JP2017175093A5 - - Google Patents

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Publication number
JP2017175093A5
JP2017175093A5 JP2016062870A JP2016062870A JP2017175093A5 JP 2017175093 A5 JP2017175093 A5 JP 2017175093A5 JP 2016062870 A JP2016062870 A JP 2016062870A JP 2016062870 A JP2016062870 A JP 2016062870A JP 2017175093 A5 JP2017175093 A5 JP 2017175093A5
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JP
Japan
Prior art keywords
electronic component
substrate
conductive adhesive
electrode
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016062870A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017175093A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2016062870A priority Critical patent/JP2017175093A/ja
Priority claimed from JP2016062870A external-priority patent/JP2017175093A/ja
Priority to KR1020170017403A priority patent/KR20170113039A/ko
Priority to CN201710137728.2A priority patent/CN107978579A/zh
Publication of JP2017175093A publication Critical patent/JP2017175093A/ja
Priority to HK18113948.6A priority patent/HK1254852A1/zh
Publication of JP2017175093A5 publication Critical patent/JP2017175093A5/ja
Pending legal-status Critical Current

Links

JP2016062870A 2016-03-25 2016-03-25 電子部品、接続体、電子部品の設計方法 Pending JP2017175093A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016062870A JP2017175093A (ja) 2016-03-25 2016-03-25 電子部品、接続体、電子部品の設計方法
KR1020170017403A KR20170113039A (ko) 2016-03-25 2017-02-08 전자 부품, 접속체, 전자 부품의 설계 방법
CN201710137728.2A CN107978579A (zh) 2016-03-25 2017-03-09 电子部件、连接体、电子部件的设计方法
HK18113948.6A HK1254852A1 (zh) 2016-03-25 2018-11-01 电子部件、连接体、电子部件的设计方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016062870A JP2017175093A (ja) 2016-03-25 2016-03-25 電子部品、接続体、電子部品の設計方法

Publications (2)

Publication Number Publication Date
JP2017175093A JP2017175093A (ja) 2017-09-28
JP2017175093A5 true JP2017175093A5 (enrdf_load_stackoverflow) 2019-04-18

Family

ID=59972211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016062870A Pending JP2017175093A (ja) 2016-03-25 2016-03-25 電子部品、接続体、電子部品の設計方法

Country Status (4)

Country Link
JP (1) JP2017175093A (enrdf_load_stackoverflow)
KR (1) KR20170113039A (enrdf_load_stackoverflow)
CN (1) CN107978579A (enrdf_load_stackoverflow)
HK (1) HK1254852A1 (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017191774A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 異方性導電フィルム
JP7274810B2 (ja) * 2016-05-05 2023-05-17 デクセリアルズ株式会社 異方性導電フィルム
JP7095227B2 (ja) * 2016-05-05 2022-07-05 デクセリアルズ株式会社 異方性導電フィルム
JP7274811B2 (ja) * 2016-05-05 2023-05-17 デクセリアルズ株式会社 異方性導電フィルム
DE102019126859A1 (de) * 2019-10-07 2021-04-08 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Anzeigevorrichtung und Anzeigeeinheit
CN111179750A (zh) * 2019-12-12 2020-05-19 武汉华星光电技术有限公司 显示面板的结构和其制作方法
CN111642058A (zh) * 2020-05-08 2020-09-08 欧菲微电子技术有限公司 电路板、电路板组件及电子设备
CN114388420B (zh) * 2020-10-19 2025-02-18 重庆康佳光电科技有限公司 临时基板及其制作方法，及微型发光芯片转移方法
KR20240123431A (ko) * 2022-03-31 2024-08-13 데쿠세리아루즈 가부시키가이샤 접속 구조체

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154876A (ja) * 1997-08-05 1999-02-26 Sony Corp 基板端子の接続構造および接続方法
JP2002329806A (ja) * 2001-04-27 2002-11-15 Toshiba Corp 電気回路部品
JP4130746B2 (ja) * 2002-03-28 2008-08-06 旭化成エレクトロニクス株式会社 異方性を有する導電性接着シートおよびその製造方法
US20100051330A1 (en) * 2006-11-29 2010-03-04 Sharp Kabushiki Kaisha Wiring board and display unit
JP6303289B2 (ja) * 2013-05-13 2018-04-04 日立化成株式会社 回路部材、接続構造体及び接続構造体の製造方法
JP2015079586A (ja) * 2013-10-15 2015-04-23 デクセリアルズ株式会社 異方性導電フィルム

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