CN106489194B - 基板传送机械手终端受动器 - Google Patents

基板传送机械手终端受动器 Download PDF

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Publication number
CN106489194B
CN106489194B CN201580036350.6A CN201580036350A CN106489194B CN 106489194 B CN106489194 B CN 106489194B CN 201580036350 A CN201580036350 A CN 201580036350A CN 106489194 B CN106489194 B CN 106489194B
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China
Prior art keywords
substrate
contact surface
contact
support member
angle
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CN201580036350.6A
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English (en)
Chinese (zh)
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CN106489194A (zh
Inventor
普及特·阿咖瓦
丹尼尔·格林伯格
徐松文
杰弗里·布罗丁
史蒂芬·V·桑索尼
格伦·莫里
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Applied Materials Inc
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Applied Materials Inc
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Priority to CN201811152281.7A priority Critical patent/CN109727900B/zh
Publication of CN106489194A publication Critical patent/CN106489194A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN201580036350.6A 2014-07-03 2015-06-05 基板传送机械手终端受动器 Active CN106489194B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811152281.7A CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462020769P 2014-07-03 2014-07-03
US62/020,769 2014-07-03
US14/476,224 US9425076B2 (en) 2014-07-03 2014-09-03 Substrate transfer robot end effector
US14/476,224 2014-09-03
PCT/US2015/034333 WO2016003598A1 (en) 2014-07-03 2015-06-05 Substrate transfer robot end effector

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201811152281.7A Division CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Publications (2)

Publication Number Publication Date
CN106489194A CN106489194A (zh) 2017-03-08
CN106489194B true CN106489194B (zh) 2020-12-04

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN201580036350.6A Active CN106489194B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器
CN201811152281.7A Active CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201811152281.7A Active CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Country Status (9)

Country Link
US (1) US9425076B2 (enExample)
EP (1) EP3164883A4 (enExample)
JP (2) JP2017522738A (enExample)
KR (1) KR102509442B1 (enExample)
CN (2) CN106489194B (enExample)
IL (1) IL249505A0 (enExample)
SG (1) SG11201610314UA (enExample)
TW (1) TWI628738B (enExample)
WO (1) WO2016003598A1 (enExample)

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US10312127B2 (en) 2013-09-16 2019-06-04 Applied Materials, Inc. Compliant robot blade for defect reduction
US9536329B2 (en) * 2014-05-30 2017-01-03 Adobe Systems Incorporated Method and apparatus for performing sentiment analysis based on user reactions to displayable content
JP6276317B2 (ja) * 2016-03-31 2018-02-07 平田機工株式会社 ハンドユニットおよび移載方法
US10090188B2 (en) * 2016-05-05 2018-10-02 Applied Materials, Inc. Robot subassemblies, end effector assemblies, and methods with reduced cracking
JP6757646B2 (ja) * 2016-10-27 2020-09-23 川崎重工業株式会社 基板把持ハンド及びそれを備える基板搬送装置
US10781056B2 (en) 2016-12-22 2020-09-22 General Electric Company Adaptive apparatus and system for automated handling of components
US10773902B2 (en) 2016-12-22 2020-09-15 General Electric Company Adaptive apparatus and system for automated handling of components
USD822735S1 (en) * 2017-03-17 2018-07-10 Donald Dimattia, Jr. Positionable end effector link
US10399231B2 (en) 2017-05-22 2019-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate handling contacts and methods
WO2020081348A1 (en) 2018-10-15 2020-04-23 General Electric Company Systems and methods of automated film removal
US11600580B2 (en) 2019-02-27 2023-03-07 Applied Materials, Inc. Replaceable end effector contact pads, end effectors, and maintenance methods
JP7415782B2 (ja) * 2020-05-11 2024-01-17 東京エレクトロン株式会社 基板搬送機構及び基板搬送方法
US20220063113A1 (en) * 2020-08-26 2022-03-03 WaferPath, Inc. Protective cap for a robot end effector
CN112060116B (zh) * 2020-09-02 2021-08-24 深圳市大族富创得科技有限公司 一种搬运机器人
JP7580333B2 (ja) * 2021-05-12 2024-11-11 三菱電機株式会社 ウエハハンド、半導体製造装置、および半導体装置の製造方法

Citations (6)

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EP1063683A2 (en) * 1999-06-03 2000-12-27 Applied Materials, Inc. Robot blade for semiconductor processing equipment
US20040113444A1 (en) * 2002-12-17 2004-06-17 Blonigan Wendell T. End effector assembly
JP2004235234A (ja) * 2003-01-28 2004-08-19 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2004266202A (ja) * 2003-03-04 2004-09-24 Daihen Corp ワークピースの保持機構
US7048316B1 (en) * 2002-07-12 2006-05-23 Novellus Systems, Inc. Compound angled pad end-effector
US20120049555A1 (en) * 2008-02-06 2012-03-01 Yoshinori Fujii Robot hand for substrate transfer

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US5985033A (en) * 1997-07-11 1999-11-16 Applied Materials, Inc. Apparatus and method for delivering a gas
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EP1063683A2 (en) * 1999-06-03 2000-12-27 Applied Materials, Inc. Robot blade for semiconductor processing equipment
US7048316B1 (en) * 2002-07-12 2006-05-23 Novellus Systems, Inc. Compound angled pad end-effector
US20040113444A1 (en) * 2002-12-17 2004-06-17 Blonigan Wendell T. End effector assembly
JP2004235234A (ja) * 2003-01-28 2004-08-19 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2004266202A (ja) * 2003-03-04 2004-09-24 Daihen Corp ワークピースの保持機構
US20120049555A1 (en) * 2008-02-06 2012-03-01 Yoshinori Fujii Robot hand for substrate transfer

Also Published As

Publication number Publication date
JP7169334B2 (ja) 2022-11-10
TWI628738B (zh) 2018-07-01
US9425076B2 (en) 2016-08-23
CN109727900A (zh) 2019-05-07
US20160005638A1 (en) 2016-01-07
WO2016003598A1 (en) 2016-01-07
CN109727900B (zh) 2023-05-09
EP3164883A1 (en) 2017-05-10
SG11201610314UA (en) 2017-01-27
KR20170026595A (ko) 2017-03-08
JP2021048406A (ja) 2021-03-25
KR102509442B1 (ko) 2023-03-10
CN106489194A (zh) 2017-03-08
JP2017522738A (ja) 2017-08-10
EP3164883A4 (en) 2018-08-01
TW201608671A (zh) 2016-03-01
IL249505A0 (en) 2017-02-28

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