KR102509442B1 - 기판 이송 로봇 엔드 이펙터 - Google Patents

기판 이송 로봇 엔드 이펙터 Download PDF

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Publication number
KR102509442B1
KR102509442B1 KR1020177002989A KR20177002989A KR102509442B1 KR 102509442 B1 KR102509442 B1 KR 102509442B1 KR 1020177002989 A KR1020177002989 A KR 1020177002989A KR 20177002989 A KR20177002989 A KR 20177002989A KR 102509442 B1 KR102509442 B1 KR 102509442B1
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South Korea
Prior art keywords
substrate
contact surface
supporting
contact
support member
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KR1020177002989A
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English (en)
Korean (ko)
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KR20170026595A (ko
Inventor
풀킷 아가르왈
다니엘 그린버그
송-문 수
제프리 브로딘
스티븐 브이. 샌소니
글렌 모리
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어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20170026595A publication Critical patent/KR20170026595A/ko
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    • H01L21/67766—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H01L21/67742—
    • H01L21/67787—
    • H01L21/67796—
    • H01L21/6835—
    • H01L21/68707—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • H10P72/3602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/38—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
KR1020177002989A 2014-07-03 2015-06-05 기판 이송 로봇 엔드 이펙터 Active KR102509442B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462020769P 2014-07-03 2014-07-03
US62/020,769 2014-07-03
US14/476,224 2014-09-03
US14/476,224 US9425076B2 (en) 2014-07-03 2014-09-03 Substrate transfer robot end effector
PCT/US2015/034333 WO2016003598A1 (en) 2014-07-03 2015-06-05 Substrate transfer robot end effector

Publications (2)

Publication Number Publication Date
KR20170026595A KR20170026595A (ko) 2017-03-08
KR102509442B1 true KR102509442B1 (ko) 2023-03-10

Family

ID=55017516

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177002989A Active KR102509442B1 (ko) 2014-07-03 2015-06-05 기판 이송 로봇 엔드 이펙터

Country Status (9)

Country Link
US (1) US9425076B2 (enExample)
EP (1) EP3164883A4 (enExample)
JP (2) JP2017522738A (enExample)
KR (1) KR102509442B1 (enExample)
CN (2) CN109727900B (enExample)
IL (1) IL249505A0 (enExample)
SG (1) SG11201610314UA (enExample)
TW (1) TWI628738B (enExample)
WO (1) WO2016003598A1 (enExample)

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US10312127B2 (en) 2013-09-16 2019-06-04 Applied Materials, Inc. Compliant robot blade for defect reduction
US9536329B2 (en) * 2014-05-30 2017-01-03 Adobe Systems Incorporated Method and apparatus for performing sentiment analysis based on user reactions to displayable content
JP6276317B2 (ja) * 2016-03-31 2018-02-07 平田機工株式会社 ハンドユニットおよび移載方法
US10090188B2 (en) * 2016-05-05 2018-10-02 Applied Materials, Inc. Robot subassemblies, end effector assemblies, and methods with reduced cracking
JP6757646B2 (ja) * 2016-10-27 2020-09-23 川崎重工業株式会社 基板把持ハンド及びそれを備える基板搬送装置
US10781056B2 (en) 2016-12-22 2020-09-22 General Electric Company Adaptive apparatus and system for automated handling of components
US10773902B2 (en) 2016-12-22 2020-09-15 General Electric Company Adaptive apparatus and system for automated handling of components
USD822735S1 (en) * 2017-03-17 2018-07-10 Donald Dimattia, Jr. Positionable end effector link
US10399231B2 (en) 2017-05-22 2019-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate handling contacts and methods
WO2020081348A1 (en) 2018-10-15 2020-04-23 General Electric Company Systems and methods of automated film removal
US11600580B2 (en) 2019-02-27 2023-03-07 Applied Materials, Inc. Replaceable end effector contact pads, end effectors, and maintenance methods
JP7415782B2 (ja) * 2020-05-11 2024-01-17 東京エレクトロン株式会社 基板搬送機構及び基板搬送方法
US20220063113A1 (en) * 2020-08-26 2022-03-03 WaferPath, Inc. Protective cap for a robot end effector
CN112060116B (zh) * 2020-09-02 2021-08-24 深圳市大族富创得科技有限公司 一种搬运机器人
JP7580333B2 (ja) * 2021-05-12 2024-11-11 三菱電機株式会社 ウエハハンド、半導体製造装置、および半導体装置の製造方法

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JP2003258076A (ja) * 2002-03-05 2003-09-12 Tokyo Electron Ltd 搬送装置
JP2010239023A (ja) * 2009-03-31 2010-10-21 Tokyo Electron Ltd 基板搬送装置及び基板処理装置

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JPH0189455U (enExample) * 1987-12-04 1989-06-13
JPH06151195A (ja) 1992-11-06 1994-05-31 Meidensha Corp 変圧器
US6322119B1 (en) * 1999-07-09 2001-11-27 Semitool, Inc. Robots for microelectronic workpiece handling
JPH10144758A (ja) * 1996-11-11 1998-05-29 Kokusai Electric Co Ltd 基板搬送用プレート
JPH10181878A (ja) * 1996-12-26 1998-07-07 Canon Inc 基板搬送用フィンガ
US5955858A (en) * 1997-02-14 1999-09-21 Applied Materials, Inc. Mechanically clamping robot wrist
DE29708315U1 (de) * 1997-05-09 1997-07-10 Leybold Systems GmbH, 63450 Hanau Vorrichtung für den Transport von scheibenförmigen Substraten in einer Vakuumbeschichtungsanlage oder für deren Magazinierung
US5985033A (en) * 1997-07-11 1999-11-16 Applied Materials, Inc. Apparatus and method for delivering a gas
US6722834B1 (en) * 1997-10-08 2004-04-20 Applied Materials, Inc. Robot blade with dual offset wafer supports
TW543079B (en) * 1999-06-03 2003-07-21 Applied Materials Inc Robot blade for semiconductor processing equipment
US6537011B1 (en) * 2000-03-10 2003-03-25 Applied Materials, Inc. Method and apparatus for transferring and supporting a substrate
JP2003065311A (ja) * 2001-08-24 2003-03-05 Nitto Seiko Co Ltd 流体排出用ねじ部品
US7048316B1 (en) * 2002-07-12 2006-05-23 Novellus Systems, Inc. Compound angled pad end-effector
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JP4275420B2 (ja) * 2003-01-28 2009-06-10 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
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US7654596B2 (en) * 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
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CN102341901B (zh) * 2009-01-11 2013-11-06 应用材料公司 用于移动基板的系统、设备与方法
WO2013088733A1 (ja) * 2011-12-14 2013-06-20 株式会社ニコン 基板ホルダ及び一対の基板ホルダ
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JP2003258076A (ja) * 2002-03-05 2003-09-12 Tokyo Electron Ltd 搬送装置
JP2010239023A (ja) * 2009-03-31 2010-10-21 Tokyo Electron Ltd 基板搬送装置及び基板処理装置

Also Published As

Publication number Publication date
WO2016003598A1 (en) 2016-01-07
TW201608671A (zh) 2016-03-01
JP2017522738A (ja) 2017-08-10
IL249505A0 (en) 2017-02-28
CN109727900B (zh) 2023-05-09
JP7169334B2 (ja) 2022-11-10
US9425076B2 (en) 2016-08-23
KR20170026595A (ko) 2017-03-08
EP3164883A4 (en) 2018-08-01
CN109727900A (zh) 2019-05-07
US20160005638A1 (en) 2016-01-07
JP2021048406A (ja) 2021-03-25
TWI628738B (zh) 2018-07-01
SG11201610314UA (en) 2017-01-27
EP3164883A1 (en) 2017-05-10
CN106489194B (zh) 2020-12-04
CN106489194A (zh) 2017-03-08

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