KR20160113168A - 전기 전도성 접착 테이프 및 그로부터의 물품 - Google Patents

전기 전도성 접착 테이프 및 그로부터의 물품 Download PDF

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Publication number
KR20160113168A
KR20160113168A KR1020167022666A KR20167022666A KR20160113168A KR 20160113168 A KR20160113168 A KR 20160113168A KR 1020167022666 A KR1020167022666 A KR 1020167022666A KR 20167022666 A KR20167022666 A KR 20167022666A KR 20160113168 A KR20160113168 A KR 20160113168A
Authority
KR
South Korea
Prior art keywords
conductive
tape
electrically conductive
porous substrate
cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020167022666A
Other languages
English (en)
Korean (ko)
Inventor
정완 최
제프리 더블유 맥커친
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20160113168A publication Critical patent/KR20160113168A/ko
Withdrawn legal-status Critical Current

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    • C09J7/041—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C09J2201/122—
    • C09J2201/602—
    • C09J2201/606—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/26—Presence of textile or fabric
    • C09J2400/263—Presence of textile or fabric in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
KR1020167022666A 2014-01-24 2015-01-21 전기 전도성 접착 테이프 및 그로부터의 물품 Withdrawn KR20160113168A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461931361P 2014-01-24 2014-01-24
US61/931,361 2014-01-24
PCT/US2015/012141 WO2015112532A1 (en) 2014-01-24 2015-01-21 Electrically conductive adhesive tapes and articles therefrom

Publications (1)

Publication Number Publication Date
KR20160113168A true KR20160113168A (ko) 2016-09-28

Family

ID=53681877

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167022666A Withdrawn KR20160113168A (ko) 2014-01-24 2015-01-21 전기 전도성 접착 테이프 및 그로부터의 물품

Country Status (5)

Country Link
US (1) US20160333232A1 (enExample)
JP (1) JP2017503899A (enExample)
KR (1) KR20160113168A (enExample)
CN (1) CN105940072A (enExample)
WO (1) WO2015112532A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190035318A (ko) * 2017-09-26 2019-04-03 주식회사 영우 금속섬유를 이용한 전도성 테이프

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3520154A1 (de) * 2016-09-27 2019-08-07 INURU GmbH Kontaktierung von optoelektronischen bauelementen
WO2018063970A1 (en) * 2016-09-27 2018-04-05 3M Innovative Properties Company Protection film
CN108913057B (zh) 2017-03-27 2023-11-10 昆山雅森电子材料科技有限公司 一种多层异向型导电布胶及其制作方法
JP6930239B2 (ja) * 2017-06-15 2021-09-01 Dic株式会社 導電性粘着シート
US10058014B1 (en) 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
TWI686309B (zh) * 2019-01-09 2020-03-01 可成科技股份有限公司 散熱結構及其製造方法
WO2020202461A1 (ja) * 2019-04-02 2020-10-08 日本製鉄株式会社 金属－炭素繊維強化樹脂材料複合体および金属－炭素繊維強化樹脂材料複合体の製造方法
EP4114662A4 (en) 2020-03-03 2024-03-06 3M Innovative Properties Company THERMALLY CONDUCTIVE ARTICLES COMPRISING ENTANGLED OR ALIGNED FIBERS, METHODS OF MANUFACTURING THEREOF, AND BATTERY MODULES
CN112445035A (zh) * 2020-11-30 2021-03-05 深圳同兴达科技股份有限公司 导电贴以及液晶显示模组
KR20220099200A (ko) * 2021-01-05 2022-07-13 삼성디스플레이 주식회사 접착 부재, 표시 장치 및 표시 장치 제조 방법
CN113174211B (zh) * 2021-05-26 2025-03-28 3M中国有限公司 一种胶带
US12241008B2 (en) 2021-05-26 2025-03-04 3M Innovative Properties Company Tape including electrically conductive porous medium
EP4381008A1 (en) * 2021-08-05 2024-06-12 3M Innovative Properties Company Electrically conductive bonding tape with low passive intermodulation
CN113913097B (zh) * 2021-10-24 2023-11-03 杭州巨力绝缘材料有限公司 纳米铜覆膜铝箔制作方法及生产线
US12090708B2 (en) 2021-12-16 2024-09-17 Textron Innovations Inc. Self heating structural adhesives for out-of-autoclave and out-of-oven curing
WO2024176092A1 (en) * 2023-02-24 2024-08-29 3M Innovative Properties Company Electrically conductive adhesive film

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6340216A (ja) * 1986-08-05 1988-02-20 住友スリ−エム株式会社 導電性テ−プ
JP2772613B2 (ja) * 1992-12-16 1998-07-02 龍 仁 李 導電性粘着テープ
EP0726925B1 (en) * 1993-11-03 1998-07-22 W.L. Gore & Associates, Inc. Electrically conductive adhesives
US20050062024A1 (en) * 2003-08-06 2005-03-24 Bessette Michael D. Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof
CN202030694U (zh) * 2011-05-06 2011-11-09 广州方邦电子有限公司 具有导通孔的高剥离强度的导电胶膜
US9061478B2 (en) * 2011-05-18 2015-06-23 3M Innovative Properties Company Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom
WO2013062836A1 (en) * 2011-10-25 2013-05-02 3M Innovative Properties Company Nonwoven adhesive tapes and articles therefrom

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190035318A (ko) * 2017-09-26 2019-04-03 주식회사 영우 금속섬유를 이용한 전도성 테이프

Also Published As

Publication number Publication date
US20160333232A1 (en) 2016-11-17
JP2017503899A (ja) 2017-02-02
WO2015112532A1 (en) 2015-07-30
CN105940072A (zh) 2016-09-14

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Date Code Title Description
PA0105 International application

Patent event date: 20160819

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid