JP2017014362A5 - - Google Patents

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Publication number
JP2017014362A5
JP2017014362A5 JP2015131086A JP2015131086A JP2017014362A5 JP 2017014362 A5 JP2017014362 A5 JP 2017014362A5 JP 2015131086 A JP2015131086 A JP 2015131086A JP 2015131086 A JP2015131086 A JP 2015131086A JP 2017014362 A5 JP2017014362 A5 JP 2017014362A5
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JP
Japan
Prior art keywords
acid
alumina abrasive
abrasive grains
potassium
salt
Prior art date
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Application number
JP2015131086A
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English (en)
Japanese (ja)
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JP2017014362A (ja
JP6622991B2 (ja
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Publication date
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Priority to JP2015131086A priority Critical patent/JP6622991B2/ja
Priority claimed from JP2015131086A external-priority patent/JP6622991B2/ja
Priority to PCT/JP2016/068701 priority patent/WO2017002705A1/ja
Priority to TW105120783A priority patent/TW201706392A/zh
Publication of JP2017014362A publication Critical patent/JP2017014362A/ja
Publication of JP2017014362A5 publication Critical patent/JP2017014362A5/ja
Application granted granted Critical
Publication of JP6622991B2 publication Critical patent/JP6622991B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015131086A 2015-06-30 2015-06-30 研磨用組成物 Active JP6622991B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2015131086A JP6622991B2 (ja) 2015-06-30 2015-06-30 研磨用組成物
PCT/JP2016/068701 WO2017002705A1 (ja) 2015-06-30 2016-06-23 研磨用組成物
TW105120783A TW201706392A (zh) 2015-06-30 2016-06-30 研磨用組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015131086A JP6622991B2 (ja) 2015-06-30 2015-06-30 研磨用組成物

Publications (3)

Publication Number Publication Date
JP2017014362A JP2017014362A (ja) 2017-01-19
JP2017014362A5 true JP2017014362A5 (https=) 2018-06-14
JP6622991B2 JP6622991B2 (ja) 2019-12-18

Family

ID=57608367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015131086A Active JP6622991B2 (ja) 2015-06-30 2015-06-30 研磨用組成物

Country Status (3)

Country Link
JP (1) JP6622991B2 (https=)
TW (1) TW201706392A (https=)
WO (1) WO2017002705A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11117239B2 (en) 2017-09-29 2021-09-14 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing composition and method
JP7084176B2 (ja) * 2018-03-28 2022-06-14 株式会社フジミインコーポレーテッド 研磨用組成物
CN109233646A (zh) * 2018-11-02 2019-01-18 长沙县新光特种陶瓷有限公司 一种抛光蜡及其制备方法
JP7431038B2 (ja) * 2019-12-27 2024-02-14 ニッタ・デュポン株式会社 研磨用スラリー
JP2022039461A (ja) * 2020-08-28 2022-03-10 株式会社フジミインコーポレーテッド 研磨用組成物およびその濃縮液ならびにこれを用いた研磨方法
KR102620964B1 (ko) * 2021-07-08 2024-01-03 에스케이엔펄스 주식회사 반도체 공정용 연마 조성물 및 이를 이용한 연마된 물품의 제조방법
CN119773078B (zh) * 2025-03-01 2025-11-07 东莞励治研磨科技有限公司 一种蓝宝石衬底的加工工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4339034B2 (ja) * 2003-07-01 2009-10-07 花王株式会社 研磨液組成物
JP5381701B2 (ja) * 2007-02-27 2014-01-08 日立化成株式会社 金属用研磨液及び研磨方法
JP5461772B2 (ja) * 2007-12-14 2014-04-02 花王株式会社 研磨液組成物
JP5536433B2 (ja) * 2009-12-11 2014-07-02 花王株式会社 ハードディスク基板用研磨液組成物
TWI605112B (zh) * 2011-02-21 2017-11-11 福吉米股份有限公司 研磨用組成物
CN102572863B (zh) * 2012-02-03 2015-10-21 中兴通讯股份有限公司 一种无线通信覆盖的方法及系统
WO2013133198A1 (ja) * 2012-03-05 2013-09-12 株式会社 フジミインコーポレーテッド 研磨用組成物、及び当該研磨用組成物を用いた化合物半導体基板の製造方法
WO2014061417A1 (ja) * 2012-10-16 2014-04-24 日立化成株式会社 Cmp用研磨液、貯蔵液及び研磨方法
US10450651B2 (en) * 2013-01-18 2019-10-22 Fujimi Incorporated Article comprising metal oxide-containing coating

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