JP2017210396A - 結晶基板の製造方法 - Google Patents
結晶基板の製造方法 Download PDFInfo
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- 239000013078 crystal Substances 0.000 title claims abstract description 255
- 239000000758 substrate Substances 0.000 title claims abstract description 203
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000009826 distribution Methods 0.000 claims abstract description 24
- 238000002360 preparation method Methods 0.000 claims abstract description 15
- 238000012545 processing Methods 0.000 claims abstract description 14
- 150000004767 nitrides Chemical class 0.000 claims description 7
- 238000005259 measurement Methods 0.000 abstract description 25
- 238000000034 method Methods 0.000 description 37
- 229910003460 diamond Inorganic materials 0.000 description 20
- 239000010432 diamond Substances 0.000 description 20
- 239000002002 slurry Substances 0.000 description 20
- 239000002245 particle Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 13
- 238000005498 polishing Methods 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 229910002601 GaN Inorganic materials 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000012943 hotmelt Substances 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- 238000000560 X-ray reflectometry Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
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- H01L21/6735—Closed carriers
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- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
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- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
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Abstract
【解決手段】結晶基板の製造方法は、湾曲した結晶格子面13Aを含む結晶基板本体1Aを準備する準備工程と、結晶格子面13Aの形状的特徴を測定する測定工程と、形状的特徴に基づいて結晶格子面13Aが準備工程時における結晶格子面13Aより平坦化されるように、結晶基板本体1Aを反らせた状態で保持する保持工程と、保持された結晶基板本体1Aの表面11Aを平坦化するように加工する加工工程とを含む。
【選択図】図3
Description
以下に、上記製造方法の具体的な実施例を説明する。
厚さが500μmであり、直径が2インチ(50.8mm)のc面、すなわち(0001)面を主面とする、GaNからなる結晶基板本体1を準備した。図7は、実施例1に係る結晶基板本体1の形状を示す斜視図である。実施例1に係る結晶基板本体1の表面11はGa面であり、表面11を上に向けた場合に(0001)面となる結晶格子面が凹形状に反っている。図7においてa面断面41が示されている。結晶基板本体1のGa面(表面11)及びN面(裏面12)はCMP(Chemical Mechanical Polishing)で仕上げられている。結晶基板本体1には結晶方位を示すオリエンテーションフラットが施されている。
線源がCuのKα線のX線回折装置を用いて表面11側から(0002)結晶格子面の分布(形状的特徴)を測定した。結晶格子面分布はa軸<11−20>に沿って12mm間隔で5点、m軸<1−100>に沿って12mm間隔で5点測定することで把握された。図8は、実施例1に係る結晶基板本体1における測定箇所を示す上面図である。a軸に沿った測定点をそれぞれa1〜a5とし、m軸に沿った測定点をそれぞれm1〜m5とする。a3及びm3は同一の場所である。
結晶格子面測定工程のオフ角の曲率半径測定結果から、当接面が凸形状であり、その曲率半径が5.0mである貼り付け用治具を選定した。結晶基板本体1を当接面へ貼り付ける工程は、貼り付け用冶具の当接面を加熱してホットメルトワックスを溶かす工程、ホットメルトワックス上に結晶基板本体1を置く工程、真空引きで結晶基板本体1と当接面との間の気泡を抜く工程、結晶基板本体1を上部からシリコンラバーで加圧する工程、及び結晶基板本体1と当接面とが密着した状態で冷却する工程を含むものであった。貼り付け用治具に接着された結晶基板本体1の中心部は縁部より高くなり、中心部と縁部との高さの差は65μmであった。
次に#600の砥石を用いて表面11の研削加工を行った。結晶基板本体1の中心部から約70μm削ることにより表面11を平坦にした。研削後、貼り付け用冶具を加熱して結晶基板本体1を剥がし、洗浄した。
その後、結晶基板本体1の厚みを均一にするために裏面12を加工した。先ず、裏面12を上に向けて結晶基板本体1を貼り付け用冶具の当接面に貼り付けた。ここでは平坦な当接面を有する貼り付け用冶具を用い、基板保持工程と同様の手順により裏面12を当接面に接着させた。その後、裏面12が平坦になるまで研削処理を行った。その結果、結晶基板本体1の厚みは420μmになった。その後、結晶基板本体1を貼り付け用冶具から外し洗浄した。
平坦な当接面を有する貼り付け用冶具に表面11が上を向くように結晶基板本体1を貼り付けた。表面11を、ダイヤモンドスラリーを用いて研磨をした後、CMPにより加工ダメージを除去するように仕上処理を行った。仕上後の結晶基板本体1の厚さは400μmになった。その後、結晶基板本体1のオフ角の分布を再度評価したが、表1の測定結果と略同一であった。
以下に、基板保持工程において保持される結晶基板本体1の表面11の加工変質層の厚さとクラックとの関係についての実施例を示す。
実施例1と同様に、厚さが500μmであり、直径が2インチ(50.8mm)のc面、すなわち(0001)面を主面とする、GaNからなる複数の結晶基板本体1を準備した。表面11の加工変質層を制御するために、粒径の異なるダイヤスラリーを用いて表面11を研磨し、加工変質層の深さについて調査した。加工変質層の深さは結晶基板本体1の断面をTEMにより観察して評価した。
以下に、曲面形状の当接面を有する貼り付け用冶具から結晶基板本体1を取り外すときの基板表面1の加工変質層の厚さとクラックとの関係についての実施例を示す。
実施例1と同様に、厚さが500μmであり、直径が2インチ(50.8mm)のc面、すなわち(0001)面を主面とする、GaNからなる複数の結晶基板本体1を準備した。曲率半径が3.0mの凸形状の当接面を有する貼り付け用冶具を用いて結晶基板本体1を保持した。結晶基板本体1の貼り付けは実施例1と同様に行った。結晶基板本体1は中心部と縁部との高さの差は108μmであった。#600の砥石を用いて研削加工を行った。結晶基板本体1の中心部から約120μm削ることにより表面11を平坦にした。
5A,5B 結晶基板
11,11A,11B 表面
12,12A,12B 裏面
13,13A,13B 結晶格子面
41 a面断面
D (加工変質層の)厚さ
θ1,θ2 オフ角
Claims (6)
- 湾曲した結晶格子面を含む結晶基板本体を準備する準備工程と、
前記結晶格子面の形状的特徴を測定する測定工程と、
前記形状的特徴に基づいて前記結晶格子面が前記準備工程時における前記結晶格子面より平坦化されるように、前記結晶基板本体を反らせた状態で保持する保持工程と、
保持された前記結晶基板本体の表面を平坦化するように加工する加工工程と、
を含む結晶基板の製造方法。 - 前記準備工程により準備される前記結晶基板本体の前記表面と前記結晶格子面とにより形成されるオフ角の分布は、1つの極値を有する、
請求項1に記載の結晶基板の製造方法。 - 前記加工工程は、前記結晶基板本体の裏面を前記表面に対して平行となるように加工する工程を更に含む、
請求項1又は2に記載の結晶基板の製造方法。 - 前記保持工程は、前記結晶格子面の形状を平坦化する凸形状又は凹形状の当接面に前記結晶基板本体を貼り付ける工程を含む、
請求項1〜3のいずれか1項に記載の結晶基板の製造方法。 - 前記加工工程により加工される部分の変質層の厚さは、1μm以下である、
請求項1〜4のいずれか1項に記載の結晶基板の製造方法。 - 前記結晶基板本体は、13族窒化物の単結晶基板である、
請求項1〜5のいずれか1項に記載の結晶基板の製造方法。
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JP2016106551A JP6714431B2 (ja) | 2016-05-27 | 2016-05-27 | 結晶基板の製造方法 |
US15/600,937 US10325793B2 (en) | 2016-05-27 | 2017-05-22 | Method for producing crystal substrate |
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JP2016106551A JP6714431B2 (ja) | 2016-05-27 | 2016-05-27 | 結晶基板の製造方法 |
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WO2021235067A1 (ja) * | 2020-05-21 | 2021-11-25 | 信越半導体株式会社 | 基板ウェーハの製造方法、及び基板ウェーハ |
US11919125B2 (en) | 2018-09-29 | 2024-03-05 | Corning Incorporated | Carrier wafers and methods of forming carrier wafers |
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