孔以抽空該複數個螺釘之每一者及該支撐構件之間的一空氣空隙。
- 如請求項1所述之設備,其中該第二角度較該第一角度大。
- 如請求項1所述之設備,其中該第一接 觸表面及該第二接觸表面形成一連續彎曲表面。
- 如請求項1所述之設備,其中該第一接觸表面經配置以應用摩擦及徑向力以防止該基板滑動。
- 如請求項1所述之設備,其中該第一接觸表面的一水平長度介於約4mm及7mm之間。
- 如請求項1所述之設備,其中該複數個基板接觸元件由以下之一者或更多者形成:氧化鋁、氮化矽、不鏽鋼、或一電性傳導塑膠。
- 一種用於支撐一基板的設備,包括:一支撐構件;複數個基板接觸元件,該複數個基板接觸元件由該支撐構件突出,其中該複數個基板接觸元件之每一者包括:一第一接觸表面,在一基板放置於該第一接觸表面上時支撐該基板;及一第二接觸表面,該第二接觸表面由該第一接觸表面延伸,其中該第二接觸表面鄰近該基板的一周邊以防止該基板的徑向移動,其中該第一接觸表面相對於該支撐構件處於一第一角度,且該第二接觸表面相對於該支撐構件處於一第二角度,且其中該第一角度介於約3度及5度之間;及 一個或更多個墊片,該一個或更多個墊片設置於該支撐構件及該複數個基板接觸元件之其中一者或多者之間。
- 如請求項7所述之設備,其中該複數個基板接觸元件使用複數個螺釘耦合至該支撐構件。
- 如請求項8所述之設備,其中該複數個螺釘之每一者包含一穿孔,以確保抽空該複數個螺釘之每一者及該支撐構件之間的一空氣空隙。
- 一種用於傳送一基板的基板傳送機械手,包括:一臂,該臂包含一葉片;複數個基板接觸元件,該複數個基板接觸元件由該葉片的一上方表面突出,其中該複數個基板接觸元件之每一者包括:一第一接觸表面,在一基板放置於該第一接觸表面上時支撐該基板;及一第二接觸表面,該第二接觸表面由該第一接觸表面延伸;其中該第二接觸表面鄰近該基板的一周邊以防止該基板的徑向移動;其中該第一接觸表面相對於該上方表面處於一第一角度,且該第二接觸表面相對於該上方表面處於一第二角度;及 其中該第一角度介於約3度及5度之間;及一個或更多個墊片,該一個或更多個墊片設置於該葉片的該上方表面及該複數個基板接觸元件之其中一者或多者之間。
- 如請求項10所述之基板傳送機械手,其中該第二角度較該第一角度大。
- 如請求項10所述之基板傳送機械手,其中該第一接觸表面及該第二接觸表面形成一連續彎曲表面。
- 如請求項10所述之基板傳送機械手,其中該第一接觸表面經配置以應用摩擦及徑向力以防止該基板滑動。
- 如請求項10所述之基板傳送機械手,其中該第一接觸表面的一水平長度介於約4mm及7mm之間。
- 如請求項10所述之基板傳送機械手,其中該複數個基板接觸元件使用複數個螺釘耦合至該葉片。
- 如請求項15所述之基板傳送機械手,其中該複數個螺釘之每一者包含一穿孔,以確保抽空該複數個螺釘之每一者及該葉片之間的一空氣空隙。
- 如請求項10所述之基板傳送機械手,其中該複數個基板接觸元件由以下之一者形成:氧化鋁、氮化矽、不鏽鋼、或一電性傳導塑膠。
- 如請求項10所述之基板傳送機械手,其中該葉片由一電性傳導摻鈦陶瓷形成。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462020769P | 2014-07-03 | 2014-07-03 | |
US62/020,769 | 2014-07-03 | ||
US14/476,224 | 2014-09-03 | ||
US14/476,224 US9425076B2 (en) | 2014-07-03 | 2014-09-03 | Substrate transfer robot end effector |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201608671A TW201608671A (zh) | 2016-03-01 |
TWI628738B true TWI628738B (zh) | 2018-07-01 |
Family
ID=55017516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104117843A TWI628738B (zh) | 2014-07-03 | 2015-06-02 | 基板傳送機械手端效器 |
Country Status (9)
Country | Link |
---|---|
US (1) | US9425076B2 (zh) |
EP (1) | EP3164883A4 (zh) |
JP (2) | JP2017522738A (zh) |
KR (1) | KR102509442B1 (zh) |
CN (2) | CN109727900B (zh) |
IL (1) | IL249505A0 (zh) |
SG (1) | SG11201610314UA (zh) |
TW (1) | TWI628738B (zh) |
WO (1) | WO2016003598A1 (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10312127B2 (en) | 2013-09-16 | 2019-06-04 | Applied Materials, Inc. | Compliant robot blade for defect reduction |
US9536329B2 (en) * | 2014-05-30 | 2017-01-03 | Adobe Systems Incorporated | Method and apparatus for performing sentiment analysis based on user reactions to displayable content |
JP6276317B2 (ja) * | 2016-03-31 | 2018-02-07 | 平田機工株式会社 | ハンドユニットおよび移載方法 |
US10090188B2 (en) * | 2016-05-05 | 2018-10-02 | Applied Materials, Inc. | Robot subassemblies, end effector assemblies, and methods with reduced cracking |
JP6757646B2 (ja) * | 2016-10-27 | 2020-09-23 | 川崎重工業株式会社 | 基板把持ハンド及びそれを備える基板搬送装置 |
US10781056B2 (en) | 2016-12-22 | 2020-09-22 | General Electric Company | Adaptive apparatus and system for automated handling of components |
US10773902B2 (en) | 2016-12-22 | 2020-09-15 | General Electric Company | Adaptive apparatus and system for automated handling of components |
USD822735S1 (en) * | 2017-03-17 | 2018-07-10 | Donald Dimattia, Jr. | Positionable end effector link |
US10399231B2 (en) | 2017-05-22 | 2019-09-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Substrate handling contacts and methods |
US11648738B2 (en) | 2018-10-15 | 2023-05-16 | General Electric Company | Systems and methods of automated film removal |
US11600580B2 (en) | 2019-02-27 | 2023-03-07 | Applied Materials, Inc. | Replaceable end effector contact pads, end effectors, and maintenance methods |
JP7415782B2 (ja) * | 2020-05-11 | 2024-01-17 | 東京エレクトロン株式会社 | 基板搬送機構及び基板搬送方法 |
US20220063113A1 (en) * | 2020-08-26 | 2022-03-03 | WaferPath, Inc. | Protective cap for a robot end effector |
CN112060116B (zh) * | 2020-09-02 | 2021-08-24 | 深圳市大族富创得科技有限公司 | 一种搬运机器人 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5985033A (en) * | 1997-07-11 | 1999-11-16 | Applied Materials, Inc. | Apparatus and method for delivering a gas |
US6537011B1 (en) * | 2000-03-10 | 2003-03-25 | Applied Materials, Inc. | Method and apparatus for transferring and supporting a substrate |
JP2004266202A (ja) * | 2003-03-04 | 2004-09-24 | Daihen Corp | ワークピースの保持機構 |
US20080267747A1 (en) * | 2007-04-27 | 2008-10-30 | Brooks Automation, Inc. | Inertial wafer centering end effector and transport apparatus |
US20090110520A1 (en) * | 2007-10-31 | 2009-04-30 | Dinesh Kanawade | Advanced fi blade for high temperature extraction |
US20100178137A1 (en) * | 2009-01-11 | 2010-07-15 | Applied Materials, Inc. | Systems, apparatus and methods for moving substrates |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4558984A (en) * | 1984-05-18 | 1985-12-17 | Varian Associates, Inc. | Wafer lifting and holding apparatus |
JPH0189455U (zh) * | 1987-12-04 | 1989-06-13 | ||
JPH06151195A (ja) | 1992-11-06 | 1994-05-31 | Meidensha Corp | 変圧器 |
US6322119B1 (en) * | 1999-07-09 | 2001-11-27 | Semitool, Inc. | Robots for microelectronic workpiece handling |
JPH10144758A (ja) * | 1996-11-11 | 1998-05-29 | Kokusai Electric Co Ltd | 基板搬送用プレート |
JPH10181878A (ja) * | 1996-12-26 | 1998-07-07 | Canon Inc | 基板搬送用フィンガ |
US5955858A (en) * | 1997-02-14 | 1999-09-21 | Applied Materials, Inc. | Mechanically clamping robot wrist |
DE29708315U1 (de) * | 1997-05-09 | 1997-07-10 | Leybold Systems GmbH, 63450 Hanau | Vorrichtung für den Transport von scheibenförmigen Substraten in einer Vakuumbeschichtungsanlage oder für deren Magazinierung |
US6722834B1 (en) * | 1997-10-08 | 2004-04-20 | Applied Materials, Inc. | Robot blade with dual offset wafer supports |
TW543079B (en) | 1999-06-03 | 2003-07-21 | Applied Materials Inc | Robot blade for semiconductor processing equipment |
JP2003065311A (ja) * | 2001-08-24 | 2003-03-05 | Nitto Seiko Co Ltd | 流体排出用ねじ部品 |
JP3962609B2 (ja) * | 2002-03-05 | 2007-08-22 | 東京エレクトロン株式会社 | 搬送装置 |
US7048316B1 (en) * | 2002-07-12 | 2006-05-23 | Novellus Systems, Inc. | Compound angled pad end-effector |
US7641247B2 (en) * | 2002-12-17 | 2010-01-05 | Applied Materials, Inc. | End effector assembly for supporting a substrate |
JP4275420B2 (ja) * | 2003-01-28 | 2009-06-10 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
US7654596B2 (en) * | 2003-06-27 | 2010-02-02 | Mattson Technology, Inc. | Endeffectors for handling semiconductor wafers |
KR100679269B1 (ko) * | 2006-01-04 | 2007-02-06 | 삼성전자주식회사 | 멀티 챔버형 반도체 제조 장치 |
JP2008108991A (ja) * | 2006-10-27 | 2008-05-08 | Daihen Corp | ワーク保持機構 |
WO2008136832A1 (en) * | 2007-05-07 | 2008-11-13 | Symyx Technologies, Inc. | Apparatus and method for moving a substrate |
US7669903B2 (en) * | 2007-10-11 | 2010-03-02 | Crossing Automation, Inc. | Ultra low contact area end effector |
US8141926B2 (en) * | 2008-02-06 | 2012-03-27 | Ulvac, Inc. | Robot hand for substrate transfer |
JP2010239023A (ja) | 2009-03-31 | 2010-10-21 | Tokyo Electron Ltd | 基板搬送装置及び基板処理装置 |
WO2013088733A1 (ja) * | 2011-12-14 | 2013-06-20 | 株式会社ニコン | 基板ホルダ及び一対の基板ホルダ |
US10431489B2 (en) | 2013-12-17 | 2019-10-01 | Applied Materials, Inc. | Substrate support apparatus having reduced substrate particle generation |
-
2014
- 2014-09-03 US US14/476,224 patent/US9425076B2/en active Active
-
2015
- 2015-06-02 TW TW104117843A patent/TWI628738B/zh active
- 2015-06-05 EP EP15815072.2A patent/EP3164883A4/en not_active Withdrawn
- 2015-06-05 WO PCT/US2015/034333 patent/WO2016003598A1/en active Application Filing
- 2015-06-05 CN CN201811152281.7A patent/CN109727900B/zh active Active
- 2015-06-05 JP JP2017521054A patent/JP2017522738A/ja active Pending
- 2015-06-05 CN CN201580036350.6A patent/CN106489194B/zh active Active
- 2015-06-05 SG SG11201610314UA patent/SG11201610314UA/en unknown
- 2015-06-05 KR KR1020177002989A patent/KR102509442B1/ko active IP Right Grant
-
2016
- 2016-12-12 IL IL249505A patent/IL249505A0/en unknown
-
2020
- 2020-11-30 JP JP2020198010A patent/JP7169334B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5985033A (en) * | 1997-07-11 | 1999-11-16 | Applied Materials, Inc. | Apparatus and method for delivering a gas |
US6537011B1 (en) * | 2000-03-10 | 2003-03-25 | Applied Materials, Inc. | Method and apparatus for transferring and supporting a substrate |
JP2004266202A (ja) * | 2003-03-04 | 2004-09-24 | Daihen Corp | ワークピースの保持機構 |
US20080267747A1 (en) * | 2007-04-27 | 2008-10-30 | Brooks Automation, Inc. | Inertial wafer centering end effector and transport apparatus |
US20090110520A1 (en) * | 2007-10-31 | 2009-04-30 | Dinesh Kanawade | Advanced fi blade for high temperature extraction |
US20100178137A1 (en) * | 2009-01-11 | 2010-07-15 | Applied Materials, Inc. | Systems, apparatus and methods for moving substrates |
Also Published As
Publication number | Publication date |
---|---|
CN106489194B (zh) | 2020-12-04 |
JP7169334B2 (ja) | 2022-11-10 |
SG11201610314UA (en) | 2017-01-27 |
JP2021048406A (ja) | 2021-03-25 |
KR20170026595A (ko) | 2017-03-08 |
CN109727900A (zh) | 2019-05-07 |
IL249505A0 (en) | 2017-02-28 |
EP3164883A4 (en) | 2018-08-01 |
WO2016003598A1 (en) | 2016-01-07 |
EP3164883A1 (en) | 2017-05-10 |
KR102509442B1 (ko) | 2023-03-10 |
US9425076B2 (en) | 2016-08-23 |
CN109727900B (zh) | 2023-05-09 |
JP2017522738A (ja) | 2017-08-10 |
US20160005638A1 (en) | 2016-01-07 |
TW201608671A (zh) | 2016-03-01 |
CN106489194A (zh) | 2017-03-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI628738B (zh) | 基板傳送機械手端效器 | |
EP3084818B1 (en) | Substrate support apparatus having reduced substrate particle generation | |
TWI778133B (zh) | 用於半導體製程模組的原位設備 | |
JP5574553B2 (ja) | 基板搬送装置及び保持装置 | |
TW201522186A (zh) | 晶圓處理系統及處理晶圓之方法 | |
US20230238268A1 (en) | Simultaneous bonding approach for high quality wafer stacking applications | |
JP5146056B2 (ja) | 半導体装置の製造方法および半導体装置の支持装置 | |
JP2014203967A (ja) | チャックテーブル | |
JP7268208B2 (ja) | ウェハ用の基板処理装置 | |
KR101553826B1 (ko) | 이송장치 및 이를 이용한 웨이퍼 이송방법 | |
TW202209595A (zh) | 晶片固定機構及使用該晶片固定機構的晶片預清潔機台 | |
TWI646573B (zh) | 聚焦環和電漿處理裝置 | |
KR102706773B1 (ko) | 반도체 웨이퍼 이송용 로봇암 블레이드에 탈부착되는 이중접합에 의한 미끄럼 방지 패드 | |
KR20170076161A (ko) | 기판 처리장치용 리프팅 핀 조립체 및 이를 갖는 기판 처리장치 | |
JP7316033B2 (ja) | 基板搬送装置および基板搬送方法 | |
KR20070015771A (ko) | 웨이퍼 슬라이딩을 방지하기 위한 웨이퍼 이송장치 |