TWI628738B - 基板傳送機械手端效器 - Google Patents
基板傳送機械手端效器 Download PDFInfo
- Publication number
- TWI628738B TWI628738B TW104117843A TW104117843A TWI628738B TW I628738 B TWI628738 B TW I628738B TW 104117843 A TW104117843 A TW 104117843A TW 104117843 A TW104117843 A TW 104117843A TW I628738 B TWI628738 B TW I628738B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- contact surface
- contact
- support member
- angle
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 176
- 239000012636 effector Substances 0.000 title description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 8
- 239000000356 contaminant Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 210000000707 wrist Anatomy 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462020769P | 2014-07-03 | 2014-07-03 | |
| US62/020,769 | 2014-07-03 | ||
| US14/476,224 | 2014-09-03 | ||
| US14/476,224 US9425076B2 (en) | 2014-07-03 | 2014-09-03 | Substrate transfer robot end effector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201608671A TW201608671A (zh) | 2016-03-01 |
| TWI628738B true TWI628738B (zh) | 2018-07-01 |
Family
ID=55017516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104117843A TWI628738B (zh) | 2014-07-03 | 2015-06-02 | 基板傳送機械手端效器 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9425076B2 (enExample) |
| EP (1) | EP3164883A4 (enExample) |
| JP (2) | JP2017522738A (enExample) |
| KR (1) | KR102509442B1 (enExample) |
| CN (2) | CN106489194B (enExample) |
| IL (1) | IL249505A0 (enExample) |
| SG (1) | SG11201610314UA (enExample) |
| TW (1) | TWI628738B (enExample) |
| WO (1) | WO2016003598A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10312127B2 (en) | 2013-09-16 | 2019-06-04 | Applied Materials, Inc. | Compliant robot blade for defect reduction |
| US9536329B2 (en) * | 2014-05-30 | 2017-01-03 | Adobe Systems Incorporated | Method and apparatus for performing sentiment analysis based on user reactions to displayable content |
| JP6276317B2 (ja) * | 2016-03-31 | 2018-02-07 | 平田機工株式会社 | ハンドユニットおよび移載方法 |
| US10090188B2 (en) * | 2016-05-05 | 2018-10-02 | Applied Materials, Inc. | Robot subassemblies, end effector assemblies, and methods with reduced cracking |
| JP6757646B2 (ja) * | 2016-10-27 | 2020-09-23 | 川崎重工業株式会社 | 基板把持ハンド及びそれを備える基板搬送装置 |
| US10781056B2 (en) | 2016-12-22 | 2020-09-22 | General Electric Company | Adaptive apparatus and system for automated handling of components |
| US10773902B2 (en) | 2016-12-22 | 2020-09-15 | General Electric Company | Adaptive apparatus and system for automated handling of components |
| USD822735S1 (en) * | 2017-03-17 | 2018-07-10 | Donald Dimattia, Jr. | Positionable end effector link |
| US10399231B2 (en) * | 2017-05-22 | 2019-09-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Substrate handling contacts and methods |
| US11648738B2 (en) | 2018-10-15 | 2023-05-16 | General Electric Company | Systems and methods of automated film removal |
| US11600580B2 (en) | 2019-02-27 | 2023-03-07 | Applied Materials, Inc. | Replaceable end effector contact pads, end effectors, and maintenance methods |
| JP7415782B2 (ja) * | 2020-05-11 | 2024-01-17 | 東京エレクトロン株式会社 | 基板搬送機構及び基板搬送方法 |
| US20220063113A1 (en) * | 2020-08-26 | 2022-03-03 | WaferPath, Inc. | Protective cap for a robot end effector |
| CN112060116B (zh) * | 2020-09-02 | 2021-08-24 | 深圳市大族富创得科技有限公司 | 一种搬运机器人 |
| JP7580333B2 (ja) * | 2021-05-12 | 2024-11-11 | 三菱電機株式会社 | ウエハハンド、半導体製造装置、および半導体装置の製造方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985033A (en) * | 1997-07-11 | 1999-11-16 | Applied Materials, Inc. | Apparatus and method for delivering a gas |
| US6537011B1 (en) * | 2000-03-10 | 2003-03-25 | Applied Materials, Inc. | Method and apparatus for transferring and supporting a substrate |
| JP2004266202A (ja) * | 2003-03-04 | 2004-09-24 | Daihen Corp | ワークピースの保持機構 |
| US20080267747A1 (en) * | 2007-04-27 | 2008-10-30 | Brooks Automation, Inc. | Inertial wafer centering end effector and transport apparatus |
| US20090110520A1 (en) * | 2007-10-31 | 2009-04-30 | Dinesh Kanawade | Advanced fi blade for high temperature extraction |
| US20100178137A1 (en) * | 2009-01-11 | 2010-07-15 | Applied Materials, Inc. | Systems, apparatus and methods for moving substrates |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4558984A (en) * | 1984-05-18 | 1985-12-17 | Varian Associates, Inc. | Wafer lifting and holding apparatus |
| JPH0189455U (enExample) * | 1987-12-04 | 1989-06-13 | ||
| JPH06151195A (ja) | 1992-11-06 | 1994-05-31 | Meidensha Corp | 変圧器 |
| US6322119B1 (en) * | 1999-07-09 | 2001-11-27 | Semitool, Inc. | Robots for microelectronic workpiece handling |
| JPH10144758A (ja) * | 1996-11-11 | 1998-05-29 | Kokusai Electric Co Ltd | 基板搬送用プレート |
| JPH10181878A (ja) * | 1996-12-26 | 1998-07-07 | Canon Inc | 基板搬送用フィンガ |
| US5955858A (en) * | 1997-02-14 | 1999-09-21 | Applied Materials, Inc. | Mechanically clamping robot wrist |
| DE29708315U1 (de) * | 1997-05-09 | 1997-07-10 | Leybold Systems GmbH, 63450 Hanau | Vorrichtung für den Transport von scheibenförmigen Substraten in einer Vakuumbeschichtungsanlage oder für deren Magazinierung |
| US6722834B1 (en) * | 1997-10-08 | 2004-04-20 | Applied Materials, Inc. | Robot blade with dual offset wafer supports |
| TW543079B (en) * | 1999-06-03 | 2003-07-21 | Applied Materials Inc | Robot blade for semiconductor processing equipment |
| JP2003065311A (ja) * | 2001-08-24 | 2003-03-05 | Nitto Seiko Co Ltd | 流体排出用ねじ部品 |
| JP3962609B2 (ja) * | 2002-03-05 | 2007-08-22 | 東京エレクトロン株式会社 | 搬送装置 |
| US7048316B1 (en) * | 2002-07-12 | 2006-05-23 | Novellus Systems, Inc. | Compound angled pad end-effector |
| US7641247B2 (en) * | 2002-12-17 | 2010-01-05 | Applied Materials, Inc. | End effector assembly for supporting a substrate |
| JP4275420B2 (ja) * | 2003-01-28 | 2009-06-10 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| US7654596B2 (en) * | 2003-06-27 | 2010-02-02 | Mattson Technology, Inc. | Endeffectors for handling semiconductor wafers |
| KR100679269B1 (ko) * | 2006-01-04 | 2007-02-06 | 삼성전자주식회사 | 멀티 챔버형 반도체 제조 장치 |
| JP2008108991A (ja) * | 2006-10-27 | 2008-05-08 | Daihen Corp | ワーク保持機構 |
| DE112007003490T5 (de) * | 2007-05-07 | 2010-04-15 | Symyx Solutions, Inc., Santa Clara | Vorrichtung und Verfahren zum Bewegen eines Substrats |
| US7669903B2 (en) * | 2007-10-11 | 2010-03-02 | Crossing Automation, Inc. | Ultra low contact area end effector |
| WO2009099107A1 (ja) * | 2008-02-06 | 2009-08-13 | Ulvac, Inc. | 基板搬送用のロボットハンド |
| JP2010239023A (ja) | 2009-03-31 | 2010-10-21 | Tokyo Electron Ltd | 基板搬送装置及び基板処理装置 |
| TWI616975B (zh) * | 2011-12-14 | 2018-03-01 | Nikon Corp | Substrate holder and substrate bonding device |
| US10431489B2 (en) | 2013-12-17 | 2019-10-01 | Applied Materials, Inc. | Substrate support apparatus having reduced substrate particle generation |
-
2014
- 2014-09-03 US US14/476,224 patent/US9425076B2/en active Active
-
2015
- 2015-06-02 TW TW104117843A patent/TWI628738B/zh active
- 2015-06-05 CN CN201580036350.6A patent/CN106489194B/zh active Active
- 2015-06-05 JP JP2017521054A patent/JP2017522738A/ja active Pending
- 2015-06-05 KR KR1020177002989A patent/KR102509442B1/ko active Active
- 2015-06-05 CN CN201811152281.7A patent/CN109727900B/zh active Active
- 2015-06-05 EP EP15815072.2A patent/EP3164883A4/en not_active Withdrawn
- 2015-06-05 WO PCT/US2015/034333 patent/WO2016003598A1/en not_active Ceased
- 2015-06-05 SG SG11201610314UA patent/SG11201610314UA/en unknown
-
2016
- 2016-12-12 IL IL249505A patent/IL249505A0/en unknown
-
2020
- 2020-11-30 JP JP2020198010A patent/JP7169334B2/ja active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985033A (en) * | 1997-07-11 | 1999-11-16 | Applied Materials, Inc. | Apparatus and method for delivering a gas |
| US6537011B1 (en) * | 2000-03-10 | 2003-03-25 | Applied Materials, Inc. | Method and apparatus for transferring and supporting a substrate |
| JP2004266202A (ja) * | 2003-03-04 | 2004-09-24 | Daihen Corp | ワークピースの保持機構 |
| US20080267747A1 (en) * | 2007-04-27 | 2008-10-30 | Brooks Automation, Inc. | Inertial wafer centering end effector and transport apparatus |
| US20090110520A1 (en) * | 2007-10-31 | 2009-04-30 | Dinesh Kanawade | Advanced fi blade for high temperature extraction |
| US20100178137A1 (en) * | 2009-01-11 | 2010-07-15 | Applied Materials, Inc. | Systems, apparatus and methods for moving substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016003598A1 (en) | 2016-01-07 |
| JP2017522738A (ja) | 2017-08-10 |
| KR102509442B1 (ko) | 2023-03-10 |
| CN106489194A (zh) | 2017-03-08 |
| CN109727900B (zh) | 2023-05-09 |
| CN106489194B (zh) | 2020-12-04 |
| CN109727900A (zh) | 2019-05-07 |
| US20160005638A1 (en) | 2016-01-07 |
| TW201608671A (zh) | 2016-03-01 |
| KR20170026595A (ko) | 2017-03-08 |
| JP7169334B2 (ja) | 2022-11-10 |
| EP3164883A4 (en) | 2018-08-01 |
| JP2021048406A (ja) | 2021-03-25 |
| US9425076B2 (en) | 2016-08-23 |
| SG11201610314UA (en) | 2017-01-27 |
| EP3164883A1 (en) | 2017-05-10 |
| IL249505A0 (en) | 2017-02-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI628738B (zh) | 基板傳送機械手端效器 | |
| US10431489B2 (en) | Substrate support apparatus having reduced substrate particle generation | |
| JP5574553B2 (ja) | 基板搬送装置及び保持装置 | |
| CN102341901B (zh) | 用于移动基板的系统、设备与方法 | |
| CN110050336A (zh) | 用于制造半导体装置的晶片边缘提升销设计 | |
| CN104690641A (zh) | 用于弯曲晶圆的传送模块 | |
| US20250118587A1 (en) | Simultaneous bonding approach for high quality wafer stacking applications | |
| JP7268208B2 (ja) | ウェハ用の基板処理装置 | |
| CN107210253A (zh) | 基板移载系统 | |
| JP2018046032A (ja) | ウエーハ保持装置 | |
| TWI646573B (zh) | 聚焦環和電漿處理裝置 | |
| TW202209595A (zh) | 晶片固定機構及使用該晶片固定機構的晶片預清潔機台 | |
| KR20170076161A (ko) | 기판 처리장치용 리프팅 핀 조립체 및 이를 갖는 기판 처리장치 | |
| KR20240134808A (ko) | 슬립 방지 구조의 웨이퍼 블록 | |
| KR20070015771A (ko) | 웨이퍼 슬라이딩을 방지하기 위한 웨이퍼 이송장치 |