JP2017123356A5 - - Google Patents

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Publication number
JP2017123356A5
JP2017123356A5 JP2016000033A JP2016000033A JP2017123356A5 JP 2017123356 A5 JP2017123356 A5 JP 2017123356A5 JP 2016000033 A JP2016000033 A JP 2016000033A JP 2016000033 A JP2016000033 A JP 2016000033A JP 2017123356 A5 JP2017123356 A5 JP 2017123356A5
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JP
Japan
Prior art keywords
processing method
plasma
plasma processing
film
magnetic film
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Application number
JP2016000033A
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English (en)
Japanese (ja)
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JP6499980B2 (ja
JP2017123356A (ja
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Priority to JP2016000033A priority Critical patent/JP6499980B2/ja
Priority claimed from JP2016000033A external-priority patent/JP6499980B2/ja
Priority to KR1020160098396A priority patent/KR101903432B1/ko
Priority to TW105126830A priority patent/TWI642105B/zh
Priority to US15/260,351 priority patent/US9972776B2/en
Publication of JP2017123356A publication Critical patent/JP2017123356A/ja
Publication of JP2017123356A5 publication Critical patent/JP2017123356A5/ja
Application granted granted Critical
Publication of JP6499980B2 publication Critical patent/JP6499980B2/ja
Active legal-status Critical Current
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JP2016000033A 2016-01-04 2016-01-04 プラズマ処理方法 Active JP6499980B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016000033A JP6499980B2 (ja) 2016-01-04 2016-01-04 プラズマ処理方法
KR1020160098396A KR101903432B1 (ko) 2016-01-04 2016-08-02 플라스마 처리 방법
TW105126830A TWI642105B (zh) 2016-01-04 2016-08-19 Plasma processing method
US15/260,351 US9972776B2 (en) 2016-01-04 2016-09-09 Plasma processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016000033A JP6499980B2 (ja) 2016-01-04 2016-01-04 プラズマ処理方法

Publications (3)

Publication Number Publication Date
JP2017123356A JP2017123356A (ja) 2017-07-13
JP2017123356A5 true JP2017123356A5 (enExample) 2018-06-07
JP6499980B2 JP6499980B2 (ja) 2019-04-10

Family

ID=59227017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016000033A Active JP6499980B2 (ja) 2016-01-04 2016-01-04 プラズマ処理方法

Country Status (4)

Country Link
US (1) US9972776B2 (enExample)
JP (1) JP6499980B2 (enExample)
KR (1) KR101903432B1 (enExample)
TW (1) TWI642105B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6630649B2 (ja) * 2016-09-16 2020-01-15 株式会社日立ハイテクノロジーズ プラズマ処理方法
KR102224236B1 (ko) 2017-03-27 2021-03-08 주식회사 히타치하이테크 플라스마 처리 방법
WO2018231695A1 (en) * 2017-06-13 2018-12-20 Tokyo Electron Limited Process for patterning a magnetic tunnel junction
JP6845773B2 (ja) * 2017-09-15 2021-03-24 株式会社日立ハイテク プラズマ処理方法
US10460988B2 (en) * 2017-12-21 2019-10-29 Tokyo Electron Limited Removal method and processing method
US10522752B1 (en) 2018-08-22 2019-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Magnetic layer for magnetic random access memory (MRAM) by moment enhancement
TWI851606B (zh) 2018-10-05 2024-08-11 美商蘭姆研究公司 從處理腔室表面之金屬汙染移除
JP7300945B2 (ja) * 2019-09-13 2023-06-30 東京エレクトロン株式会社 クリーニング方法およびクリーニングプログラムを記録する記録媒体
WO2021260869A1 (ja) 2020-06-25 2021-12-30 株式会社日立ハイテク 真空処理方法
KR20220101830A (ko) * 2021-01-12 2022-07-19 에스케이스페셜티 주식회사 금속산화물 반도체 물질의 증착 챔버의 세정 방법
CN115699265B (zh) 2021-05-27 2025-06-27 株式会社日立高新技术 等离子处理装置
CN115513021B (zh) * 2021-06-07 2025-06-10 江苏鲁汶仪器股份有限公司 一种等离子腔体清洗组件、等离子体处理系统及清洗方法
JP7386348B2 (ja) 2021-06-21 2023-11-24 株式会社日立ハイテク プラズマ処理装置
CN113808902B (zh) * 2021-08-20 2024-09-27 深圳天狼芯半导体有限公司 一种干法刻蚀设备的腔体清理方法、装置、终端和介质
CN115985745B (zh) * 2022-12-05 2025-06-24 北京北方华创微电子装备有限公司 半导体工艺腔室和半导体工艺设备
CN119943640B (zh) * 2025-01-24 2025-11-04 华天慧创科技(西安)有限公司 一种清洁刻蚀腔室的灰化-清洁方法以及一种电感耦合等离子体刻蚀方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012515A (ja) * 1998-06-22 2000-01-14 Hitachi Ltd マイクロ波プラズマエッチング装置のプラズマクリーニング方法
JP2002359234A (ja) 2001-06-01 2002-12-13 Hitachi Ltd プラズマ処理方法
JP4764028B2 (ja) * 2005-02-28 2011-08-31 株式会社日立ハイテクノロジーズ プラズマ処理方法
US7602032B2 (en) * 2005-04-29 2009-10-13 Altis Semiconductor Snc Memory having cap structure for magnetoresistive junction and method for structuring the same
JPWO2008129605A1 (ja) * 2007-03-30 2010-07-22 キヤノンアネルバ株式会社 磁性素子の製造法
JP5110987B2 (ja) * 2007-07-05 2012-12-26 株式会社日立ハイテクノロジーズ プラズマ処理方法およびコンピュータ読み取り可能な記録媒体
US8802451B2 (en) * 2008-02-29 2014-08-12 Avalanche Technology Inc. Method for manufacturing high density non-volatile magnetic memory
JP5783890B2 (ja) 2011-12-07 2015-09-24 株式会社日立ハイテクノロジーズ プラズマ処理方法
JP6227483B2 (ja) * 2014-05-30 2017-11-08 株式会社日立ハイテクノロジーズ プラズマ処理方法

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