JP2017503899A5 - - Google Patents

Download PDF

Info

Publication number
JP2017503899A5
JP2017503899A5 JP2016548073A JP2016548073A JP2017503899A5 JP 2017503899 A5 JP2017503899 A5 JP 2017503899A5 JP 2016548073 A JP2016548073 A JP 2016548073A JP 2016548073 A JP2016548073 A JP 2016548073A JP 2017503899 A5 JP2017503899 A5 JP 2017503899A5
Authority
JP
Japan
Prior art keywords
conductive
sided tape
adhesive layer
substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2016548073A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017503899A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/012141 external-priority patent/WO2015112532A1/en
Publication of JP2017503899A publication Critical patent/JP2017503899A/ja
Publication of JP2017503899A5 publication Critical patent/JP2017503899A5/ja
Withdrawn legal-status Critical Current

Links

JP2016548073A 2014-01-24 2015-01-21 導電性接着テープ及びその物品 Withdrawn JP2017503899A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461931361P 2014-01-24 2014-01-24
US61/931,361 2014-01-24
PCT/US2015/012141 WO2015112532A1 (en) 2014-01-24 2015-01-21 Electrically conductive adhesive tapes and articles therefrom

Publications (2)

Publication Number Publication Date
JP2017503899A JP2017503899A (ja) 2017-02-02
JP2017503899A5 true JP2017503899A5 (enExample) 2018-03-01

Family

ID=53681877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016548073A Withdrawn JP2017503899A (ja) 2014-01-24 2015-01-21 導電性接着テープ及びその物品

Country Status (5)

Country Link
US (1) US20160333232A1 (enExample)
JP (1) JP2017503899A (enExample)
KR (1) KR20160113168A (enExample)
CN (1) CN105940072A (enExample)
WO (1) WO2015112532A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3520154A1 (de) * 2016-09-27 2019-08-07 INURU GmbH Kontaktierung von optoelektronischen bauelementen
BR112019005772A2 (pt) * 2016-09-27 2019-06-11 3M Innovative Properties Co filme de proteção
CN108913057B (zh) 2017-03-27 2023-11-10 昆山雅森电子材料科技有限公司 一种多层异向型导电布胶及其制作方法
JP6930239B2 (ja) * 2017-06-15 2021-09-01 Dic株式会社 導電性粘着シート
KR102007915B1 (ko) * 2017-09-26 2019-08-06 주식회사 영우 금속섬유를 이용한 전도성 테이프
US10058014B1 (en) 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
TWI686309B (zh) * 2019-01-09 2020-03-01 可成科技股份有限公司 散熱結構及其製造方法
CN113692349B (zh) * 2019-04-02 2023-07-28 日本制铁株式会社 金属-碳纤维增强树脂材料复合体及其制造方法
JP2023516361A (ja) 2020-03-03 2023-04-19 スリーエム イノベイティブ プロパティズ カンパニー 交絡または整列した繊維を含む熱伝導性物品、その作製方法、および電池モジュール
CN112445035A (zh) * 2020-11-30 2021-03-05 深圳同兴达科技股份有限公司 导电贴以及液晶显示模组
KR20220099200A (ko) 2021-01-05 2022-07-13 삼성디스플레이 주식회사 접착 부재, 표시 장치 및 표시 장치 제조 방법
CN113174211B (zh) * 2021-05-26 2025-03-28 3M中国有限公司 一种胶带
WO2022246682A1 (en) * 2021-05-26 2022-12-01 3M Innovative Properties Company Tape including electrically conductive porous medium
CN117813344A (zh) 2021-08-05 2024-04-02 3M创新有限公司 具有低无源互调的导电粘结带
CN113913097B (zh) * 2021-10-24 2023-11-03 杭州巨力绝缘材料有限公司 纳米铜覆膜铝箔制作方法及生产线
US12090708B2 (en) 2021-12-16 2024-09-17 Textron Innovations Inc. Self heating structural adhesives for out-of-autoclave and out-of-oven curing
EP4669713A1 (en) * 2023-02-24 2025-12-31 3M Innovative Properties Company ELECTROCONDUCTIVE ADHESIVE FILM

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6340216A (ja) * 1986-08-05 1988-02-20 住友スリ−エム株式会社 導電性テ−プ
JP2772613B2 (ja) * 1992-12-16 1998-07-02 龍 仁 李 導電性粘着テープ
WO1995012643A1 (en) * 1993-11-03 1995-05-11 W. L. Gore & Associates, Inc. Electrically conductive adhesives
US20050062024A1 (en) * 2003-08-06 2005-03-24 Bessette Michael D. Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof
CN202030694U (zh) * 2011-05-06 2011-11-09 广州方邦电子有限公司 具有导通孔的高剥离强度的导电胶膜
US9061478B2 (en) * 2011-05-18 2015-06-23 3M Innovative Properties Company Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom
WO2013062836A1 (en) * 2011-10-25 2013-05-02 3M Innovative Properties Company Nonwoven adhesive tapes and articles therefrom

Similar Documents

Publication Publication Date Title
JP2017503899A5 (enExample)
ES2548921T3 (es) Elemento plano flexible calentable
JP2017503880A5 (enExample)
JP2013533605A5 (enExample)
JP2019115699A5 (ja) 電子装置
JP2017509721A5 (enExample)
JP2012524159A5 (enExample)
JP2012525719A5 (enExample)
JP2013538271A5 (enExample)
JP2014195064A5 (enExample)
JP2011525000A5 (enExample)
WO2016019338A3 (en) Controlled heating for electrochromic devices
JP2013179097A5 (ja) 表示装置
JP2013235024A5 (enExample)
JP2017097096A5 (enExample)
JP2016530622A5 (enExample)
JP2013258393A5 (enExample)
MY184919A (en) Cover tape, component package, and method of making the same
JP2017202694A5 (enExample)
SG10201403298XA (en) Lightweight two-sided adhesive tape
WO2017112453A3 (en) Acrylic polyvinyl acetal films comprising a second layer
JP2016512478A5 (enExample)
EP2533280A3 (en) Semiconductor device
JP2017099467A5 (enExample)
CN204897812U (zh) 一种含有孔基膜的双面胶