CN105940072A - 导电粘合胶带和由其制得的制品 - Google Patents

导电粘合胶带和由其制得的制品 Download PDF

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Publication number
CN105940072A
CN105940072A CN201580005548.8A CN201580005548A CN105940072A CN 105940072 A CN105940072 A CN 105940072A CN 201580005548 A CN201580005548 A CN 201580005548A CN 105940072 A CN105940072 A CN 105940072A
Authority
CN
China
Prior art keywords
conductive
conduction
porous substrate
faced tapes
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580005548.8A
Other languages
English (en)
Chinese (zh)
Inventor
崔汀完
J·W·麦卡彻昂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN105940072A publication Critical patent/CN105940072A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/26—Presence of textile or fabric
    • C09J2400/263—Presence of textile or fabric in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
CN201580005548.8A 2014-01-24 2015-01-21 导电粘合胶带和由其制得的制品 Pending CN105940072A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461931361P 2014-01-24 2014-01-24
US61/931,361 2014-01-24
PCT/US2015/012141 WO2015112532A1 (en) 2014-01-24 2015-01-21 Electrically conductive adhesive tapes and articles therefrom

Publications (1)

Publication Number Publication Date
CN105940072A true CN105940072A (zh) 2016-09-14

Family

ID=53681877

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580005548.8A Pending CN105940072A (zh) 2014-01-24 2015-01-21 导电粘合胶带和由其制得的制品

Country Status (5)

Country Link
US (1) US20160333232A1 (enExample)
JP (1) JP2017503899A (enExample)
KR (1) KR20160113168A (enExample)
CN (1) CN105940072A (enExample)
WO (1) WO2015112532A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109135601A (zh) * 2017-06-15 2019-01-04 Dic株式会社 导电性粘着片
CN111432595A (zh) * 2019-01-09 2020-07-17 可成科技股份有限公司 散热结构及其制造方法
CN113174211A (zh) * 2021-05-26 2021-07-27 3M中国有限公司 一种胶带
WO2022246682A1 (en) * 2021-05-26 2022-12-01 3M Innovative Properties Company Tape including electrically conductive porous medium

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3520154A1 (de) * 2016-09-27 2019-08-07 INURU GmbH Kontaktierung von optoelektronischen bauelementen
WO2018063970A1 (en) * 2016-09-27 2018-04-05 3M Innovative Properties Company Protection film
CN108913057B (zh) 2017-03-27 2023-11-10 昆山雅森电子材料科技有限公司 一种多层异向型导电布胶及其制作方法
KR102007915B1 (ko) * 2017-09-26 2019-08-06 주식회사 영우 금속섬유를 이용한 전도성 테이프
US10058014B1 (en) 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
WO2020202461A1 (ja) * 2019-04-02 2020-10-08 日本製鉄株式会社 金属－炭素繊維強化樹脂材料複合体および金属－炭素繊維強化樹脂材料複合体の製造方法
EP4114662A4 (en) 2020-03-03 2024-03-06 3M Innovative Properties Company THERMALLY CONDUCTIVE ARTICLES COMPRISING ENTANGLED OR ALIGNED FIBERS, METHODS OF MANUFACTURING THEREOF, AND BATTERY MODULES
CN112445035A (zh) * 2020-11-30 2021-03-05 深圳同兴达科技股份有限公司 导电贴以及液晶显示模组
KR20220099200A (ko) * 2021-01-05 2022-07-13 삼성디스플레이 주식회사 접착 부재, 표시 장치 및 표시 장치 제조 방법
EP4381008A1 (en) * 2021-08-05 2024-06-12 3M Innovative Properties Company Electrically conductive bonding tape with low passive intermodulation
CN113913097B (zh) * 2021-10-24 2023-11-03 杭州巨力绝缘材料有限公司 纳米铜覆膜铝箔制作方法及生产线
US12090708B2 (en) 2021-12-16 2024-09-17 Textron Innovations Inc. Self heating structural adhesives for out-of-autoclave and out-of-oven curing
WO2024176092A1 (en) * 2023-02-24 2024-08-29 3M Innovative Properties Company Electrically conductive adhesive film

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1090084A (zh) * 1992-12-16 1994-07-27 李龙仁 一种用于带子的导电基底层和采用该基底层的导电胶带
CN1103423A (zh) * 1993-11-03 1995-06-07 W·L·戈尔及同仁股份有限公司 导电性粘合剂
CN202030694U (zh) * 2011-05-06 2011-11-09 广州方邦电子有限公司 具有导通孔的高剥离强度的导电胶膜

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6340216A (ja) * 1986-08-05 1988-02-20 住友スリ−エム株式会社 導電性テ−プ
US20050062024A1 (en) * 2003-08-06 2005-03-24 Bessette Michael D. Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof
US9061478B2 (en) * 2011-05-18 2015-06-23 3M Innovative Properties Company Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom
WO2013062836A1 (en) * 2011-10-25 2013-05-02 3M Innovative Properties Company Nonwoven adhesive tapes and articles therefrom

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1090084A (zh) * 1992-12-16 1994-07-27 李龙仁 一种用于带子的导电基底层和采用该基底层的导电胶带
CN1103423A (zh) * 1993-11-03 1995-06-07 W·L·戈尔及同仁股份有限公司 导电性粘合剂
CN202030694U (zh) * 2011-05-06 2011-11-09 广州方邦电子有限公司 具有导通孔的高剥离强度的导电胶膜

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109135601A (zh) * 2017-06-15 2019-01-04 Dic株式会社 导电性粘着片
CN109135601B (zh) * 2017-06-15 2021-11-26 Dic株式会社 导电性粘着片
CN111432595A (zh) * 2019-01-09 2020-07-17 可成科技股份有限公司 散热结构及其制造方法
CN113174211A (zh) * 2021-05-26 2021-07-27 3M中国有限公司 一种胶带
WO2022246682A1 (en) * 2021-05-26 2022-12-01 3M Innovative Properties Company Tape including electrically conductive porous medium
US12241008B2 (en) 2021-05-26 2025-03-04 3M Innovative Properties Company Tape including electrically conductive porous medium

Also Published As

Publication number Publication date
US20160333232A1 (en) 2016-11-17
JP2017503899A (ja) 2017-02-02
WO2015112532A1 (en) 2015-07-30
KR20160113168A (ko) 2016-09-28

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160914

WD01 Invention patent application deemed withdrawn after publication