JP2017515295A - 受動デバイスを有するロープロファイルパッケージ - Google Patents

受動デバイスを有するロープロファイルパッケージ Download PDF

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Publication number
JP2017515295A
JP2017515295A JP2016552347A JP2016552347A JP2017515295A JP 2017515295 A JP2017515295 A JP 2017515295A JP 2016552347 A JP2016552347 A JP 2016552347A JP 2016552347 A JP2016552347 A JP 2016552347A JP 2017515295 A JP2017515295 A JP 2017515295A
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JP
Japan
Prior art keywords
substrate
recess
interconnect
package
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016552347A
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English (en)
Japanese (ja)
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JP2017515295A5 (enExample
Inventor
マリオ・フランシスコ・ヴェレス
デイク・ダニエル・キム
ヨン・キョ・ソン
シャオナン・ジャン
ジョンヘ・キム
チャンハン・ホビー・ユン
チェンジエ・ズオ
Original Assignee
クアルコム，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クアルコム，インコーポレイテッド filed Critical クアルコム，インコーポレイテッド
Publication of JP2017515295A publication Critical patent/JP2017515295A/ja
Publication of JP2017515295A5 publication Critical patent/JP2017515295A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H10W70/093—
    • H10W70/095—
    • H10W70/635—
    • H10W70/68—
    • H10W70/69—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structure Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2016552347A 2014-02-18 2015-02-06 受動デバイスを有するロープロファイルパッケージ Pending JP2017515295A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201461941308P 2014-02-18 2014-02-18
US61/941,308 2014-02-18
US14/200,684 2014-03-07
US14/200,684 US20150237732A1 (en) 2014-02-18 2014-03-07 Low-profile package with passive device
PCT/US2015/014895 WO2015126640A1 (en) 2014-02-18 2015-02-06 Low-profile package with passive device

Publications (2)

Publication Number Publication Date
JP2017515295A true JP2017515295A (ja) 2017-06-08
JP2017515295A5 JP2017515295A5 (enExample) 2018-03-01

Family

ID=53799402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016552347A Pending JP2017515295A (ja) 2014-02-18 2015-02-06 受動デバイスを有するロープロファイルパッケージ

Country Status (6)

Country Link
US (1) US20150237732A1 (enExample)
EP (1) EP3108502A1 (enExample)
JP (1) JP2017515295A (enExample)
KR (1) KR20160123322A (enExample)
CN (1) CN106030782B (enExample)
WO (1) WO2015126640A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI607539B (zh) * 2015-02-16 2017-12-01 精材科技股份有限公司 晶片封裝體及其製造方法
US10321575B2 (en) * 2015-09-01 2019-06-11 Qualcomm Incorporated Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components
US10074625B2 (en) 2015-09-20 2018-09-11 Qualcomm Incorporated Wafer level package (WLP) ball support using cavity structure
US20170092594A1 (en) * 2015-09-25 2017-03-30 Qualcomm Incorporated Low profile package with passive device
US10044390B2 (en) 2016-07-21 2018-08-07 Qualcomm Incorporated Glass substrate including passive-on-glass device and semiconductor die
US20180061775A1 (en) * 2016-08-31 2018-03-01 Qualcomm Incorporated LOW PROFILE PASSIVE ON GLASS (PoG) DEVICE COMPRISING A DIE
DE102016116499B4 (de) * 2016-09-02 2022-06-15 Infineon Technologies Ag Verfahren zum Bilden von Halbleiterbauelementen und Halbleiterbauelemente
US10194529B2 (en) * 2016-09-16 2019-01-29 Qualcomm Incorporated Partial metal fill for preventing extreme-low-k dielectric delamination
US10861840B2 (en) * 2017-08-30 2020-12-08 Advanced Semiconductor Engineering, Inc. Integrated passive component and method for manufacturing the same
KR102513078B1 (ko) * 2018-10-12 2023-03-23 삼성전자주식회사 반도체 패키지
CN110312363B (zh) * 2019-06-24 2020-10-16 维沃移动通信有限公司 一种印刷电路板组件及终端
CN111834341B (zh) * 2020-06-17 2021-09-21 珠海越亚半导体股份有限公司 电容电感嵌埋结构及其制作方法和基板

Citations (6)

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JPH10340929A (ja) * 1997-04-10 1998-12-22 Hitachi Aic Inc 電子部品搭載用配線基板
JP2000068399A (ja) * 1998-08-19 2000-03-03 Hitachi Denshi Ltd 半導体装置
JP2002280490A (ja) * 2001-03-21 2002-09-27 Fujitsu Ltd 配線基板とその製造方法並びにそれを用いた半導体装置
JP2004273622A (ja) * 2003-03-06 2004-09-30 Fujitsu Ltd コネクタ基板の製造方法
WO2007129526A1 (ja) * 2006-05-08 2007-11-15 Ibiden Co., Ltd. インダクタ及びこれを利用した電源回路
JP2013538010A (ja) * 2010-09-23 2013-10-07 クゥアルコム・メムス・テクノロジーズ・インコーポレイテッド 集積化された受動素子と電力増幅器

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CA2034703A1 (en) * 1990-01-23 1991-07-24 Masanori Nishiguchi Substrate for packaging a semiconductor device
US6569604B1 (en) * 1999-06-30 2003-05-27 International Business Machines Corporation Blind via formation in a photoimageable dielectric material
US20030205799A1 (en) * 2002-05-03 2003-11-06 Mohammad Yunus Method and device for assembly of ball grid array packages
US20040036170A1 (en) * 2002-08-20 2004-02-26 Lee Teck Kheng Double bumping of flexible substrate for first and second level interconnects
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JP4082220B2 (ja) * 2003-01-16 2008-04-30 セイコーエプソン株式会社 配線基板、半導体モジュールおよび半導体モジュールの製造方法
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US20110050334A1 (en) * 2009-09-02 2011-03-03 Qualcomm Incorporated Integrated Voltage Regulator with Embedded Passive Device(s)
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JPH10340929A (ja) * 1997-04-10 1998-12-22 Hitachi Aic Inc 電子部品搭載用配線基板
JP2000068399A (ja) * 1998-08-19 2000-03-03 Hitachi Denshi Ltd 半導体装置
JP2002280490A (ja) * 2001-03-21 2002-09-27 Fujitsu Ltd 配線基板とその製造方法並びにそれを用いた半導体装置
JP2004273622A (ja) * 2003-03-06 2004-09-30 Fujitsu Ltd コネクタ基板の製造方法
WO2007129526A1 (ja) * 2006-05-08 2007-11-15 Ibiden Co., Ltd. インダクタ及びこれを利用した電源回路
JP2013538010A (ja) * 2010-09-23 2013-10-07 クゥアルコム・メムス・テクノロジーズ・インコーポレイテッド 集積化された受動素子と電力増幅器

Also Published As

Publication number Publication date
EP3108502A1 (en) 2016-12-28
CN106030782B (zh) 2020-01-14
US20150237732A1 (en) 2015-08-20
CN106030782A (zh) 2016-10-12
WO2015126640A1 (en) 2015-08-27
KR20160123322A (ko) 2016-10-25

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