WO2015056518A1 - 異方性導電フィルム - Google Patents

異方性導電フィルム Download PDF

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Publication number
WO2015056518A1
WO2015056518A1 PCT/JP2014/074639 JP2014074639W WO2015056518A1 WO 2015056518 A1 WO2015056518 A1 WO 2015056518A1 JP 2014074639 W JP2014074639 W JP 2014074639W WO 2015056518 A1 WO2015056518 A1 WO 2015056518A1
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WIPO (PCT)
Prior art keywords
resin composition
insulating resin
layer
melt viscosity
minimum melt
Prior art date
Application number
PCT/JP2014/074639
Other languages
English (en)
French (fr)
Inventor
誠一郎 篠原
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to CN201480054891.7A priority Critical patent/CN105594063A/zh
Priority to US15/027,607 priority patent/US10424538B2/en
Priority to KR1020167008804A priority patent/KR20160050078A/ko
Publication of WO2015056518A1 publication Critical patent/WO2015056518A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83862—Heat curing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/38—Effects and problems related to the device integration
    • H01L2924/381—Pitch distance

Definitions

  • the present invention relates to an anisotropic conductive film.
  • the driving IC and the substrate are anisotropically conductively connected via an anisotropic conductive film, and the display elements in recent years have become more precise and functional.
  • the bumps of such ICs are also narrowed.
  • conductive particles are dispersed on the adhesive layer of the adhesive sheet in which the adhesive layer is formed on the base sheet, and the conductive particles not in contact with the adhesive layer are removed by air blowing to form a single conductive particle-containing layer.
  • the base sheet on which the conductive particle-containing layer is formed is biaxially stretched at a predetermined stretch ratio so that the intended interparticle distance can be obtained, thereby arranging the conductive particles as a single layer (Patent Document 1).
  • the conductive particles can be arranged in a single layer by arranging conductive particles in a specific region of the magnetic medium, removing the excessively attached conductive particles, and then transferring the arranged conductive particles to an insulating adhesive film. It has been proposed (Patent Document 2). In these cases, it is considered that by reducing the particle size of the conductive particles and increasing the density of the conductive particles in the anisotropic conductive film, it becomes easy to cope with the narrow pitch.
  • An object of the present invention is to solve the above-described problems of the conventional technology, and when an anisotropic conductive film is used to connect electrical components with a narrow pitch using an anisotropic conductive film, a short circuit occurs.
  • production is suppressed and it is enabling it to suppress that conduction
  • each resin composition in which the object of the present invention can be achieved by adjusting the minimum melt viscosity of the present invention, and have completed the present invention.
  • the present invention is an anisotropic conductive film in which a conductive particle-containing layer in which conductive particles are arranged in a single layer in a layered binder resin composition is laminated on at least a first insulating resin composition layer.
  • an anisotropic conductive film in which the minimum melt viscosity of the binder resin composition is not less than the minimum melt viscosity of the first insulating resin composition.
  • This anisotropic conductive film of the present invention includes the following aspects.
  • a second insulating resin composition layer is further laminated on the surface of the conductive particle-containing layer opposite to the first insulating resin composition layer, and the minimum melt viscosity of the binder resin composition is A mode higher than the minimum melt viscosity of the second insulating resin composition.
  • This embodiment is an embodiment in which the minimum melt viscosity of one of the first insulating resin composition and the second insulating resin composition is higher than the other minimum melt viscosity, or the first insulating resin composition
  • An embodiment in which the layer thickness is thicker than the other layer thickness is included.
  • the present invention is also a connection body obtained by anisotropically connecting the terminals of the first electrical component and the terminals of the second electrical component through the anisotropic conductive film of the present invention,
  • a connection body characterized in that a conductive particle-containing layer is in a curved state when a cross section is observed from a side surface direction.
  • the anisotropic conductive film of the present invention at least a conductive particle-containing layer in which conductive particles are arranged in a single layer in a layered binder resin composition is laminated on the first insulating resin composition layer.
  • the minimum melt viscosity of the resin composition is adjusted to be equal to or higher than the minimum melt viscosity of the first insulating resin composition. For this reason, the terminal of the first electrical component and the terminal of the second electrical component are arranged so that the anisotropic conductive film is placed between them and the first insulating resin composition layer is on the first electrical component side.
  • connection body is formed by arranging anisotropic conductive connections and observing from the plane direction of the connection surface, the conductive particles 1 blended at a high particle density are continuously arranged as shown in FIG. 1A. It also seems to short-circuit between the electrodes 2 due to contact. However, as shown in FIG. 1B, when observed from the cross-sectional direction along line AA, the conductive particles containing the thermocompression bonded between the terminal 3a of the first electrical component 3 and the terminal 4a of the second electrical component 4 are contained.
  • the layer 10 is pushed to the opposite side of the first insulating resin composition layer 11 to bend, and as a result, the conductive particles 1 move to the second electric component 4 side, and the conductive particles 1 are separated from each other in the thickness direction. Therefore, the occurrence of a short circuit is suppressed, and the decrease in conduction reliability is also suppressed.
  • the resin components are often mixed with each other, and the interface between them is often unclear.
  • the first insulating resin composition layer 11 may also enter the second electrical component 4 side of the conductive particle-containing layer 10.
  • FIG. 1B shows a state in which the first insulating resin composition layer 11 has also entered the second electrical component 4 side of the conductive particle-containing layer 10 as described above.
  • a second insulating resin composition layer is further laminated on the surface of the conductive particle-containing layer opposite to the first insulating resin composition layer, and the minimum melt viscosity of the binder resin composition is When it is higher than the minimum melt viscosity of the second insulating resin composition, the minimum melt viscosity of either the first insulating resin composition or the second insulating resin composition is higher than the minimum melt viscosity of the other. It can be expensive. As shown in FIG.
  • the conductive particle-containing layer 22 is As a result, the conductive particles are pressed and curved toward the first insulating resin composition having the lowest minimum melt viscosity. As a result, the conductive particles are separated from each other in the thickness direction.
  • the conductive particle-containing layer 22, the first insulating resin composition layer 20, and the second insulating resin composition layer 21 may be mixed with resin components and the interface between them may be unclear. Many.
  • the thickness of one of the first insulating resin composition layer 30 and the second insulating resin composition layer 31 may be greater than the thickness of the other layer. . If the layer thickness of the first insulating resin composition layer is thicker than the layer thickness of the second insulating resin composition layer 31, the conductive particle-containing layer 32 has the second insulating property with a small layer thickness.
  • the conductive particles are pushed into the resin composition layer 31 and bent, and as a result, the conductive particles are separated from each other in the thickness direction, so that the occurrence of a short circuit is suppressed and the decrease in conduction reliability is also suppressed.
  • the conductive particle-containing layer 32, the first insulating resin composition layer 30, and the second insulating resin composition layer 31 may be mixed with resin components and the interface between them may be unclear. Many.
  • the conductive particle-containing layer is placed on the side where the terminal height is low. May be able to be pushed and curved.
  • FIG. 1A is a plan perspective view of a connection body. 1B is a cross-sectional view taken along line AA in FIG. 1A.
  • FIG. 2 is a cross-sectional view of the connection body.
  • FIG. 3 is a cross-sectional view of the connection body.
  • FIG. 4 is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 5 is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 6A is an explanatory diagram of a device configuration for arranging a single layer of conductive particles.
  • FIG. 6B is an explanatory diagram of an apparatus configuration for arranging a single layer of conductive particles.
  • FIG. 6C is a cross-sectional view of a conductive squeegee.
  • the anisotropic conductive film 40 of the present invention includes at least a first insulating resin composition layer 41 and conductive particles 42 arranged in a single layer in a layered binder resin composition 43.
  • the conductive particle-containing layer 44 has a laminated structure, and the minimum melt viscosity of the binder resin composition is equal to or higher than the minimum melt viscosity of the insulating resin composition. If the minimum melt viscosity of the binder resin composition is equal to or higher than the minimum melt viscosity of the first insulating resin composition, the conductive particle-containing layer 44 may be curved between adjacent terminals during anisotropic conductive connection. It becomes easy.
  • the minimum melt viscosity is a value measured with a viscoelasticity measuring device (Rheometer RS150, Haake).
  • the minimum melt viscosity of the first insulating resin composition layer 41 is preferably adjusted to 10 to 5000 mPa ⁇ s, more preferably 50 to 3000 mPa ⁇ s from the viewpoint of uniform fluidity.
  • the minimum melt viscosity can be adjusted by selecting the type of constituent components of the resin composition, selecting the blending ratio, performing preliminary heating or UV irradiation.
  • the layer thickness of the first insulating resin composition layer 41 is preferably 0.5 to 30 ⁇ m, more preferably 3 to 20 ⁇ m from the viewpoint of preventing short circuit after connection.
  • the first insulating resin composition layer 41 is a layer formed of an insulating thermoplastic resin composition, an insulating thermosetting resin composition, or an insulating photocurable resin composition.
  • the component constitution of these resin compositions can be appropriately selected from known component constitutions, but since most anisotropic conductive connection is carried out by thermocompression bonding, the thermosetting resin composition A configuration is preferable.
  • the polymerization type of the thermosetting resin composition may be thermal radical polymerization, thermal cationic polymerization, or thermal anion polymerization, but thermal cationic polymerization is preferred from the viewpoint of rapid curing at low temperature and connection stability.
  • thermal cationic polymerization type curable resin composition examples include 5 to 80 parts by mass (preferably 10 to 70 parts by mass) of a thermal cationic polymerization compound such as an epoxy compound, an oxetane compound and a vinyl ether compound, and an aromatic sulfonium salt. 0.2-30 parts by mass (preferably 0.5-20 parts by mass) of a thermal cationic polymerization initiator such as 5 and 95 parts by mass (preferably 10-90 parts by mass) of a film forming resin such as a phenoxy resin. Preferable examples include mixed compositions. If necessary, the thermal cationic polymerization type curable resin composition may contain additives such as a silane coupling agent, a rust inhibitor, a colorant, and a solvent.
  • additives such as a silane coupling agent, a rust inhibitor, a colorant, and a solvent.
  • the conductive particle-containing layer 44 has a structure in which the conductive particles 42 are arranged in a single layer on a layered binder resin composition 43.
  • the method of arranging the conductive particles 42 in a single layer in the layered binder resin composition 43 is not particularly limited as long as the effects of the invention are not impaired.
  • the methods disclosed in Patent Documents 1 and 2 mentioned in the section of the prior art can be employed.
  • conductive particles constituting a known anisotropic conductive film can be employed.
  • examples thereof include metal particles such as nickel, and metal-coated resin particles in which a metal plating film such as nickel is formed on the surface of the resin core.
  • An insulating thin film may be formed as necessary.
  • the average particle diameter of the conductive particles 42 is preferably 1 to 20 ⁇ m, more preferably 2 to 10 ⁇ m, from the viewpoint of contact between the terminal to be connected and the conductive particles.
  • Conductive particle density in the conductive particle-containing layer 44 from the viewpoint of preventing short-circuit, preferably 5000 to 80,000 / mm 2, more preferably from 10,000 to 60,000 / mm 2.
  • the distance between adjacent conductive particles is preferably 1 ⁇ m or more, more preferably 1 ⁇ m or more, more preferably 30 ⁇ m or more, particularly preferably 2 ⁇ m or more, from the viewpoint of short circuit prevention. It is within 20 times the conductive particle diameter.
  • This inter-particle distance means a distance from any conductive particle arranged to the closest conductive particle.
  • the conductive particles selected to determine the interparticle distance exist independently without being aggregated.
  • the binder resin composition 43 constituting the conductive particle-containing layer 44 is the same as the first insulating resin composition except that the minimum melt viscosity is not less than the minimum melt viscosity of the first insulating resin composition. It can be set as the same structure.
  • the layer thickness of the conductive particle-containing layer 44 is preferably 0.3 to 3 times, more preferably 0.5 to 2 times the conductive particle diameter, from the viewpoint of stabilizing the retention of the conductive particles.
  • the anisotropic conductive film 50 is further provided with a second insulating film on the surface of the conductive particle-containing layer 44 on the side opposite to the first insulating resin composition layer 41.
  • the resin composition layer 51 has a laminated structure. Also in this aspect, the minimum melt viscosity of the binder resin composition 43 constituting the conductive particle-containing layer 44 is higher than the minimum melt viscosity of the first and second insulating resin composition layers 41 and 51.
  • the conductive particle-containing layer 44 is adjacent to each other during anisotropic conductive connection. It becomes easy to bend between terminals.
  • the second insulating resin composition layer 51 can have the same configuration as the first insulating resin composition layer 41 with respect to the constituent components and the layer thickness.
  • the minimum melt viscosity of the first insulating resin composition and the minimum melt viscosity of the second insulating resin composition may be the same, but the contact between the conductive particles is stabilized by stabilizing the flow. From the standpoint of prevention, it is preferable that one is higher than the other minimum melt viscosity. In this case, the difference between the two is preferably adjusted to 50 to 10000 mPa ⁇ s, more preferably 100 to 5000 mPa ⁇ s from the viewpoint of controlling the direction of flow.
  • the first insulation is preferably 1 to 20 ⁇ m, more preferably 2 to 15 ⁇ m thicker than the thickness of the other layer.
  • the anisotropic conductive film having the structure shown in FIG. 4 can be manufactured by various methods. One example will be described below.
  • the thermal cation polymerizable compound, the thermal cation polymerization initiator, and the film-forming resin are dissolved in a solvent such as ethyl acetate or toluene so that the solid content is 50%, and the resulting solution is removed from the release PET base.
  • the first insulating resin composition layer is applied onto the peeled PET base film by applying to the film by a known method so as to have a predetermined dry thickness, and drying in an oven at 50 to 80 ° C. for 3 to 10 minutes, for example. Can be created.
  • a wiring substrate 62 is prepared in which a line electrode 61 having a predetermined electrode width a, an interelectrode distance b, and an electrode depth c is provided on an insulating substrate 60. A positive potential is applied to 61. Conductive particles 63 are dispersed on the surface of the wiring board 62. Next, a charger 64 for positively charging the conductive particles 63 is arranged on the wiring substrate 62 so as to be orthogonal to the line electrode 61 and to be movable in the length direction on the line electrode 61.
  • a conductive squeegee 65 for squeezing the conductive particles 63 positively charged by the charger 64 is set on the wiring board 62.
  • a conductive squeegee 65 for squeezing the conductive particles 63 positively charged by the charger 64 is set on the wiring board 62.
  • rectangular convex portions 65a corresponding to the line-shaped electrode width a and concave portions 65b corresponding to the interelectrode distance b are alternately provided (FIG. 6C).
  • the charger 64 is moved in the length direction of the line electrode 61 while the conductive particles 63 are positively charged by the charger 64.
  • the positively charged conductive particles 63 are concentrated between the line electrodes 61 to which a positive potential is applied.
  • the conductive squeegee 65 is squeezed on the surface of the wiring board 62 so that the rectangular convex portion 65 a comes into contact with the line electrode 61. Thereby, the single-layer conductive particles 63 can be arranged in a line between the line-shaped electrodes 61.
  • the binder resin composition layer formed on the peeled PET base film which was prepared in the same manner as the first insulating resin composition, was thermocompression-bonded to the conductive particles arranged in a line shape at a level at which the binder resin composition layer was not fully cured. Transfer is performed so as to embed conductive particles in the resin composition layer, whereby a conductive particle-containing layer can be formed on the peeled PET base film.
  • a method of arranging the conductive particles a known method such as a method using a stretched film or a method of transferring using a mold can be employed.
  • Regularity means a sequence that is not a random sequence.
  • the first insulating resin composition layer prepared as described above and the conductive particle-containing layer are opposed to each other and integrated by thermocompression bonding at a level that does not cause the main curing, whereby the anisotropic structure shown in FIG. Conductive film can be obtained.
  • the anisotropic conductive film having the structure shown in FIG. 5 can be manufactured by various methods. One example will be described below.
  • a first insulating resin composition layer and a conductive particle-containing layer are prepared. Further, a second insulating resin composition layer is prepared in the same manner as the first insulating resin composition layer.
  • the anisotropic conductive film of the present invention is provided between a terminal (for example, a bump) of a first electric component (for example, an IC chip) and a terminal (for example, a bump or pad) of a second electric component (for example, a wiring board).
  • the connection body is obtained by arranging in the above-described manner and carrying out main curing from the first or second electric component side by thermocompression bonding and anisotropic conductive connection. When this connection body is observed from the plane direction, the adjacent electrodes may appear to be short-circuited as shown in FIG. 1A, but when this cross section is observed from the side direction, as shown in FIG.
  • the conductive particle-containing layer is curved, the conductive particles are not in contact with each other, and the planar direction is insulated. Therefore, in the connection body, occurrence of a short circuit is suppressed and a decrease in conduction reliability is also suppressed.
  • the regularity of the particles works effectively to suppress short-circuiting, considering that the conductive particles appear to be in contact with each other in the observation from the planar direction.
  • the conductive particle-containing layer is in a curved state when the arranged conductive particles are regarded as a group, the group exhibits flexibility.
  • Examples 1 to 8, Comparative Examples 1 and 2 (Formation of first insulating resin composition layer)
  • a first insulating resin composition mixed solution of 50% solid content was prepared using toluene, and this mixed solution was applied to a peeled PET base sheet as shown in Table 1. It apply
  • the minimum melt viscosity of the first insulating resin composition layer was measured with a viscoelasticity measuring device (Rheometer RS150, Haake), and the results are shown in Table 1.
  • Second insulating resin composition layer (Formation of second insulating resin composition layer) According to the composition shown in Table 1 (unit: parts by mass), a second insulating resin composition mixed solution of 50% solid content is prepared using toluene, and this mixed solution is applied to the peeled PET base sheet as shown in Table 1. It apply
  • Electrode width in Table 1 distance between electrodes: 3.5 ⁇ m, electrode depth: 3.5 ⁇ m
  • conductive particles having an average particle diameter of 3 ⁇ m (AUL703, Sekisui) on the wiring board. Chemical Industry Co., Ltd.) was arranged in a single layer in a line at the particle density shown in Table 1.
  • the conductive particles are arranged on the binder resin composition layer by arranging a binder resin composition layer on the conductive particles arranged in a single layer in this line shape and laminating at 40 ° C. and 0.1 MPa from the peeled PET base sheet side.
  • a conductive particle-containing layer having the indented structure and having a thickness of Table 1 was formed.
  • the first insulating resin composition layer is disposed on the surface of the conductive particle-containing layer on the side where the conductive particles are pressed, and the second insulating resin composition layer is disposed on the other surface.
  • An anisotropic conductive film was prepared by laminating at 1 MPa.
  • Example 9 An anisotropic conductive film having a two-layer structure was prepared in accordance with the operation performed in Example 1 except that the second insulating resin composition layer was not used.
  • Example 10 An anisotropic conductive film having a two-layer structure was prepared in accordance with the operation performed in Example 1 except that the first insulating resin composition layer was not used.
  • the short-circuit occurrence rate was calculated by “number of short-circuits / total number of 7.5 ⁇ m spaces”. Practically, it is desirably 100 ppm or less.
  • Initial conduction resistance The initial conduction resistance of the connection body immediately after preparation was measured using a commercially available resistance measuring instrument. Practically, it is desired to be 10 ⁇ or less.
  • the anisotropic connection portion of the connection structure is cut in a direction perpendicular to the planar direction and perpendicular to the line-shaped conductive particle array, and the cut surface is observed with a microscope to obtain “conductive particles.
  • the bending direction of the containing layer was examined. When the curvature of the conductive particle-containing layer existing in the space between the bumps in the plane direction of the connection body is convex toward the first insulating resin composition layer side, the bending direction is “up”, and the second insulating resin The curve direction was defined as “down” when the composition layer was convex.
  • connection structure is cut in a direction perpendicular to the planar direction and perpendicular to the line-shaped conductive particle array, and the cut surface is observed with a microscope to obtain “conductive particles.
  • the bending length of the containing layer was determined.
  • the shortest distance from the straight line extending in the horizontal direction between the centers of the opposing bumps that were anisotropically conductively connected to the tip of the curved convex portion of the conductive particle-containing layer was defined as the “curved length of the conductive particle-containing layer”.
  • connection between conductive particles The anisotropic connection portion of the connection structure is cut in a direction perpendicular to the planar direction and perpendicular to the line-shaped conductive particle array, and the cut surface is observed with a microscope to obtain “conductive particles. "Distance” was calculated. The distance between the adjacent conductive particles in the conductive particle-containing layer existing in the space between the bumps in the planar direction of the connection body was defined as “distance between the conductive particles”.
  • the minimum melt viscosity of the binder resin composition constituting the conductive particle-containing layer is equal to or higher than the minimum melt viscosity of the first insulating resin composition.
  • the particle-containing layer was convexly curved toward the wiring board side. For this reason, the initial conduction resistance was also low, and the conduction reliability after the high temperature and high humidity load test was also high. Moreover, the occurrence of a short circuit was also suppressed.
  • the minimum melt viscosity of the binder resin composition constituting the conductive particle-containing layer is equal to or higher than the minimum melt viscosity of the second insulating resin composition.
  • the particle-containing layer was convexly curved toward the IC chip. For this reason, the initial conduction resistance was also low, and the conduction reliability after the high temperature and high humidity load test was also high. Moreover, the occurrence of a short circuit was also suppressed.
  • the minimum melt viscosity of the binder resin composition constituting the conductive particle-containing layer is the minimum melt viscosity of the first and second insulating resin compositions. Higher. Moreover, the minimum melt viscosity of one of the first insulating resin composition and the second insulating resin composition is higher than the other minimum melt viscosity. For this reason, the conductive particle-containing layer in the connection body was convexly curved toward the insulating resin composition layer exhibiting a lower minimum melt viscosity. For this reason, the initial conduction resistance was also low, and the conduction reliability after the high temperature and high humidity load test was also high. Moreover, the occurrence of a short circuit was also suppressed.
  • the minimum melt viscosity of the binder resin composition constituting the conductive particle-containing layer is higher than the minimum melt viscosity of the first and second insulating resin compositions.
  • the minimum melt viscosity of the first insulating resin composition and the second insulating resin composition was the same.
  • the bump height of the IC chip is much larger than the electrode height of the wiring board, the conductive particle-containing layer in the connection body is convexly curved toward the first insulating resin composition layer side on the IC chip side. did. For this reason, the initial conduction resistance was also low, and the conduction reliability after the high temperature and high humidity load test was also high. Moreover, the occurrence of a short circuit was also suppressed.
  • the minimum melt viscosity of the binder resin composition constituting the conductive particle-containing layer is higher than the minimum melt viscosity of the first and second insulating resin compositions.
  • the minimum melt viscosity of the first insulating resin composition and the second insulating resin composition was the same.
  • the layer thickness of the first insulating resin composition is much thicker than the layer thickness of the second insulating resin composition, the conductive particle-containing layer in the connection body is the second on the wiring board side. It was convexly curved toward the insulating resin composition layer side. For this reason, the initial conduction resistance was also low, and the conduction reliability after the high temperature and high humidity load test was also high. Moreover, the occurrence of a short circuit was also suppressed.
  • the anisotropic conductive film of Comparative Example 1 and the anisotropic conductive film of Comparative Example 2 have different conductive particle densities, but the first insulating resin composition, the binder resin composition, and the second The minimum melt viscosity of the insulating resin composition was the same. For this reason, the connection body using the anisotropic conductive film of Comparative Example 1 had a high incidence of short circuit. The connection body using the anisotropic conductive film of Comparative Example 2 had low conduction reliability.
  • anisotropic conductive film of the present invention when an anisotropic conductive film is used to make an anisotropic conductive connection between narrowed electrical components, the occurrence of a short circuit is suppressed, and a high temperature and high humidity environment is achieved. It can suppress that conduction

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Abstract

　狭ピッチ化された電気部品同士を異方性導電接続する際に、ショートの発生を抑制し、高温高湿環境下での保管により導通信頼性が低下することを抑制できる異方性導電フィルムは、少なくとも、第一の絶縁性樹脂組成物層上に、導電粒子が層状のバインダ樹脂組成物に単層配列されてなる導電粒子含有層が積層された構造を有する。ここで、バインダ樹脂組成物の最低溶融粘度は、第一の絶縁性樹脂組成物の最低溶融粘度以上である。また、導電粒子含有層の、第一の絶縁性樹脂組成物層と反対面に、更に第二の絶縁性樹脂組成物層が積層されていてもよい。その場合、バインダ樹脂組成物の最低溶融粘度は、第一及び第二の絶縁性樹脂組成物の最低溶融粘度より高い。

Description

異方性導電フィルム
　本発明は、異方性導電フィルムに関する。
　液晶パネルや有機ＥＬパネル等の多くの表示素子においては、駆動ＩＣと基板とが異方性導電フィルムを介して異方性導電接続されており、近年の表示素子の高精細化と高機能化とを実現するために、そのようなＩＣのバンプも狭ピッチ化している。
　従来、ＩＣバンプの狭ピッチ化に対応するために、異方性導電フィルム中で導電粒子を単層で配列することが提案されている。たとえば、ベースシートに接着剤層を形成した接着シートの当該接着剤層に導電粒子を散布し、接着剤層に接触していない導電粒子をエアブローで取り除いて単層の導電粒子含有層を形成し、その導電粒子含有層が形成されたベースシートを、意図した粒子間距離が得られるように所定の延伸倍率で２軸延伸することで、導電粒子を単層配列することや（特許文献１）、磁性媒体の特定領域に導電粒子を配置させ、過剰に付着した導電粒子を取り除いた後、配置された導電粒子を絶縁性接着剤フィルムに転写することで、導電粒子を単層配列することが提案されている（特許文献２）。これらの場合、導電粒子の粒径を小さくし、異方性導電フィルム中の導電粒子密度を高くすることで、狭ピッチ化に対応し易くなると考えられている。
特許第４７８９７３８号 特許第４８８７７００号
　しかしながら、特許文献１～２の技術を利用して作成された、導電粒子含有層のみの単層タイプの異方性導電フィルムや、更に絶縁性樹脂組成物層を積層した２層構造タイプの異方性導電フィルムは、ＩＣチップの高レベルの狭ピッチ化に十分に対応できない場合があった。具体的には、そのような異方性導電フィルムを使用して電気部品同士を異方性導電接続した際に、ショートの発生が増大したり、高温高湿環境下での保管により導通抵抗が増大して導通信頼性が低下するという問題が発生する場合があった。
　本発明の目的は、以上の従来の技術の問題点を解決することであり、異方性導電フィルムを使用して狭ピッチ化された電気部品同士を異方性導電接続した際に、ショートの発生を抑制し、高温高湿環境下での保管により導通信頼性が低下することを抑制できるようにすることである。
　本発明者は、少なくとも、第一の絶縁性樹脂組成物層上に、導電粒子が層状のバインダ樹脂組成物に単層配列されてなる導電粒子含有層が積層された異方性導電フィルムにおいて、あるいは、第一の絶縁性樹脂組成物層と反対側の導電粒子含有層の表面に、更に第二の絶縁性樹脂組成物層が積層されている異方性導電フィルムにおいて、それぞれの樹脂組成物の最低溶融粘度を調整することにより本願発明の目的を達成できることを見出し、本発明を完成させるに至った。
　即ち、本発明は、少なくとも、第一の絶縁性樹脂組成物層上に、導電粒子が層状のバインダ樹脂組成物に単層配列されてなる導電粒子含有層が積層された異方性導電フィルムであって、
　バインダ樹脂組成物の最低溶融粘度が、第一の絶縁性樹脂組成物の最低溶融粘度以上である異方性導電フィルムを提供する。本発明のこの異方性導電フィルムは以下の態様を包含する。
　導電粒子含有層の、第一の絶縁性樹脂組成物層と反対面に、更に第二の絶縁性樹脂組成物層が積層されており、バインダ樹脂組成物の最低溶融粘度が、第一及び第二の絶縁性樹脂組成物の最低溶融粘度より高い態様。
　なお、この態様は、第一の絶縁性樹脂組成物と第二の絶縁性樹脂組成物の一方の最低溶融粘度が、他方の最低溶融粘度よりも高い態様や、第一の絶縁性樹脂組成物の最低溶融粘度と第二の絶縁性樹脂組成物の最低溶融粘度とが同一もしくは略同一である場合に、第一の絶縁性樹脂組成物層及び第二の絶縁性樹脂組成物層の一方の層厚が他方の層厚よりも厚い態様を包含する。
　本発明は、また、第一の電気部品の端子と第二の電気部品の端子とを、本発明の異方性導電フィルムを介して異方性導電接続してなる接続体であって、その断面を側面方向から観察したときに、導電粒子含有層が湾曲した状態になることを特徴とする接続体を提供する。
　少なくとも、第一の絶縁性樹脂組成物層上に、導電粒子が層状のバインダ樹脂組成物に単層配列されてなる導電粒子含有層が積層された本発明の異方性導電フィルムにおいては、バインダ樹脂組成物の最低溶融粘度が、第一の絶縁性樹脂組成物の最低溶融粘度以上に調整されている。このため、第一の電気部品の端子と第二の電気部品の端子とを、それらの間に異方性導電フィルムを第一の絶縁性樹脂組成物層が第一の電気部品側になるように配置して異方性導電接続して接続体を作成した場合、その接続面の平面方向から観察すると、図１Ａのように、高粒子密度で配合された導電粒子１同士が互いに連続的に接触して電極２間をショートさせてしまうようにも見える。しかし、図１Ｂに示すように、Ａ－Ａ線断面方向から観察したときには、第一の電気部品３の端子３ａと第二の電気部品４の端子４ａとの間で熱圧着された導電粒子含有層１０が第一の絶縁性樹脂組成物層１１と反対側に押し込まれて湾曲し、その結果、導電粒子１が第二の電気部品４側に移動し、厚み方向で導電粒子１同士が離隔するので、ショートの発生が抑制され、導通信頼性の低下も抑制される。この場合、導電粒子含有層１０と第一の絶縁性樹脂組成物層１１とは、樹脂成分が互いに混ざり合い、それらの界面が不明確になる場合が多い。また、導電粒子含有層１０の第二の電気部品４側にも第一の絶縁性樹脂組成物層１１が入り込む場合がある。図１Ｂは、そのように、導電粒子含有層１０の第二の電気部品４側にも第一の絶縁性樹脂組成物層１１が入り込んでいる様子を示している。
　また、第一の絶縁性樹脂組成物層と反対側の導電粒子含有層の表面に、更に第二の絶縁性樹脂組成物層が積層され、バインダ樹脂組成物の最低溶融粘度が、第一及び第二の絶縁性樹脂組成物の最低溶融粘度より高い場合、第一の絶縁性樹脂組成物と第二の絶縁性樹脂組成物のいずれか一方の最低溶融粘度が、他方の最低溶融粘度よりも高い場合が考えられる。図２に示すように、仮に第一の絶縁性樹脂組成物層２０の最低溶融粘度が第二の絶縁性樹脂組成物２１の最低溶融粘度よりも低い場合には、導電粒子含有層２２が、最低溶融粘度が低い第一の絶縁性樹脂組成物側に押し込まれて湾曲し、その結果、厚み方向で導電粒子同士が離隔するので、ショートの発生が抑制され、導通信頼性の低下も抑制される。この場合、導電粒子含有層２２と第一の絶縁性樹脂組成物層２０と第二の絶縁性樹脂組成物層２１とは、樹脂成分が互いに混ざり合い、それらの界面が不明確になる場合が多い。
　なお、第一の絶縁性樹脂組成物の最低溶融粘度と第二の絶縁性樹脂組成物の最低溶融粘度とが同一もしくは略同一である場合、導電粒子含有層の湾曲を形成できないようにも考えられるが、図３に示すように、第一の絶縁性樹脂組成物層３０及び第二の絶縁性樹脂組成物層３１のいずれか一方の層厚が他方の層厚よりも厚くなる場合がある。仮に第一の絶縁性樹脂組成物層の層厚が第二の絶縁性樹脂組成物層３１の層厚よりも厚い場合には、導電粒子含有層３２は、層厚の薄い第二の絶縁性樹脂組成物層３１側に押し込まれて湾曲し、その結果、厚み方向で導電粒子同士が離隔するので、ショートの発生が抑制され、導通信頼性の低下も抑制される。この場合、導電粒子含有層３２と第一の絶縁性樹脂組成物層３０と第二の絶縁性樹脂組成物層３１とは、樹脂成分が互いに混ざり合い、それらの界面が不明確になる場合が多い。
　なお、第一の電気部品の端子（例えばバンプ）の高さと、第二の電気部品の端子（例えばバンプ）の高さとが互いに大きく異なる場合には、端子高さが低い側に導電粒子含有層を押し込み、湾曲させることが可能になる場合がある。
図１Ａは、接続体の平面透視図である。 図１Ｂは、図１ＡのＡ－Ａ線断面図である。 図２は、接続体の断面図である。 図３は、接続体の断面図である。 図４は、本発明の異方性導電フィルムの断面図である。 図５は、本発明の異方性導電フィルムの断面図である。 図６Ａは、導電粒子を単層配列するための装置構成説明図である。 図６Ｂは、導電粒子を単層配列するための装置構成説明図である。 図６Ｃは、導電スキージの断面図である。
＜異方性導電フィルム＞
　本発明の異方性導電フィルム４０は、図４に示すように、少なくとも、第一の絶縁性樹脂組成物層４１に、導電粒子４２が層状のバインダ樹脂組成物４３に単層配列されてなる導電粒子含有層４４が積層された構造を有し、バインダ樹脂組成物の最低溶融粘度が、絶縁性樹脂組成物の最低溶融粘度以上であることを特徴とする。バインダ樹脂組成物の最低溶融粘度が、第一の絶縁性樹脂組成物の最低溶融粘度以上であれば、異方性導電接続の際に導電粒子含有層４４を、隣接端子間で湾曲させることが容易となる。ここで、最低溶融粘度は、粘弾性測定装置（レオメーターＲＳ１５０、ハーケ社）で測定した値である。
＜第一の絶縁性樹脂組成物層＞
　第一の絶縁性樹脂組成物層４１の最低溶融粘度は、均一な流動性の点から、好ましくは１０～５０００ｍＰａ・ｓ、より好ましくは５０～３０００ｍＰａ・ｓに調整する。最低溶融粘度の調整は、樹脂組成物の構成成分の種類の選択、配合割合の選択、予備的な加熱もしくはＵＶ照射の実施等により行うことができる。
　第一の絶縁性樹脂組成物層４１の層厚は、接続後の短絡防止の点から、好ましくは０．５～３０μｍ、より好ましくは３～２０μｍである。
　第一の絶縁性樹脂組成物層４１は、絶縁性熱可塑性樹脂組成物、絶縁性熱硬化性樹脂組成物、あるいは絶縁性光硬化性樹脂組成物により形成された層である。これらの樹脂組成物の成分構成については、公知の成分構成の中から適宜選択することができるが、殆どの異方性導電接続が熱圧着により実施されることから、熱硬化性樹脂組成物の構成とすることが好ましい。熱硬化性樹脂組成物の重合形式としては、熱ラジカル重合でも、熱カチオン重合でも、熱アニオン重合でもかまわないが、低温での迅速な硬化と接続安定性の点から熱カチオン重合が好ましい。このような熱カチオン重合型硬化性樹脂組成物としては、エポキシ化合物、オキセタン化合物、ビニルエーテル化合物等の熱カチオン重合性化合物５～８０質量部（好ましくは１０～７０質量部）と、芳香族スルホニウム塩などの熱カチオン重合開始剤０．２～３０質量部（好ましくは０．５～２０質量部）と、フェノキシ樹脂等の成膜樹脂５～９５質量部（好ましくは１０～９０質量部）とを混合した組成物を好ましく挙げることができる。必要に応じて、熱カチオン重合型硬化性樹脂組成物には、シランカップリング剤、防錆剤、着色剤、溶剤などの添加剤を含有することができる。
＜導電粒子含有層＞
　導電粒子含有層４４は、導電粒子４２が層状のバインダ樹脂組成物４３に単層配列された構造を有する。導電粒子４２を、層状のバインダ樹脂組成物４３に単層配列する手法としては、発明の効果を損なわないかぎり、特に限定されない。例えば、従来技術の欄で言及した特許文献１～２に開示の手法を採用することができる。
　導電粒子４２としては、公知の異方性導電フィルムを構成している導電粒子を採用することができる。例えば、ニッケルなどの金属粒子、樹脂コアの表面にニッケル等の金属メッキ膜を形成した金属被覆樹脂粒子等が挙げられる。必要に応じて絶縁薄膜が形成されていてもよい。
　このような導電粒子４２の平均粒径としては、接続されるべき端子と導電粒子との接触性の点から、好ましくは１～２０μｍ、より好ましくは２～１０μｍである。
　導電粒子含有層４４における導電粒子密度は、短絡防止の観点から、好ましくは５０００～８００００個／ｍｍ２で、より好ましくは１００００～６００００個／ｍｍ２である。
　また、導電粒子含有層４４において、互いに隣接する導電粒子同士の粒子間距離は、短絡防止の観点から、好ましくは１μｍ以上、より好ましくは１μｍ以上導電粒子径の３０倍以内、特に好ましくは２μｍ以上導電粒子径の２０倍以内である。この粒子間距離は、配列されている任意の導電粒子から最も近接している導電粒子までの距離を意味する。ここで、粒子間距離を確定するために選択される導電粒子は、凝集せずに独立的に存在しているものである。
　なお、導電粒子含有層４４を構成するバインダ樹脂組成物４３としては、その最低溶融粘度を第一の絶縁性樹脂組成物の最低溶融粘度以上とすること以外、第一の絶縁性樹脂組成物と同様の構成とすることができる。
　導電粒子含有層４４の層厚は、導電粒子の保持性を安定させる点から、好ましくは導電粒子径の０．３倍以上３倍以下、より好ましくは０．５倍以上２倍以下である。
＜別の態様の異方性導電フィルム＞
　図５に示すように、本発明の別の態様の異方性導電フィルム５０は、第一の絶縁性樹脂組成物層４１と反対側の導電粒子含有層４４の表面に、更に第二の絶縁性樹脂組成物層５１が積層されている構造を有する。この態様においても、導電粒子含有層４４を構成するバインダ樹脂組成物４３の最低溶融粘度が、第一及び第二の絶縁性樹脂組成物層４１、５１の最低溶融粘度より高くなっている。バインダ樹脂組成物４３の最低溶融粘度が、第一及び第二の絶縁性樹脂組成物層４１、５１の最低溶融粘度より高いと、異方性導電接続の際に導電粒子含有層４４を、隣接端子間で湾曲させることが容易となる。
＜第二の絶縁性樹脂組成物層＞
　第二の絶縁性樹脂組成物層５１は、構成成分、層厚については、第一の絶縁性樹脂組成物層４１と同様の構成とすることができる。
　なお、第一の絶縁性樹脂組成物の最低溶融粘度と第二の絶縁性樹脂組成物の最低溶融粘度とは、同じであってもよいが、流動を安定させることにより導電粒子同士の接触を防止する点から、一方が他方の最低溶融粘度よりも高いことが好ましい。この場合、両者の差は、流動の方向性を制御する点から、好ましくは５０～１００００ｍＰａ・ｓ、より好ましくは１００～５０００ｍＰａ・ｓに調整する。
　第一の絶縁性樹脂組成物の最低溶融粘度と第二の絶縁性樹脂組成物の最低溶融粘度とが同一もしくは略同一である場合、同一方向への流動を実現するために、第一の絶縁性樹脂組成物層４１及び第二の絶縁性樹脂組成物層５１のいずれか一方の層厚を、他方の層厚よりも好ましくは１～２０μｍ、より好ましくは２～１５μｍ厚くすることが好ましい。
＜図４に示す構造の異方性導電フィルムの製造＞
　図４に示す構造の異方性導電フィルムは、種々の手法により製造することができる。その一例を以下に説明する。
（第一の絶縁性樹脂組成物層の作成）
　熱カチオン重合性化合物と、熱カチオン重合開始剤と、成膜樹脂とを、固形分が５０％となるように、酢酸エチルやトルエン等の溶媒に溶解し、得られた溶液を、剥離ＰＥＴベースフィルムに所定の乾燥厚となるように公知の手法で塗布し、例えば５０～８０℃のオーブン中で３～１０分間乾燥することにより、剥離ＰＥＴベースフィルム上に第一の絶縁性樹脂組成物層が作成できる。
（導電粒子含有層の作成）
　図６Ａ、６Ｂに示すように、絶縁基板６０上に、所定の電極巾ａと電極間距離ｂと電極深さｃを有するライン状電極６１が設けられた配線基板６２を用意し、ライン状電極６１に正電位を付与する。その配線基板６２表面に導電粒子６３を散布する。次に、配線基板６２上に、導電粒子６３を正に帯電させるための帯電器６４をライン状電極６１に直交するように且つライン状電極６１に長さ方向に移動可能に配置する。更に、帯電器６４で正に帯電させた導電粒子６３をスキージする導電スキージ６５を配線基板６２上にセットする。導電スキージ６５のスキージ表面には、ライン状の電極巾ａに相当する矩形凸部６５ａと電極間距離ｂに相当する凹部６５ｂが交互に設けられている（図６Ｃ）。次に、帯電器６４で導電粒子６３を正に帯電させながら当該帯電器６４をライン状電極６１の長さ方向に移動させる。そうすると、正に帯電した導電粒子６３は、正電位が付与されているライン状電極６１間に集中するようになる。次に、帯電器６４の移動に続いて、導電スキージ６５を、矩形凸部６５ａがライン状電極６１に当接するように配線基板６２表面をスキージする。これにより、ライン状電極６１間に単層の導電粒子６３をライン状に配列することができる。
　このライン状に配列した導電粒子に対し、第一の絶縁性樹脂組成物と同様に作成した、剥離ＰＥＴベースフィルム上に形成されたバインダ樹脂組成物層を本硬化しないレベルで熱圧着し、バインダ樹脂組成物層に導電粒子を埋めこむように転写し、これにより剥離ＰＥＴベースフィルム上に導電粒子含有層を作成できる。このように、導電粒子を配列させる手法は、延伸フィルムを用いる手法、型を用いて転写させる手法等、公知の手法を採用することができる。ここで、導電粒子を配列する際、個数基準で９０％以上、好ましくは９５％以上の導電粒子に規則性を持たせることが望ましい。規則性とは、ランダム配列ではない配列を意味する。
（導電粒子含有層と第一の絶縁性樹脂組成物層との一体化）
　上述のように用意した第一の絶縁性樹脂組成物層と、導電粒子含有層とを対向させて本硬化しないレベルで熱圧着することにより一体化することにより、図４に示す構造の異方性導電フィルムを得ることができる。
＜図５に示す構造の異方性導電フィルムの製造＞
　図５に示す構造の異方性導電フィルムは、種々の手法により製造することができる。その一例を以下に説明する。
　図４に示す構造の異方性導電フィルムを製造する場合と同様に、第一の絶縁性樹脂組成物層と、導電粒子含有層とを作成する。更に、第一の絶縁性樹脂組成物層の作成と同様に第二の絶縁性樹脂組成物層を作成する。上述のように用意した導電粒子含有層を、第一の絶縁性樹脂組成物層と第二の絶縁性樹脂組成物層とで挟み、本硬化しないレベルで熱圧着することにより一体化することにより、図５に示す構造の異方性導電フィルムを得ることができる。
＜接続体＞
　本発明の異方性導電フィルムは、第一の電気部品（例えば、ＩＣチップ）の端子（例えばバンプ）と、第二の電気部品（例えば配線基板）の端子（例えばバンプ、パッド）との間に配置し、第一又は第二の電気部品側から熱圧着により本硬化させて異方性導電接続することにより接続体が得られる。この接続体を平面方向から観察したときには、隣接電極間が図１Ａに示すように、ショートしているように見える場合があるが、この断面を側面方向から観察すると、図１Ｂに示すように、導電粒子含有層が湾曲し、導電粒子同士が互いに接触しておらず、平面方向は絶縁されている。従って、接続体は、ショートの発生が抑制され、導通信頼性の低下も抑制されたものとなる。ここで、平面方向からの観察では導電粒子が互いに接触しているように見えていることを考慮すると、粒子の規則性がショートの抑制に効果的に働いていることがわかる。なお、導電粒子含有層が湾曲した状態になるということは、配列された導電粒子を群と見なした場合に、その群が屈曲性を示していると解することができる。
　以下、本発明を実施例により具体的に説明する。
　　実施例１～８、比較例１、２
（第一の絶縁性樹脂組成物層の形成）
　表１に示す配合（単位：質量部）に従って、トルエンを用いて５０％固形分の第一の絶縁性樹脂組成物混合液を調製し、この混合液を剥離ＰＥＴベースシート上に、表１の乾燥厚となるように塗布し、８０℃で５分間乾燥することにより、第一の絶縁性樹脂組成物層を形成した。なお、第一の絶縁性樹脂組成物層の最低溶融粘度を粘弾性測定装置（レオメーターＲＳ１５０、ハーケ社）で測定し、その結果を表１に示した。
（第二の絶縁性樹脂組成物層の形成）
　表１に示す配合（単位：質量部）に従って、トルエンを用いて５０％固形分の第二の絶縁性樹脂組成物混合液を調製し、この混合液を剥離ＰＥＴベースシート上に、表１の乾燥厚となるように塗布し、８０℃で５分間乾燥することにより、第二の絶縁性樹脂組成物層を形成した。なお、第二の絶縁性樹脂組成物層の最低溶融粘度を粘弾性測定装置（レオメーターＲＳ１５０、ハーケ社）で測定し、その結果を表１に示した。
（導電粒子含有層の形成）
　表１に示す配合（単位：質量部）に従って、トルエンを用いて５０％固形分のバインダ樹脂組成物混合液を調製し、この混合液を剥離ＰＥＴベースシート上に、表１の乾燥厚となるように塗布し、８０℃で５分間乾燥することにより、バインダ樹脂組成物層を形成した。なお、バインダ樹脂組成物層の最低溶融粘度を粘弾性測定装置（レオメーターＲＳ１５０、ハーケ社）で測定し、その結果を表１に示した。
　次に、図６Ａ、６Ｂに示す装置（表１の電極巾、電極間距離３．５μｍ、電極深さ３．５μｍ）を用いて、配線基板上に平均粒径３μｍの導電粒子（ＡＵＬ７０３、積水化学工業（株））を表１の粒子密度でライン状に単層配列させた。このライン状に単層配列された導電粒子に対し、バインダ樹脂組成物層を配置し、剥離ＰＥＴベースシート側から４０℃、０．１ＭＰａでラミネートすることにより、導電粒子がバインダ樹脂組成物層に押し込まれた構造を有する表１の厚みの導電粒子含有層を形成した。
（異方性導電フィルムの作成）
　導電粒子含有層の導電粒子を押し込んだ側の表面に、第一の絶縁性樹脂組成物層を配置し、他面に第二の絶縁性樹脂組成物層を配置し、全体を４０℃、０．１ＭＰａでラミネートすることにより、異方性導電フィルムを作成した。
　　実施例９
　第二の絶縁性樹脂組成物層を使用しない以外は、実施例１で行われた操作に準じて２層構造の異方性導電フィルムを作成した。
　　実施例１０
　第一の絶縁性樹脂組成物層を使用しない以外は、実施例１で行われた操作に準じて２層構造の異方性導電フィルムを作成した。
＜接続体の評価＞
（接続体の作成）
　各実施例及び比較例で作成した異方性導電フィルムを用いて、ＩＣチップのバンプとポリイミドベースの配線基板の電極との間を、熱圧着により異方性導電接続した。なお、異方性接続時には第一の絶縁性樹脂組成物層をＩＣチップ側に配置した。
　熱圧着条件：　１８０℃、８０ＭＰａ、５秒
　ＩＣチップのサイズ：１．５ｍｍ×１３ｍｍ、０．５ｍｍｔ
　ＩＣチップのバンプ：金メッキバンプ、２５μｍ×２５μｍ、バンプ高さ（表１）、バンプ間スペース７．５μｍ
　配線基板の電極：金メッキ電極、Ｌｉｎｅ／Ｓｐａｃｅ＝１６．５μｍ／１６μｍ、電極高さ（表１）、電極間スペース７．５μｍ
（性能評価）
　得られた接続体について、以下に説明するように、「導電粒子捕捉数」、「ショート発生率」、「初期導通抵抗」、「高温高湿負荷試験後の導通抵抗（導通信頼性）」、「導電粒子含有層の湾曲方向」、「導電粒子含有層の湾曲長」、「導電粒子間距離」について測定した。得られた結果を表１に示す。
「導電粒子捕捉数」
　圧着したＩＣの全バンプから任意の３００個のバンプを選択し、バンプ上に存在する導電粒子数を顕微鏡にてカウントし、その平均値と標準偏差とを求めた。接続実用上、導電粒子数は平均－３σの値が３個以上であることが望まれる。
「ショート発生率」
　ショート発生率は、「ショートの発生数／７．５μｍスペース総数」で算出した。実用上、１００ｐｐｍ以下であることが望ましい。
「初期導通抵抗」
　作成直後の接続体の初期導通抵抗を市販の抵抗測定器を用いて測定した。実用上、１０Ω以下であることが望まれる。
「高温高湿負荷試験後の導通抵抗（導通信頼性）」
　接続体を、８５℃、８５％Ｒｈに維持されたチャンバー中で１０００時間放置した後の接続体の導通抵抗を市販の抵抗測定器を用いて測定した。実用上、１０Ω以下であることが望まれる。
「導電粒子含有層の湾曲方向」
　接続構造体の異方性接続部を平面方向に対して垂直方向であって、且つライン状の導電粒子配列に対して直交する方向に切断し、その切断面を顕微鏡観察して、「導電粒子含有層の湾曲方向」を調べた。接続体の平面方向におけるバンプ間スペースに存在する導電粒子含有層の湾曲が、第一の絶縁性樹脂組成物層側に凸である場合を湾曲方向が「上」とし、第二の絶縁性樹脂組成物層側に凸である場合を湾曲方向が「下」とした。
「導電粒子含有層の湾曲長」
　接続構造体の異方性接続部を平面方向に対して垂直方向であって、且つライン状の導電粒子配列に対して直交する方向に切断し、その切断面を顕微鏡観察して、「導電粒子含有層の湾曲長」を求めた。異方性導電接続した対向するバンプ間の中心を水平方向に延ばした直線と、導電粒子含有層の湾曲凸部先端までの最短距離を、「導電粒子含有層の湾曲長」とした。
「導電粒子間距離」
　接続構造体の異方性接続部を平面方向に対して垂直方向であって、且つライン状の導電粒子配列に対して直交する方向に切断し、その切断面を顕微鏡観察して、「導電粒子間距離」を求めた。接続体の平面方向におけるバンプ間スペースに存在する導電粒子含有層における互いに隣接する導電粒子間の距離を、「導電粒子間距離」とした。
Figure JPOXMLDOC01-appb-T000001
＜考察＞
　実施例９の異方性導電フィルムの場合、導電粒子含有層を構成するバインダ樹脂組成物の最低溶融粘度が、第一の絶縁性樹脂組成物の最低溶融粘度以上であるので、接続体における導電粒子含有層が配線基板側に凸に湾曲した。このため、初期導通抵抗も低く、高温高湿負荷試験後の導通信頼性も高いものであった。また、ショートの発生も抑制されていた。
　実施例１０の異方性導電フィルムの場合、導電粒子含有層を構成するバインダ樹脂組成物の最低溶融粘度が、第二の絶縁性樹脂組成物の最低溶融粘度以上であるので、接続体における導電粒子含有層がＩＣチップ側に凸に湾曲した。このため、初期導通抵抗も低く、高温高湿負荷試験後の導通信頼性も高いものであった。また、ショートの発生も抑制されていた。
　実施例１、２、５～８の異方性導電フィルムの場合、導電粒子含有層を構成するバインダ樹脂組成物の最低溶融粘度が、第一及び第二の絶縁性樹脂組成物の最低溶融粘度より高くなっている。しかも、第一の絶縁性樹脂組成物と第二の絶縁性樹脂組成物の一方の最低溶融粘度が、他方の最低溶融粘度よりも高くなっている。このため、接続体における導電粒子含有層が、より低い最低溶融粘度を示す絶縁性樹脂組成物層側に凸に湾曲した。このため、初期導通抵抗も低く、高温高湿負荷試験後の導通信頼性も高いものであった。また、ショートの発生も抑制されていた。
　実施例３の異方性導電フィルムの場合、導電粒子含有層を構成するバインダ樹脂組成物の最低溶融粘度が、第一及び第二の絶縁性樹脂組成物の最低溶融粘度より高くなっているが、第一の絶縁性樹脂組成物と第二の絶縁性樹脂組成物の最低溶融粘度が同じであった。しかし、ＩＣチップのバンプ高さが配線基板の電極高さよりも非常に大きくなっていたため、接続体における導電粒子含有層が、ＩＣチップ側の第一の絶縁性樹脂組成物層側に凸に湾曲した。このため、初期導通抵抗も低く、高温高湿負荷試験後の導通信頼性も高いものであった。また、ショートの発生も抑制されていた。
　実施例４の異方性導電フィルムの場合、導電粒子含有層を構成するバインダ樹脂組成物の最低溶融粘度が、第一及び第二の絶縁性樹脂組成物の最低溶融粘度より高くなっているが、第一の絶縁性樹脂組成物と第二の絶縁性樹脂組成物の最低溶融粘度が同じであった。しかし、第一の絶縁性樹脂組成物の層厚が、第二の絶縁性樹脂組成物の層厚よりも非常に厚くなっていたため、接続体における導電粒子含有層が、配線基板側の第二の絶縁性樹脂組成物層側に凸に湾曲した。このため、初期導通抵抗も低く、高温高湿負荷試験後の導通信頼性も高いものであった。また、ショートの発生も抑制されていた。
　それに対し、比較例１の異方性導電フィルムと比較例２の異方性導電フィルムとは、導電粒子密度が互いに異なるものの、第一の絶縁性樹脂組成物、バインダ樹脂組成物及び第二の絶縁性樹脂組成物の最低溶融粘度が同じであった。このため、比較例１の異方性導電フィルムを使用した接続体は、ショートの発生率が高いものであった。比較例２の異方性導電フィルムを使用した接続体は、導通信頼性が低いものであった。
　本発明の異方性導電フィルムによれば、異方性導電フィルムを使用して狭ピッチ化された電気部品同士を異方性導電接続した際に、ショートの発生を抑制し、高温高湿環境下での保管により導通信頼性が低下することを抑制できる。従って、ＩＣチップを配線基板にフリップチップ実装する際に有用である。
　１、４２、６３　導電粒子
　２　電極
　３　第一の電気部品
　３ａ　端子
　４　第二の電気部品
　４ａ　端子
　１０、２２、３２、４４　導電粒子含有層
　１１、２０、３０、４１　第一の絶縁性樹脂組成物層
　２１、３１、５１　第二の絶縁性樹脂組成物層
　４０、５０　異方性導電フィルム
　４３　バインダ樹脂組成物
　６０　絶縁基板
　６１　ライン状電極
　６２　配線基板
　６４　帯電器
　６５　導電スキージ
　６５ａ　矩形凸部
　６５ｂ　凹部
　ａ　電極巾
　ｂ　電極間距離
　ｃ　電極深さ

Claims (7)

  1. 　少なくとも、第一の絶縁性樹脂組成物層上に、導電粒子が層状のバインダ樹脂組成物に単層配列されてなる導電粒子含有層が積層された異方性導電フィルムであって、
    　バインダ樹脂組成物の最低溶融粘度が、第一の絶縁性樹脂組成物の最低溶融粘度以上である異方性導電フィルム。
  2. 　導電粒子含有層の、第一の絶縁性樹脂組成物層と反対面に、更に第二の絶縁性樹脂組成物層が積層されており、バインダ樹脂組成物の最低溶融粘度が、第一及び第二の絶縁性樹脂組成物の最低溶融粘度より高い請求項１記載の異方性導電フィルム。
  3. 　第一の絶縁性樹脂組成物と第二の絶縁性樹脂組成物の一方の最低溶融粘度が、他方の最低溶融粘度よりも高い請求項２記載の異方性導電フィルム。
  4. 　第一の絶縁性樹脂組成物の最低溶融粘度と第二の絶縁性樹脂組成物の最低溶融粘度とが同一もしくは略同一である場合に、第一の絶縁性樹脂組成物層及び第二の絶縁性樹脂組成物層の一方の層厚が他方の層厚よりも厚い請求項２記載の異方性導電フィルム。
  5. 　導電粒子含有層において、互いに隣接する導電粒子同士の粒子間距離が、１μｍ以上である請求項１～４のいずれかに記載の異方性導電フィルム。
  6. 　第一の電気部品の端子と第二の電気部品の端子とを、請求項１～５のいずれかに記載の異方性導電フィルムを介して異方性導電接続してなる接続体であって、その断面を側面方向から観察したときに、導電粒子含有層が湾曲していることを特徴とする接続体。
  7. 　接続体の平面方向から観察したときに、隣接電極間がショートしているように見える請求項６記載の接続体。
PCT/JP2014/074639 2013-10-15 2014-09-18 異方性導電フィルム WO2015056518A1 (ja)

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