JP2017501572A5 - - Google Patents

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Publication number
JP2017501572A5
JP2017501572A5 JP2016536811A JP2016536811A JP2017501572A5 JP 2017501572 A5 JP2017501572 A5 JP 2017501572A5 JP 2016536811 A JP2016536811 A JP 2016536811A JP 2016536811 A JP2016536811 A JP 2016536811A JP 2017501572 A5 JP2017501572 A5 JP 2017501572A5
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JP
Japan
Prior art keywords
electrode assembly
chucking
region
carrier
substrate
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Application number
JP2016536811A
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English (en)
Japanese (ja)
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JP6656153B2 (ja
JP2017501572A (ja
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Publication date
Priority claimed from US14/099,856 external-priority patent/US9460950B2/en
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Publication of JP2017501572A publication Critical patent/JP2017501572A/ja
Publication of JP2017501572A5 publication Critical patent/JP2017501572A5/ja
Application granted granted Critical
Publication of JP6656153B2 publication Critical patent/JP6656153B2/ja
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JP2016536811A 2013-12-06 2014-09-19 より小さいウエハおよびウエハ片向けのウエハキャリア Active JP6656153B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/099,856 US9460950B2 (en) 2013-12-06 2013-12-06 Wafer carrier for smaller wafers and wafer pieces
US14/099,856 2013-12-06
PCT/US2014/056607 WO2015084463A1 (en) 2013-12-06 2014-09-19 Wafer carrier for smaller wafers and wafer pieces

Publications (3)

Publication Number Publication Date
JP2017501572A JP2017501572A (ja) 2017-01-12
JP2017501572A5 true JP2017501572A5 (cg-RX-API-DMAC10.html) 2017-11-02
JP6656153B2 JP6656153B2 (ja) 2020-03-04

Family

ID=53271907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016536811A Active JP6656153B2 (ja) 2013-12-06 2014-09-19 より小さいウエハおよびウエハ片向けのウエハキャリア

Country Status (6)

Country Link
US (2) US9460950B2 (cg-RX-API-DMAC10.html)
JP (1) JP6656153B2 (cg-RX-API-DMAC10.html)
KR (2) KR101757378B1 (cg-RX-API-DMAC10.html)
CN (1) CN105793974B (cg-RX-API-DMAC10.html)
TW (2) TWI620262B (cg-RX-API-DMAC10.html)
WO (1) WO2015084463A1 (cg-RX-API-DMAC10.html)

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US20180374736A1 (en) * 2017-06-22 2018-12-27 Applied Materials, Inc. Electrostatic carrier for die bonding applications
CN111128834B (zh) * 2018-10-31 2022-09-06 成都辰显光电有限公司 微元件转移设备及其制作方法
CN109545731B (zh) * 2018-11-20 2021-12-28 合肥京东方显示技术有限公司 转移头及其制备方法、转移方法、转移装置
US12125728B2 (en) * 2019-01-21 2024-10-22 Applied Materials, Inc. Substrate carrier
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KR102327829B1 (ko) * 2020-11-02 2021-11-17 주식회사 엘케이엔지니어링 정전척
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US20250391692A1 (en) * 2024-06-20 2025-12-25 Applied Materials Israel Ltd. Hybrid vacuum electrostatic chuck in vacuum chamber for high warpage wafers

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US10978334B2 (en) 2014-09-02 2021-04-13 Applied Materials, Inc. Sealing structure for workpiece to substrate bonding in a processing chamber

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