JP2017175093A - 電子部品、接続体、電子部品の設計方法 - Google Patents

電子部品、接続体、電子部品の設計方法 Download PDF

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Publication number
JP2017175093A
JP2017175093A JP2016062870A JP2016062870A JP2017175093A JP 2017175093 A JP2017175093 A JP 2017175093A JP 2016062870 A JP2016062870 A JP 2016062870A JP 2016062870 A JP2016062870 A JP 2016062870A JP 2017175093 A JP2017175093 A JP 2017175093A
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Japan
Prior art keywords
substrate
electronic component
chip
input
conductive particles
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Pending
Application number
JP2016062870A
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English (en)
Japanese (ja)
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JP2017175093A5 (enrdf_load_stackoverflow
Inventor
昌弘 飯山
Masahiro Iiyama
昌弘 飯山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2016062870A priority Critical patent/JP2017175093A/ja
Priority to KR1020170017403A priority patent/KR20170113039A/ko
Priority to CN201710137728.2A priority patent/CN107978579A/zh
Publication of JP2017175093A publication Critical patent/JP2017175093A/ja
Priority to HK18113948.6A priority patent/HK1254852A1/zh
Publication of JP2017175093A5 publication Critical patent/JP2017175093A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4922—Bases or plates or solder therefor having a heterogeneous or anisotropic structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP2016062870A 2016-03-25 2016-03-25 電子部品、接続体、電子部品の設計方法 Pending JP2017175093A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016062870A JP2017175093A (ja) 2016-03-25 2016-03-25 電子部品、接続体、電子部品の設計方法
KR1020170017403A KR20170113039A (ko) 2016-03-25 2017-02-08 전자 부품, 접속체, 전자 부품의 설계 방법
CN201710137728.2A CN107978579A (zh) 2016-03-25 2017-03-09 电子部件、连接体、电子部件的设计方法
HK18113948.6A HK1254852A1 (zh) 2016-03-25 2018-11-01 电子部件、连接体、电子部件的设计方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016062870A JP2017175093A (ja) 2016-03-25 2016-03-25 電子部品、接続体、電子部品の設計方法

Publications (2)

Publication Number Publication Date
JP2017175093A true JP2017175093A (ja) 2017-09-28
JP2017175093A5 JP2017175093A5 (enrdf_load_stackoverflow) 2019-04-18

Family

ID=59972211

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JP2016062870A Pending JP2017175093A (ja) 2016-03-25 2016-03-25 電子部品、接続体、電子部品の設計方法

Country Status (4)

Country Link
JP (1) JP2017175093A (enrdf_load_stackoverflow)
KR (1) KR20170113039A (enrdf_load_stackoverflow)
CN (1) CN107978579A (enrdf_load_stackoverflow)
HK (1) HK1254852A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114388420A (zh) * 2020-10-19 2022-04-22 重庆康佳光电技术研究院有限公司 临时基板及其制作方法，及微型发光芯片转移方法
JP2022551619A (ja) * 2019-10-07 2022-12-12 エイエムエス－オスラム インターナショナル ゲーエムベーハー 表示デバイスおよび表示ユニット
WO2023190055A1 (ja) * 2022-03-31 2023-10-05 デクセリアルズ株式会社 接続構造体

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017191774A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 異方性導電フィルム
JP7274810B2 (ja) * 2016-05-05 2023-05-17 デクセリアルズ株式会社 異方性導電フィルム
JP7095227B2 (ja) * 2016-05-05 2022-07-05 デクセリアルズ株式会社 異方性導電フィルム
JP7274811B2 (ja) * 2016-05-05 2023-05-17 デクセリアルズ株式会社 異方性導電フィルム
CN111179750A (zh) * 2019-12-12 2020-05-19 武汉华星光电技术有限公司 显示面板的结构和其制作方法
CN111642058A (zh) * 2020-05-08 2020-09-08 欧菲微电子技术有限公司 电路板、电路板组件及电子设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154876A (ja) * 1997-08-05 1999-02-26 Sony Corp 基板端子の接続構造および接続方法
JP2002329806A (ja) * 2001-04-27 2002-11-15 Toshiba Corp 電気回路部品
JP2003286456A (ja) * 2002-03-28 2003-10-10 Asahi Kasei Corp 異方性を有する導電性接着シートおよびその製造方法
WO2008065774A1 (en) * 2006-11-29 2008-06-05 Sharp Kabushiki Kaisha Wiring board and display unit
JP2014222701A (ja) * 2013-05-13 2014-11-27 日立化成株式会社 回路部材、接続構造体及び接続構造体の製造方法
WO2015056518A1 (ja) * 2013-10-15 2015-04-23 デクセリアルズ株式会社 異方性導電フィルム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154876A (ja) * 1997-08-05 1999-02-26 Sony Corp 基板端子の接続構造および接続方法
JP2002329806A (ja) * 2001-04-27 2002-11-15 Toshiba Corp 電気回路部品
JP2003286456A (ja) * 2002-03-28 2003-10-10 Asahi Kasei Corp 異方性を有する導電性接着シートおよびその製造方法
WO2008065774A1 (en) * 2006-11-29 2008-06-05 Sharp Kabushiki Kaisha Wiring board and display unit
JP2014222701A (ja) * 2013-05-13 2014-11-27 日立化成株式会社 回路部材、接続構造体及び接続構造体の製造方法
WO2015056518A1 (ja) * 2013-10-15 2015-04-23 デクセリアルズ株式会社 異方性導電フィルム

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022551619A (ja) * 2019-10-07 2022-12-12 エイエムエス－オスラム インターナショナル ゲーエムベーハー 表示デバイスおよび表示ユニット
JP7392129B2 (ja) 2019-10-07 2023-12-05 エイエムエス－オスラム インターナショナル ゲーエムベーハー 表示デバイスおよび表示ユニット
US12249597B2 (en) 2019-10-07 2025-03-11 Osram Opto Semiconductors Gmbh Display device and display unit
CN114388420A (zh) * 2020-10-19 2022-04-22 重庆康佳光电技术研究院有限公司 临时基板及其制作方法，及微型发光芯片转移方法
CN114388420B (zh) * 2020-10-19 2025-02-18 重庆康佳光电科技有限公司 临时基板及其制作方法，及微型发光芯片转移方法
WO2023190055A1 (ja) * 2022-03-31 2023-10-05 デクセリアルズ株式会社 接続構造体

Also Published As

Publication number Publication date
CN107978579A (zh) 2018-05-01
HK1254852A1 (zh) 2019-07-26
KR20170113039A (ko) 2017-10-12

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