JP2017183578A - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP2017183578A JP2017183578A JP2016070432A JP2016070432A JP2017183578A JP 2017183578 A JP2017183578 A JP 2017183578A JP 2016070432 A JP2016070432 A JP 2016070432A JP 2016070432 A JP2016070432 A JP 2016070432A JP 2017183578 A JP2017183578 A JP 2017183578A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- resin frame
- resin
- lead
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
本発明の実施形態1に係る発光装置1000を図1、図2A、図2B、図3A〜図3Cに基づいて説明する。発光装置1000は、発光素子40と、発光素子40が載置される幅広部21Aと、幅広部から延伸し幅広部21Aよりも幅が狭い幅狭部22Aと、幅狭部22Aから延伸し幅狭部22Aよりも幅が広い端子部23Aと、を備える第一リード20Aと、発光素子40と電気的に接続される第二リード20Bと、第一リード20A及び第二リード20Bを支持し、凸部11を備える樹脂部材10と、発光素子40を囲み、凸部11の少なくとも一部を被覆する樹脂枠50と、を有し、樹脂部材10は、幅広部21Aと幅狭部22Aと端子部23Aとに囲まれる位置に凸部11の少なくとも一部を備える。
図5A〜図5Cに示す本発明の実施形態2に係る発光装置2000は、実施形態1に係る発光装置1000と比較して、凸部11の形状が相違する。その他の点については、実施形態1と同様である。
図6A、図6Bに示す本発明の実施形態3に係る発光装置3000は、実施形態1に係る発光装置1000と比較して、導電部材20の形状と、凸部11の位置と、が相違する。
基体30は、発光素子や保護素子などの電子部品を配置するためのものである。基体30は、樹脂部材10と、導電部材20と、を備える。
樹脂部材10の材料としては、エポキシ樹脂、シリコーン樹脂、BTレジン、ポリアミド樹脂、ポリイミド樹脂、ナイロン樹脂、不飽和ポリエステル等が挙げられる。これらの樹脂材料に、当該分野で公知の着色剤、充填剤、強化繊維等を含有させてもよい。着色剤として、酸化チタン、酸化亜鉛等の白色のフィラーを用いると発光装置の光取り出し効率を向上させることができる。また、熱放射係数の大きいカーボンブラック等の黒色フィラーを含有させることにより、発光素子からの熱を効率的に逃がすことができる。充填剤としては、酸化ケイ素、酸化アルミニウム等が挙げられる。強化繊維としては、ガラス、珪酸カルシウム、チタン酸カリウム等が挙げられる。
導電部材20は、発光素子40等の電子部品に外部電源からの電圧を印加するために用いられる。導電部材20は、第一リード20Aと、第二リード20Bと、を備えている。導電部材20は、z方向に屈曲する部分を有していない板状が好ましい。導電部材20が板状であることにより、基体30の成形が容易になる。
発光素子40は、第一リード20Aの第1面31上に配置される。発光素子40は、電圧を印加することで自ら発光する半導体素子であり、窒化物半導体等から構成される既知の半導体素子を適用できる。発光素子の発光波長は、可視域(380〜780nm)を含め、紫外域から赤外域まで選択することができる。例えば、ピーク波長430〜490nmの発光素子としては、窒化物半導体を用いることができる。その窒化物半導体としては、InXAlYGa1−X−YN(0≦X、0≦Y、X+Y≦1)等を用いることができる。また、発光素子40はサブマウントを介して第1面31上に配置されてもよい。
樹脂枠50は、環状に発光素子40を囲んで設けられる。樹脂枠50が発光素子40を囲んで設けられるため、封止部材70となる未硬化状態の原料を樹脂枠50内に止めることができる。樹脂枠50は、樹脂枠50の元となる未硬化の原料を、樹脂枠50を形成したい領域に配置し、当該原料を硬化させることにより形成される。
発光素子40と第二リード20Bとは、ワイヤ60を介して電気的に接続してもよい。ワイヤ60は、導電性に優れた金属材料を用いることができる。金属材料としては、金やアルミニウム、銅、銀等を用いることができる。ワイヤボンディングの方法としては、ボールボンディング、ウェッジボンディング等の公知の方法を用いてよい。
封止部材70の材料としては、透光性を有する樹脂材料又はガラス材料等を用いることができる。特に、封止部材70の材料に樹脂材料を用いることが好ましい。樹脂部材10及び樹脂枠50がそれぞれ樹脂材料を含有しているので、封止部材70も樹脂材料であることで、封止部材70と樹脂部材10との密着性、及び、封止部材70と樹脂枠50との密着性を向上させることができる。封止部材70の樹脂材料としては、ポリカーボネート樹脂、エポキシ樹脂、フェノール樹脂、シリコーン樹脂、アクリル樹脂、ポリメチルペンテン樹脂、ポリノルボルネン樹脂、又はこれらの変性樹脂やこれらの樹脂を1種以上含むハイブリッド樹脂等を用いることができる。特に、封止部材70の材料としては耐光性に優れたジメチル系シリコーン樹脂、フェニル系シリコーン樹脂が好ましい。
波長変換部材71としては、発光素子からの発光で励起可能な蛍光体の粒子が使用される。例えば、青色発光素子又は紫外線発光素子で励起可能な蛍光体としては、セリウムで賦活されたイットリウム・アルミニウム・ガーネット系蛍光体(YAG:Ce)、セリウムで賦活されたルテチウム・アルミニウム・ガーネット系蛍光体(LAG:Ce)、ユウロピウムおよび/又はクロムで賦活された窒素含有アルミノ珪酸カルシウム系蛍光体(CaO−Al2O3−SiO2:Eu,Cr)、ユウロピウムで賦活されたシリケート系蛍光体((Sr,Ba)2SiO4:Eu)、βサイアロン蛍光体、CASN系蛍光体、SCASN系蛍光体等の室化物系蛍光体;KSF系蛍光体等のフッ化物系蛍光体、硫化物系蛍光体、塩化物系蛍光体、ケイ酸塩系蛍光体、リン酸塩系蛍光体、量子ドット蛍光体などが挙げられる。これらの蛍光体と、青色発光素子又は紫外線発光素子と組み合わせることにより、様々な波長の発光装置を製造することができる。
光拡散材72の材料として、酸化チタン、酸化ジルコニウム、酸化アルミニウム、酸化ケイ素などを用いることができる。特に、酸化チタンは、水分などに対して比較的安定でかつ高屈折率であるため好ましい。
保護素子80は、例えば、発光素子40に逆方向に電圧が印加されたときに、逆方向に流れる電流を阻止したり、発光素子40の動作電圧より高い順方向電圧が印加されたときに発光素子に過電流が流れるのを阻止したりすることができる保護回路や静電保護素子が挙げられる。具体的には、ツェナーダイオードが利用できる。
10 樹脂部材
11 凸部
20 導電部材
20A 第一リード
20B 第二リード
30 基体
31 第1面
32 第2面
40 発光素子
50 樹脂枠
60 ワイヤ
70 封止部材
71 波長変換部材
72 光拡散材
80 保護素子
Claims (13)
- 発光素子と、
前記発光素子が載置される幅広部と、前記幅広部から延伸し前記幅広部よりも幅が狭い幅狭部と、前記幅狭部から延伸し前記幅狭部よりも幅が広い端子部と、を備える第一リードと、
前記発光素子と電気的に接続される第二リードと、
前記第一リード及び第二リードを支持し、凸部を備える樹脂部材と、
前記発光素子を囲み、前記凸部の少なくとも一部を被覆する樹脂枠と、を有し、
前記樹脂部材は、前記幅広部と前記幅狭部と前記端子部とに囲まれる位置に前記凸部の少なくとも一部を備える発光装置。 - 前記凸部が、前記幅広部と前記端子部とから離間する請求項1に記載の発光装置。
- 前記凸部が、前記幅狭部を被覆する請求項1又は請求項2に記載の発光装置。
- 前記凸部は、上面と側面とを備えており、前記上面及び前記側面が前記樹脂枠に被覆される請求項1〜3いずれか1項に記載の発光装置。
- 前記第一リードにおける前記樹脂枠に被覆されている部位と、前記凸部における前記樹脂枠に被覆されている部位との最短距離が前記樹脂枠の幅よりも短い請求項1〜4いずれか1項に記載の発光装置。
- 前記凸部の厚みが、前記樹脂枠の厚みの0.4倍以上1倍未満である請求項1〜5いずれか1項に記載の発光装置。
- 前記樹脂枠が前記凸部の表面の全てを被覆する請求項1〜6いずれか1項に記載の発光装置。
- 前記樹脂部材は、前記凸部を2つ備えており、
前記2つの凸部の間に前記第一リードが位置し、
前記一方の凸部から前記他方の凸部に亘って前記樹脂枠が配置されている請求項1〜7いずれか1項に記載の発光装置。 - 前記発光素子のピーク波長における前記樹脂枠の反射率が、前記発光素子のピーク波長における前記樹脂部材の反射率よりも高い請求項1〜8いずれか1項に記載の発光装置。
- 前記発光素子と前記第二リードとはワイヤによって電気的に接続されており、前記ワイヤと前記第二リードとの接続部は前記樹脂枠によって被覆される請求項1〜9いずれか1項に記載の発光装置。
- 前記樹脂枠がシリコーン樹脂を含有する請求項1〜10いずれか1項に記載の発光装置。
- 前記凸部の形状が円柱である請求項1〜11いずれか1項に記載の発光装置。
- 前記樹脂枠は前記幅狭部を跨ぐ請求項1〜12いずれか1項に記載の発光装置。
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JP6790416B2 (ja) | 2020-11-25 |
CN107275301A (zh) | 2017-10-20 |
US10593847B2 (en) | 2020-03-17 |
EP3226312A1 (en) | 2017-10-04 |
CN107275301B (zh) | 2022-08-02 |
EP3226312B1 (en) | 2021-03-24 |
US20170288104A1 (en) | 2017-10-05 |
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