JP2017147443A5 - - Google Patents
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- Publication number
- JP2017147443A5 JP2017147443A5 JP2017019642A JP2017019642A JP2017147443A5 JP 2017147443 A5 JP2017147443 A5 JP 2017147443A5 JP 2017019642 A JP2017019642 A JP 2017019642A JP 2017019642 A JP2017019642 A JP 2017019642A JP 2017147443 A5 JP2017147443 A5 JP 2017147443A5
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- conductor
- barrier layer
- transistor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012212 insulator Substances 0.000 claims 37
- 230000004888 barrier function Effects 0.000 claims 22
- 239000004020 conductor Substances 0.000 claims 16
- 239000004065 semiconductor Substances 0.000 claims 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 8
- 239000001301 oxygen Substances 0.000 claims 8
- 229910052760 oxygen Inorganic materials 0.000 claims 8
- 238000000034 method Methods 0.000 claims 6
- 239000001257 hydrogen Substances 0.000 claims 5
- 229910052739 hydrogen Inorganic materials 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 3
- 239000003990 capacitor Substances 0.000 claims 3
- 150000002431 hydrogen Chemical class 0.000 claims 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 1
- 238000009832 plasma treatment Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical group [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016024794 | 2016-02-12 | ||
| JP2016024794 | 2016-02-12 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017147443A JP2017147443A (ja) | 2017-08-24 |
| JP2017147443A5 true JP2017147443A5 (OSRAM) | 2020-03-12 |
| JP6807767B2 JP6807767B2 (ja) | 2021-01-06 |
Family
ID=59562256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017019642A Active JP6807767B2 (ja) | 2016-02-12 | 2017-02-06 | 半導体装置及びその作製方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9978774B2 (OSRAM) |
| JP (1) | JP6807767B2 (OSRAM) |
| KR (1) | KR102628719B1 (OSRAM) |
| CN (2) | CN108886021B (OSRAM) |
| TW (1) | TWI730041B (OSRAM) |
| WO (1) | WO2017137864A1 (OSRAM) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102613288B1 (ko) | 2016-07-26 | 2023-12-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP7167038B2 (ja) * | 2017-09-15 | 2022-11-08 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US11222945B2 (en) | 2017-12-29 | 2022-01-11 | Texas Instruments Incorporated | High voltage isolation structure and method |
| JP7240383B2 (ja) | 2018-04-12 | 2023-03-15 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US10727275B2 (en) * | 2018-05-18 | 2020-07-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Memory layout for reduced line loading |
| US10304836B1 (en) * | 2018-07-18 | 2019-05-28 | Xerox Corporation | Protective layers for high-yield printed electronic devices |
| US10741638B2 (en) * | 2018-08-08 | 2020-08-11 | Infineon Technologies Austria Ag | Oxygen inserted Si-layers for reduced substrate dopant outdiffusion in power devices |
| US11881522B2 (en) | 2018-10-05 | 2024-01-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of semiconductor device |
| US10707296B2 (en) | 2018-10-10 | 2020-07-07 | Texas Instruments Incorporated | LOCOS with sidewall spacer for different capacitance density capacitors |
| JP2020072191A (ja) * | 2018-10-31 | 2020-05-07 | キオクシア株式会社 | 半導体記憶装置 |
| US11849572B2 (en) | 2019-01-14 | 2023-12-19 | Intel Corporation | 3D 1T1C stacked DRAM structure and method to fabricate |
| JP2022509235A (ja) | 2019-02-11 | 2022-01-20 | 長江存儲科技有限責任公司 | 半導体デバイス、接合構造および半導体デバイスの形成方法 |
| US11791221B2 (en) * | 2019-02-22 | 2023-10-17 | Intel Corporation | Integration of III-N transistors and semiconductor layer transfer |
| JPWO2020179494A1 (OSRAM) | 2019-03-07 | 2020-09-10 | ||
| US12376410B2 (en) * | 2019-07-04 | 2025-07-29 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device with embedded conductive layers |
| US12289878B2 (en) | 2019-07-12 | 2025-04-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing semiconductor device |
| JP7583722B2 (ja) | 2019-08-09 | 2024-11-14 | 株式会社半導体エネルギー研究所 | 記憶装置 |
| US11437416B2 (en) * | 2019-09-10 | 2022-09-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pixel device layout to reduce pixel noise |
| US11107820B2 (en) * | 2019-09-13 | 2021-08-31 | Nanya Technology Corporation | Semiconductor device and method for fabricating the same |
| CN110993607B (zh) * | 2019-11-21 | 2022-12-16 | 长江存储科技有限责任公司 | 具有阻挡结构的存储器件及其制备方法 |
| CN111128721A (zh) * | 2019-12-04 | 2020-05-08 | 长江存储科技有限责任公司 | 存储器的制作方法及存储器 |
| WO2021227027A1 (zh) * | 2020-05-15 | 2021-11-18 | 京东方科技集团股份有限公司 | 显示基板及其制作方法、显示装置 |
| US20230179110A1 (en) * | 2020-05-22 | 2023-06-08 | Marel Power Solutions, Inc. | Compact power converter |
| US11610999B2 (en) * | 2020-06-10 | 2023-03-21 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Floating-gate devices in high voltage applications |
| KR20230050329A (ko) * | 2020-08-19 | 2023-04-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| US11728272B2 (en) | 2021-03-31 | 2023-08-15 | Taiwan Semiconductor Manufacturing Company Limited | Plasma-damage-resistant interconnect structure and methods for manufacturing the same |
| JP2023067454A (ja) * | 2021-11-01 | 2023-05-16 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置、電子機器、及び半導体装置の製造方法 |
| TWI802321B (zh) * | 2022-03-17 | 2023-05-11 | 新唐科技股份有限公司 | 橫向雙擴散金氧半導體裝置 |
| CN116209249B (zh) * | 2022-08-08 | 2024-02-20 | 北京超弦存储器研究院 | 动态存储器、其制作方法、读取方法及存储装置 |
| KR102891038B1 (ko) * | 2023-08-29 | 2025-11-28 | (주)피코셈 | 반도체 디바이스 및 그 제조 방법 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101299429B (zh) * | 2004-06-28 | 2010-12-15 | 富士通半导体股份有限公司 | 半导体器件及其制造方法 |
| JP2008010758A (ja) * | 2006-06-30 | 2008-01-17 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| CN105070715B (zh) | 2009-10-21 | 2018-10-19 | 株式会社半导体能源研究所 | 半导体装置 |
| MY164205A (en) | 2009-10-29 | 2017-11-30 | Semiconductor Energy Lab | Semiconductor device |
| KR102321812B1 (ko) | 2009-10-29 | 2021-11-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101945171B1 (ko) | 2009-12-08 | 2019-02-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101804589B1 (ko) * | 2009-12-11 | 2018-01-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| CN107947763B (zh) | 2010-08-06 | 2021-12-28 | 株式会社半导体能源研究所 | 半导体集成电路 |
| KR102084274B1 (ko) * | 2011-12-15 | 2020-03-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| US9735280B2 (en) * | 2012-03-02 | 2017-08-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, method for manufacturing semiconductor device, and method for forming oxide film |
| US8981370B2 (en) * | 2012-03-08 | 2015-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9006024B2 (en) * | 2012-04-25 | 2015-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| WO2015060133A1 (en) | 2013-10-22 | 2015-04-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN110571278A (zh) * | 2013-10-22 | 2019-12-13 | 株式会社半导体能源研究所 | 半导体装置 |
| KR20220163502A (ko) * | 2013-12-26 | 2022-12-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR102325158B1 (ko) * | 2014-01-30 | 2021-11-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 전자 기기, 및 반도체 장치의 제작 방법 |
| TWI663733B (zh) | 2014-06-18 | 2019-06-21 | 日商半導體能源研究所股份有限公司 | 電晶體及半導體裝置 |
| CN106537604B (zh) * | 2014-07-15 | 2020-09-11 | 株式会社半导体能源研究所 | 半导体装置及其制造方法以及包括该半导体装置的显示装置 |
| JP2016066788A (ja) | 2014-09-19 | 2016-04-28 | 株式会社半導体エネルギー研究所 | 半導体膜の評価方法および半導体装置の作製方法 |
| KR20160034200A (ko) | 2014-09-19 | 2016-03-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| KR20160114511A (ko) * | 2015-03-24 | 2016-10-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| US10460984B2 (en) | 2015-04-15 | 2019-10-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for fabricating electrode and semiconductor device |
| WO2017081579A1 (en) * | 2015-11-13 | 2017-05-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP6917700B2 (ja) * | 2015-12-02 | 2021-08-11 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP6884569B2 (ja) * | 2015-12-25 | 2021-06-09 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
| JP6851814B2 (ja) * | 2015-12-29 | 2021-03-31 | 株式会社半導体エネルギー研究所 | トランジスタ |
| US9923001B2 (en) | 2016-01-15 | 2018-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US10700212B2 (en) * | 2016-01-28 | 2020-06-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, semiconductor wafer, module, electronic device, and manufacturing method thereof |
-
2017
- 2017-01-30 KR KR1020187024777A patent/KR102628719B1/ko active Active
- 2017-01-30 CN CN201780022719.7A patent/CN108886021B/zh not_active Expired - Fee Related
- 2017-01-30 WO PCT/IB2017/050471 patent/WO2017137864A1/en not_active Ceased
- 2017-01-30 CN CN202310772146.7A patent/CN116782639A/zh active Pending
- 2017-01-31 US US15/420,628 patent/US9978774B2/en not_active Expired - Fee Related
- 2017-02-06 TW TW106103844A patent/TWI730041B/zh not_active IP Right Cessation
- 2017-02-06 JP JP2017019642A patent/JP6807767B2/ja active Active
-
2018
- 2018-04-30 US US15/966,231 patent/US10367005B2/en active Active
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