KR20170113039A - 전자 부품, 접속체, 전자 부품의 설계 방법 - Google Patents

전자 부품, 접속체, 전자 부품의 설계 방법 Download PDF

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Publication number
KR20170113039A
KR20170113039A KR1020170017403A KR20170017403A KR20170113039A KR 20170113039 A KR20170113039 A KR 20170113039A KR 1020170017403 A KR1020170017403 A KR 1020170017403A KR 20170017403 A KR20170017403 A KR 20170017403A KR 20170113039 A KR20170113039 A KR 20170113039A
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KR
South Korea
Prior art keywords
substrate
chip
anisotropic conductive
input
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020170017403A
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English (en)
Korean (ko)
Inventor
마사히로 이이야마
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20170113039A publication Critical patent/KR20170113039A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4922—Bases or plates or solder therefor having a heterogeneous or anisotropic structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020170017403A 2016-03-25 2017-02-08 전자 부품, 접속체, 전자 부품의 설계 방법 Ceased KR20170113039A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-062870 2016-03-25
JP2016062870A JP2017175093A (ja) 2016-03-25 2016-03-25 電子部品、接続体、電子部品の設計方法

Publications (1)

Publication Number Publication Date
KR20170113039A true KR20170113039A (ko) 2017-10-12

Family

ID=59972211

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170017403A Ceased KR20170113039A (ko) 2016-03-25 2017-02-08 전자 부품, 접속체, 전자 부품의 설계 방법

Country Status (4)

Country Link
JP (1) JP2017175093A (enrdf_load_stackoverflow)
KR (1) KR20170113039A (enrdf_load_stackoverflow)
CN (1) CN107978579A (enrdf_load_stackoverflow)
HK (1) HK1254852A1 (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180098356A (ko) * 2016-05-05 2018-09-03 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
KR20180098355A (ko) * 2016-05-05 2018-09-03 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
KR20180098607A (ko) * 2016-05-05 2018-09-04 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
KR20230030025A (ko) * 2016-05-05 2023-03-03 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019126859A1 (de) * 2019-10-07 2021-04-08 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Anzeigevorrichtung und Anzeigeeinheit
CN111179750A (zh) * 2019-12-12 2020-05-19 武汉华星光电技术有限公司 显示面板的结构和其制作方法
CN111642058A (zh) * 2020-05-08 2020-09-08 欧菲微电子技术有限公司 电路板、电路板组件及电子设备
CN114388420B (zh) * 2020-10-19 2025-02-18 重庆康佳光电科技有限公司 临时基板及其制作方法，及微型发光芯片转移方法
KR20240123431A (ko) * 2022-03-31 2024-08-13 데쿠세리아루즈 가부시키가이샤 접속 구조체

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154876A (ja) * 1997-08-05 1999-02-26 Sony Corp 基板端子の接続構造および接続方法
JP2002329806A (ja) * 2001-04-27 2002-11-15 Toshiba Corp 電気回路部品
JP4130746B2 (ja) * 2002-03-28 2008-08-06 旭化成エレクトロニクス株式会社 異方性を有する導電性接着シートおよびその製造方法
US20100051330A1 (en) * 2006-11-29 2010-03-04 Sharp Kabushiki Kaisha Wiring board and display unit
JP6303289B2 (ja) * 2013-05-13 2018-04-04 日立化成株式会社 回路部材、接続構造体及び接続構造体の製造方法
JP2015079586A (ja) * 2013-10-15 2015-04-23 デクセリアルズ株式会社 異方性導電フィルム

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180098356A (ko) * 2016-05-05 2018-09-03 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
KR20180098355A (ko) * 2016-05-05 2018-09-03 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
KR20180098607A (ko) * 2016-05-05 2018-09-04 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
KR20200103874A (ko) * 2016-05-05 2020-09-02 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
KR20210122900A (ko) * 2016-05-05 2021-10-12 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
KR20230030025A (ko) * 2016-05-05 2023-03-03 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름

Also Published As

Publication number Publication date
CN107978579A (zh) 2018-05-01
HK1254852A1 (zh) 2019-07-26
JP2017175093A (ja) 2017-09-28

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