JP2017503899A - 導電性接着テープ及びその物品 - Google Patents

導電性接着テープ及びその物品 Download PDF

Info

Publication number
JP2017503899A
JP2017503899A JP2016548073A JP2016548073A JP2017503899A JP 2017503899 A JP2017503899 A JP 2017503899A JP 2016548073 A JP2016548073 A JP 2016548073A JP 2016548073 A JP2016548073 A JP 2016548073A JP 2017503899 A JP2017503899 A JP 2017503899A
Authority
JP
Japan
Prior art keywords
conductive
sided tape
porous substrate
substrate
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2016548073A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017503899A5 (enExample
Inventor
チョンワン チョイ，
チョンワン チョイ，
ジェフリー ダブリュー． マカッチョン，
ジェフリー ダブリュー． マカッチョン，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2017503899A publication Critical patent/JP2017503899A/ja
Publication of JP2017503899A5 publication Critical patent/JP2017503899A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/26—Presence of textile or fabric
    • C09J2400/263—Presence of textile or fabric in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
JP2016548073A 2014-01-24 2015-01-21 導電性接着テープ及びその物品 Withdrawn JP2017503899A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461931361P 2014-01-24 2014-01-24
US61/931,361 2014-01-24
PCT/US2015/012141 WO2015112532A1 (en) 2014-01-24 2015-01-21 Electrically conductive adhesive tapes and articles therefrom

Publications (2)

Publication Number Publication Date
JP2017503899A true JP2017503899A (ja) 2017-02-02
JP2017503899A5 JP2017503899A5 (enExample) 2018-03-01

Family

ID=53681877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016548073A Withdrawn JP2017503899A (ja) 2014-01-24 2015-01-21 導電性接着テープ及びその物品

Country Status (5)

Country Link
US (1) US20160333232A1 (enExample)
JP (1) JP2017503899A (enExample)
KR (1) KR20160113168A (enExample)
CN (1) CN105940072A (enExample)
WO (1) WO2015112532A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019534809A (ja) * 2016-09-27 2019-12-05 スリーエム イノベイティブ プロパティズ カンパニー 保護フィルム
JP2024523791A (ja) * 2021-05-26 2024-07-02 スリーエム イノベイティブ プロパティズ カンパニー 導電性多孔質媒体を含むテープ
WO2024176092A1 (en) * 2023-02-24 2024-08-29 3M Innovative Properties Company Electrically conductive adhesive film

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3520154A1 (de) * 2016-09-27 2019-08-07 INURU GmbH Kontaktierung von optoelektronischen bauelementen
CN108913057B (zh) 2017-03-27 2023-11-10 昆山雅森电子材料科技有限公司 一种多层异向型导电布胶及其制作方法
JP6930239B2 (ja) * 2017-06-15 2021-09-01 Dic株式会社 導電性粘着シート
KR102007915B1 (ko) * 2017-09-26 2019-08-06 주식회사 영우 금속섬유를 이용한 전도성 테이프
US10058014B1 (en) 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
TWI686309B (zh) * 2019-01-09 2020-03-01 可成科技股份有限公司 散熱結構及其製造方法
WO2020202461A1 (ja) * 2019-04-02 2020-10-08 日本製鉄株式会社 金属－炭素繊維強化樹脂材料複合体および金属－炭素繊維強化樹脂材料複合体の製造方法
EP4114662A4 (en) 2020-03-03 2024-03-06 3M Innovative Properties Company THERMALLY CONDUCTIVE ARTICLES COMPRISING ENTANGLED OR ALIGNED FIBERS, METHODS OF MANUFACTURING THEREOF, AND BATTERY MODULES
CN112445035A (zh) * 2020-11-30 2021-03-05 深圳同兴达科技股份有限公司 导电贴以及液晶显示模组
KR20220099200A (ko) * 2021-01-05 2022-07-13 삼성디스플레이 주식회사 접착 부재, 표시 장치 및 표시 장치 제조 방법
CN113174211B (zh) * 2021-05-26 2025-03-28 3M中国有限公司 一种胶带
EP4381008A1 (en) * 2021-08-05 2024-06-12 3M Innovative Properties Company Electrically conductive bonding tape with low passive intermodulation
CN113913097B (zh) * 2021-10-24 2023-11-03 杭州巨力绝缘材料有限公司 纳米铜覆膜铝箔制作方法及生产线
US12090708B2 (en) 2021-12-16 2024-09-17 Textron Innovations Inc. Self heating structural adhesives for out-of-autoclave and out-of-oven curing

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6340216A (ja) * 1986-08-05 1988-02-20 住友スリ−エム株式会社 導電性テ−プ
JP2772613B2 (ja) * 1992-12-16 1998-07-02 龍 仁 李 導電性粘着テープ
EP0726925B1 (en) * 1993-11-03 1998-07-22 W.L. Gore & Associates, Inc. Electrically conductive adhesives
US20050062024A1 (en) * 2003-08-06 2005-03-24 Bessette Michael D. Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof
CN202030694U (zh) * 2011-05-06 2011-11-09 广州方邦电子有限公司 具有导通孔的高剥离强度的导电胶膜
US9061478B2 (en) * 2011-05-18 2015-06-23 3M Innovative Properties Company Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom
WO2013062836A1 (en) * 2011-10-25 2013-05-02 3M Innovative Properties Company Nonwoven adhesive tapes and articles therefrom

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019534809A (ja) * 2016-09-27 2019-12-05 スリーエム イノベイティブ プロパティズ カンパニー 保護フィルム
JP7161989B2 (ja) 2016-09-27 2022-10-27 スリーエム イノベイティブ プロパティズ カンパニー 保護フィルム
JP2024523791A (ja) * 2021-05-26 2024-07-02 スリーエム イノベイティブ プロパティズ カンパニー 導電性多孔質媒体を含むテープ
WO2024176092A1 (en) * 2023-02-24 2024-08-29 3M Innovative Properties Company Electrically conductive adhesive film

Also Published As

Publication number Publication date
US20160333232A1 (en) 2016-11-17
WO2015112532A1 (en) 2015-07-30
KR20160113168A (ko) 2016-09-28
CN105940072A (zh) 2016-09-14

Similar Documents

Publication Publication Date Title
JP2017503899A (ja) 導電性接着テープ及びその物品
JP6124905B2 (ja) 不織布接着剤テープ及びそれから作製される物品
US9061478B2 (en) Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom
JP2017503880A (ja) 導電性接着剤テープ及びそれから作製される物品
JP2017509721A (ja) 導電性接着テープ及びそれから作製される物品
US12152179B2 (en) Electrically conductive adhesive
TW201137073A (en) Composition, tape, and use thereof
KR20190114890A (ko) 전자파 차폐 필름, 차폐 프린트 배선판 및 차폐 프린트 배선판의 제조 방법
CN110876256A (zh) 电磁波屏蔽膜及其制造方法、屏蔽印制线路板的制造方法
EP0508722A1 (en) Electrically conductive adhesive tape
US20190359862A1 (en) Electrically conductive adhesive layer
US20120325518A1 (en) Conductive thermosetting adhesive tape
CN114902819A (zh) 形状转印膜
CN103764780A (zh) 导电性粘合带
CN102782070B (zh) 导电性粘合带
JP5553477B2 (ja) メッシュ材の製造方法及びメッシュ材
JP2024025746A (ja) パターン状粘着テープ用粘着剤組成物、パターン状粘着テープおよびその製造方法
JP2024025745A (ja) パターン状粘着テープ用粘着剤組成物、パターン状粘着テープおよびその製造方法
CN116656261A (zh) 一种复配胶层不干胶材料及其制备方法
JPS62165886A (ja) 回路の接続部材

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180122

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180122

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20180919