CN109727900B - 基板传送机械手终端受动器 - Google Patents

基板传送机械手终端受动器 Download PDF

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Publication number
CN109727900B
CN109727900B CN201811152281.7A CN201811152281A CN109727900B CN 109727900 B CN109727900 B CN 109727900B CN 201811152281 A CN201811152281 A CN 201811152281A CN 109727900 B CN109727900 B CN 109727900B
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China
Prior art keywords
substrate
contact surface
support member
contact
angle
Prior art date
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CN201811152281.7A
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English (en)
Chinese (zh)
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CN109727900A (zh
Inventor
普及特·阿咖瓦
丹尼尔·格林伯格
徐松文
杰弗里·布罗丁
史蒂芬·V·桑索尼
格伦·莫里
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN109727900A publication Critical patent/CN109727900A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • H10P72/3602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/38—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
CN201811152281.7A 2014-07-03 2015-06-05 基板传送机械手终端受动器 Active CN109727900B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811152281.7A CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201462020769P 2014-07-03 2014-07-03
US62/020,769 2014-07-03
US14/476,224 2014-09-03
US14/476,224 US9425076B2 (en) 2014-07-03 2014-09-03 Substrate transfer robot end effector
CN201580036350.6A CN106489194B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器
PCT/US2015/034333 WO2016003598A1 (en) 2014-07-03 2015-06-05 Substrate transfer robot end effector
CN201811152281.7A CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201580036350.6A Division CN106489194B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Publications (2)

Publication Number Publication Date
CN109727900A CN109727900A (zh) 2019-05-07
CN109727900B true CN109727900B (zh) 2023-05-09

Family

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Application Number Title Priority Date Filing Date
CN201811152281.7A Active CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器
CN201580036350.6A Active CN106489194B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

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CN201580036350.6A Active CN106489194B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Country Status (9)

Country Link
US (1) US9425076B2 (enExample)
EP (1) EP3164883A4 (enExample)
JP (2) JP2017522738A (enExample)
KR (1) KR102509442B1 (enExample)
CN (2) CN109727900B (enExample)
IL (1) IL249505A0 (enExample)
SG (1) SG11201610314UA (enExample)
TW (1) TWI628738B (enExample)
WO (1) WO2016003598A1 (enExample)

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US10312127B2 (en) 2013-09-16 2019-06-04 Applied Materials, Inc. Compliant robot blade for defect reduction
US9536329B2 (en) * 2014-05-30 2017-01-03 Adobe Systems Incorporated Method and apparatus for performing sentiment analysis based on user reactions to displayable content
JP6276317B2 (ja) * 2016-03-31 2018-02-07 平田機工株式会社 ハンドユニットおよび移載方法
US10090188B2 (en) * 2016-05-05 2018-10-02 Applied Materials, Inc. Robot subassemblies, end effector assemblies, and methods with reduced cracking
JP6757646B2 (ja) * 2016-10-27 2020-09-23 川崎重工業株式会社 基板把持ハンド及びそれを備える基板搬送装置
US10781056B2 (en) 2016-12-22 2020-09-22 General Electric Company Adaptive apparatus and system for automated handling of components
US10773902B2 (en) 2016-12-22 2020-09-15 General Electric Company Adaptive apparatus and system for automated handling of components
USD822735S1 (en) * 2017-03-17 2018-07-10 Donald Dimattia, Jr. Positionable end effector link
US10399231B2 (en) 2017-05-22 2019-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate handling contacts and methods
WO2020081348A1 (en) 2018-10-15 2020-04-23 General Electric Company Systems and methods of automated film removal
US11600580B2 (en) 2019-02-27 2023-03-07 Applied Materials, Inc. Replaceable end effector contact pads, end effectors, and maintenance methods
JP7415782B2 (ja) * 2020-05-11 2024-01-17 東京エレクトロン株式会社 基板搬送機構及び基板搬送方法
US20220063113A1 (en) * 2020-08-26 2022-03-03 WaferPath, Inc. Protective cap for a robot end effector
CN112060116B (zh) * 2020-09-02 2021-08-24 深圳市大族富创得科技有限公司 一种搬运机器人
JP7580333B2 (ja) * 2021-05-12 2024-11-11 三菱電機株式会社 ウエハハンド、半導体製造装置、および半導体装置の製造方法

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EP0878559A1 (de) * 1997-05-09 1998-11-18 Leybold Systems GmbH Vorrichtung für den Transport von scheibenförmigen Substraten

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JPH10144758A (ja) * 1996-11-11 1998-05-29 Kokusai Electric Co Ltd 基板搬送用プレート
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EP0878559A1 (de) * 1997-05-09 1998-11-18 Leybold Systems GmbH Vorrichtung für den Transport von scheibenförmigen Substraten

Also Published As

Publication number Publication date
WO2016003598A1 (en) 2016-01-07
TW201608671A (zh) 2016-03-01
JP2017522738A (ja) 2017-08-10
IL249505A0 (en) 2017-02-28
JP7169334B2 (ja) 2022-11-10
US9425076B2 (en) 2016-08-23
KR20170026595A (ko) 2017-03-08
EP3164883A4 (en) 2018-08-01
KR102509442B1 (ko) 2023-03-10
CN109727900A (zh) 2019-05-07
US20160005638A1 (en) 2016-01-07
JP2021048406A (ja) 2021-03-25
TWI628738B (zh) 2018-07-01
SG11201610314UA (en) 2017-01-27
EP3164883A1 (en) 2017-05-10
CN106489194B (zh) 2020-12-04
CN106489194A (zh) 2017-03-08

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