CN1103423A - 导电性粘合剂 - Google Patents

导电性粘合剂 Download PDF

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Publication number
CN1103423A
CN1103423A CN94108173A CN94108173A CN1103423A CN 1103423 A CN1103423 A CN 1103423A CN 94108173 A CN94108173 A CN 94108173A CN 94108173 A CN94108173 A CN 94108173A CN 1103423 A CN1103423 A CN 1103423A
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Prior art keywords
substrate
tackiness agent
porous
conductive
fabric
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D·R·金
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WL Gore and Associates Inc
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WL Gore and Associates Inc
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Abstract

本发明叙述了一种导电性粘合剂，其由一种多孔 衬底制成，该衬底具有许多延伸穿过它的气道。限定 气道的衬底壁用一种导电性金属涂层。这样提供一 种从多孔衬底的一边到另一边的连续外层。余留的 气道体积用一种粘合剂树脂完全填满。该粘合剂可 用于连接二个金属表面电流。

Description

在许多电子学应用中，为了使两个分离的元件正确地接地需要连接两个金属表面。这些元件可以是集成电路芯片，插件，混合元件，多芯片组件，印刷线路板，陶瓷基片，散热片，底板和外壳。用螺钉或夹子机械地固定两个元件常常是不实际或不可能的，在此情况下期望使用一种导电性粘合剂。
通常使用高分子导电性粘合剂，例如载有导电性颗粒的环氧树脂，这些颗粒例如碳或银或其类似物。然而，树脂基质中的颗粒常常不能达到良好的导电效率因为随着时间这些颗粒趋向于在树脂基质中移动而改变导电性。而且，在需要高度导电性的应用中，粘合剂中颗粒的量需要很高，例如在一些情况中高达80%的搀入物。为了确保通过树脂基质颗粒与颗粒接触需要大量的颗粒。该大量的颗粒导致树脂/搀入物的结合变脆弱或粘合强度变弱。
由于颗粒与颗粒接触的高的表面电阻，对需要高导电性的应用必须采用银粒，因为其它金属太容易形成氧化物而产生较高电阻粘合剂。并且，当需要粘合铝元件并需要高导电性时，使用银粒存在一个问题，因为银与铝发生电反应而导致腐蚀的发生。
为了克服上面提到的不足，本发明提供了一种导电性粘合剂，包括一种具有许多延伸穿过衬底的气道的多孔衬底，其中限定这些气道的衬底壁用导电性金属涂层以提供一种从衬底的一边到另一边的连续层，其中余留的气道体积用一种粘合剂树脂完全填满。
图1是本发明粘合剂薄膜的横截面。
参阅图1，在本发明中提供了一种衬底结构10，其具有从衬底的一边延伸至另一边气道11。该衬底可以是一种织品，一种多孔膜，一种泡沫材料，或其类似物。较佳地当它用作一种粘合剂衬底时，应该是有弹性的和可压缩的以提供柔顺性。织品可以是一种机织织品，无纺织品，针织品或其类似物，条件是它具有所需要的气道。代表性的织品可以是聚酰胺，聚四氟乙烯，聚酯，聚氨酯或聚酰亚胺或其类似物。对于其强度，可压缩性，耐温性，阻燃性和化学惰性尤其佳的衬底为膨胀的多孔聚四氟乙烯（PTFE），如在美国专利3，953，566中所叙述的衬底其具有一种在结点处通过小纤维相互连接的结点微结构而且小纤维限定连续的气道或气孔。
衬底一般为0.3到40密耳（mil）厚（7.6微米到1毫米），虽然开头可与欲待粘合在一起的元件相配，但是一般取薄片的形状。
气道的壁粘附着导电性金属12（见图1），其可以通过一无电镀程序形成在壁上。代表性的导电金属包括铜、镍、银、金及其类似物。金属涂层或镀金属不填入气道体积而仅覆盖限定气道的材料。
当衬底为一高分子织品例如聚酯织品时，这样的导电性平板衬底在Monsanto Co.有售，其商品名为Flectron材料。
当该衬底为膨胀的多孔PTFE时，导电性平板衬底一般可按Manniso美国专利4，557，957中所述的方法制备。
当导电性金属材料置于气孔壁上时，余留的气孔体积用粘合剂13填入（见图1）。合适的粘合剂包括环氧树脂，丙烯酸树脂，聚氨酯树脂，硅酮树脂，聚酰亚胺树脂，氰酸酯树脂或其类似物。将衬底浸在粘合剂溶液中粘合剂方便地吸入气孔。对环氧树脂粘合剂，合适的溶剂为甲基乙基酮。
如此制备的填有粘合剂的，并具有导电性涂层的衬底作为一种导电性粘合剂是有用的。
该粘合剂可用于将元件粘合在一起。普通的粘合剂是置于两个金属表面之间并加热及加压（如果需要）直到形成粘结。由于导电性涂层从粘合剂的一边延伸至另一边，电流也就从一种金属的表面流向另一种金属的表面。
实施例1
用W.L.Gore & Associates，Inc.制造的Part Number NC17201-04-1的电镀多孔PTFE薄片5mil（127微米）厚为衬底制备导电性粘合剂。
该薄片在25℃用环氧粘合剂树脂（Nelco N-4205-2）在甲基乙基酮（MEK）溶剂（以重量计为20%固体物）中浸渍15秒使之浸透。然后在烘箱中163℃下蒸发溶剂。该吸入环氧树脂的薄片经测定含有30%（重量）的环氧树脂。
如上制备的粘合剂产品通过粘合二块铝板进行测定。特别地，将二块未经表面化学处理的直径为2吋（5.08厘米）的铝板放入烘箱，其中二块铝板之间带有粘合剂产品的薄片。用1psi（2.88kg/cm2）的压力在150℃下保持1小时使之粘合。电流从平板的一边到另一边经过该组件。经过铝和导电性粘合剂的电阻经测定小于0.01欧姆，其包括铝的表面电阻。
实施例2
用15mil厚的由Monsanto公司制备的无纺聚酯织品，称作Flectron的无纺聚酯织品制备导电性粘合剂。Flectron织品为2.5OZ./sq.yd.总重量其中金属重量最小值为0.64OZ./sq/yd.。织品上的金属镀层为镍镀于铜上。
然后已镀层的聚酯间隙用高温环氧粘合剂树脂（Nelco N-4205-6）在一种MEK溶剂（按重量20%固体）中25℃下浸渍15秒。在163℃下加热蒸发溶剂，剩下的镀层织品含有30%（重量）的树脂。该原料形成导电性粘合剂。
用该导电性粘合剂将两块铝板粘合在一起，直径为3.0吋。该粘合是在50psi压力和176℃下在与实施例1相同的仪器上粘合1.5小时。测得通过铝和导电性粘合剂的电阻小于0.001欧姆。
实施例3
在本实施例中，采用由Monsanto公司制造的并称作FlectronH1聚酯塔夫绸的厚度为3.8mil的纺织聚酯织品。该原料用已经抗氧化剂处理的铜涂层。内涂层不存在镍。吸入环氧树脂的操作如实施例1所述。得到的粘合剂含有30%（重量）的环氧树脂和25%（重量）的金属。该原料，包括树脂涂层，镀金属，纺织聚酯，形成了导电性粘合剂。
该导电性粘合剂用于将两块铝板粘合在一起，其面积为1.0平方吋。该粘合是在1psi压力和176℃下粘合一小时而进行的。经通过铝和导电性粘合剂的电阻小于0.5欧姆。
实施例4
一种普通的商业上可得到的用环氧树脂和银粒制备的导电性粘合剂（由Ablestik（National Starch and Chemical Company的一个部门）制造的Ablefilm ECF-561-003）用于将两块铝板（直径为2.0吋）粘合在一起，采用如实施例1所述的同样类型的板和同样的层压条件（粘合是在1psi压力和150℃下持续1小时进行的）。用一台四探针欧姆计测量通过铝和粘合剂（Ablestik产品和实施例1中粘合的原料）的电阻。两个样品同时在同一仪器上测量。市场上有售的银粘合剂被测得的电阻值为291.3毫欧姆而实施例1中所示的粘合剂的电阻值为8.6毫欧姆。除了实施例1所显示的电阻值仅为市售粘合剂的3%，实施例1所显示的粘合剂还具有下列优点：不腐蚀铝，不需要冷藏，较易处理，以及没有会使相邻部件短路的自由颗粒。

Claims (7)

1、一种导电性粘合剂包括一种多孔衬底其具有许多延伸穿过该衬底的气道，其中限定气道的衬底壁用导电性金属涂层以提供以多孔衬底的一边到另一边连续的外层，其中余留的气道体积用一种粘合剂树脂完全填满。
2、如权利要求1所述的粘合剂，其中衬底为一种多孔有机聚合物或一种多孔织品。
3、如权利要求1所述的粘合剂，其中衬底为一种有机聚合物，选自聚四氟乙烯，聚酰胺，聚氨酯，聚酯，聚烯烃，和聚酰亚胺。
4、如权利要求1所述的粘合剂其中衬底为多孔聚四氟乙烯片。
5、如权利要求1所述的粘合剂其中衬底为一种由有机纤维制成的织品，这些有机纤维选自聚四氟乙烯，聚酰胺，聚氨酯，聚酯，聚烯烃，和聚酰亚胺。
6、如权利要求1或3所述粘合剂其中导电性金属为铜或镍，或二者的序列。
7、如权利要求1或3所述粘合剂其中树脂包括一种有机聚合物选自环氧，尿烷，丙烯酸和氰酸酯类。
CN94108173A 1993-11-03 1994-08-15 导电性粘合剂 Pending CN1103423A (zh)

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