JP2017174883A - 保護部材形成装置 - Google Patents
保護部材形成装置 Download PDFInfo
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- JP2017174883A JP2017174883A JP2016056711A JP2016056711A JP2017174883A JP 2017174883 A JP2017174883 A JP 2017174883A JP 2016056711 A JP2016056711 A JP 2016056711A JP 2016056711 A JP2016056711 A JP 2016056711A JP 2017174883 A JP2017174883 A JP 2017174883A
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- 230000001681 protective effect Effects 0.000 title claims abstract description 29
- 230000015572 biosynthetic process Effects 0.000 title abstract description 4
- 239000011347 resin Substances 0.000 claims abstract description 71
- 229920005989 resin Polymers 0.000 claims abstract description 71
- 239000007788 liquid Substances 0.000 claims abstract description 63
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 238000003892 spreading Methods 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 abstract description 2
- 230000003313 weakening effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 81
- 229920001971 elastomer Polymers 0.000 description 37
- 230000032258 transport Effects 0.000 description 9
- 230000003028 elevating effect Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
したがって、ステージの強度を弱めることなく、液状樹脂の硬化時間を長くせずに、均一な厚みの保護部材をウエーハの一方の面に形成することが可能となる。
したがって、ステージ20の強度を弱めることなく、液状樹脂の硬化時間を長くせずに、均一な厚みの保護部材をウエーハWの一方の面に形成することができる。
102:支持ベース 103:カセット収容本体
2a,2b:収容スペース 3a,3b:カセット 4:第1ウエーハ搬送手段
5:第2ウエーハ搬送手段 6a:第1支持台 6b:第2支持台
7:ウエーハ検出部 8:フィルムカッター 9:ゴム板 9a:円形凸部
10:フィルム供給手段 11:ロール部 12:フィルム
20:ステージ 21:フィルム保持面 22:吸引部 23:吸引源
30:フィルム載置手段 31:アーム部 32:クランプ部
40:液状樹脂供給手段 41:樹脂供給ノズル 41a:供給口
50:空気除去手段 51:ローラ 51a:外周面 510:軸部 52:支持部
53:移動部 54:ガイド
60:ゴム板載置手段 61:ゴム板支持部 62:ゴム板移動部 63:ガイド
70:保持手段 71:ホイール 72:ウエーハ保持面
80:拡張手段 81:ボールネジ 82:モータ 83:ガイドレール
84:昇降板
90:硬化手段
Claims (1)
- ウエーハの一方の面の全面に液状樹脂を押し拡げて硬化させ保護部材を形成する保護部材形成装置であって、
フィルムを吸引保持するフィルム保持面にウエーハの直径より大きい直径のリング状の吸引部を有するステージと、
該ステージが吸引保持するフィルムの上に液状樹脂を供給する液状樹脂供給手段と、
該フィルム保持面に対面しウエーハを保持するウエーハ保持面を有する保持手段と、
該保持手段と該ステージとを相対的に接近する方向に移動させ該フィルムの上に供給された液状樹脂を押し拡げる拡張手段と、
該拡張手段によりウエーハの一方の面の全面に押し拡げられた液状樹脂を硬化させる硬化手段と、を備え、
さらに、該フィルムの上に液状樹脂を供給する前に該フィルム保持面と該フィルムとの間の空気を除去する空気除去手段を備え、
該空気除去手段は、該ウエーハの直径以上の長さで延在するローラと、
該ステージに吸引保持された該フィルムを該フィルム保持面に向けて押し付けながら該ローラを転動させる移動部と、を備える保護部材形成装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016056711A JP6641209B2 (ja) | 2016-03-22 | 2016-03-22 | 保護部材形成装置 |
KR1020170033714A KR102184474B1 (ko) | 2016-03-22 | 2017-03-17 | 보호 부재 형성 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016056711A JP6641209B2 (ja) | 2016-03-22 | 2016-03-22 | 保護部材形成装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017174883A true JP2017174883A (ja) | 2017-09-28 |
JP6641209B2 JP6641209B2 (ja) | 2020-02-05 |
Family
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JP2016056711A Active JP6641209B2 (ja) | 2016-03-22 | 2016-03-22 | 保護部材形成装置 |
Country Status (2)
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JP (1) | JP6641209B2 (ja) |
KR (1) | KR102184474B1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020102515A (ja) * | 2018-12-21 | 2020-07-02 | 株式会社ディスコ | 保護部材の形成方法 |
US10916459B2 (en) | 2018-08-06 | 2021-02-09 | Disco Corporation | Protective member forming apparatus |
DE102021207336A1 (de) | 2020-07-20 | 2022-01-20 | Disco Corporation | Folie und ausbildungsverfahren für schutzelement |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09219383A (ja) * | 1996-02-13 | 1997-08-19 | Fujitsu Ltd | 半導体装置の製造方法及び製造装置 |
JP2001146357A (ja) * | 1999-11-19 | 2001-05-29 | Sony Corp | 半導体基板にテープを貼り付けるテープ貼り付け方法及び同装置 |
JP2010118584A (ja) * | 2008-11-14 | 2010-05-27 | Takatori Corp | ウエハのマウント装置 |
JP2012146872A (ja) * | 2011-01-13 | 2012-08-02 | Disco Abrasive Syst Ltd | 樹脂塗布装置 |
JP2012143723A (ja) * | 2011-01-13 | 2012-08-02 | Disco Corp | 樹脂塗布装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4841355B2 (ja) * | 2006-08-08 | 2011-12-21 | 日東電工株式会社 | 半導体ウエハの保持方法 |
JP6430143B2 (ja) * | 2014-04-30 | 2018-11-28 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法並びに成形製品の製造方法 |
-
2016
- 2016-03-22 JP JP2016056711A patent/JP6641209B2/ja active Active
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2017
- 2017-03-17 KR KR1020170033714A patent/KR102184474B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09219383A (ja) * | 1996-02-13 | 1997-08-19 | Fujitsu Ltd | 半導体装置の製造方法及び製造装置 |
JP2001146357A (ja) * | 1999-11-19 | 2001-05-29 | Sony Corp | 半導体基板にテープを貼り付けるテープ貼り付け方法及び同装置 |
JP2010118584A (ja) * | 2008-11-14 | 2010-05-27 | Takatori Corp | ウエハのマウント装置 |
JP2012146872A (ja) * | 2011-01-13 | 2012-08-02 | Disco Abrasive Syst Ltd | 樹脂塗布装置 |
JP2012143723A (ja) * | 2011-01-13 | 2012-08-02 | Disco Corp | 樹脂塗布装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10916459B2 (en) | 2018-08-06 | 2021-02-09 | Disco Corporation | Protective member forming apparatus |
JP2020102515A (ja) * | 2018-12-21 | 2020-07-02 | 株式会社ディスコ | 保護部材の形成方法 |
JP7214466B2 (ja) | 2018-12-21 | 2023-01-30 | 株式会社ディスコ | 保護部材の形成方法 |
DE102021207336A1 (de) | 2020-07-20 | 2022-01-20 | Disco Corporation | Folie und ausbildungsverfahren für schutzelement |
KR20220011074A (ko) | 2020-07-20 | 2022-01-27 | 가부시기가이샤 디스코 | 시트, 및 보호 부재의 형성 방법 |
Also Published As
Publication number | Publication date |
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KR102184474B1 (ko) | 2020-11-30 |
KR20170110026A (ko) | 2017-10-10 |
JP6641209B2 (ja) | 2020-02-05 |
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