TW201706392A - 研磨用組成物 - Google Patents

研磨用組成物 Download PDF

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Publication number
TW201706392A
TW201706392A TW105120783A TW105120783A TW201706392A TW 201706392 A TW201706392 A TW 201706392A TW 105120783 A TW105120783 A TW 105120783A TW 105120783 A TW105120783 A TW 105120783A TW 201706392 A TW201706392 A TW 201706392A
Authority
TW
Taiwan
Prior art keywords
polishing
alumina
abrasive grains
alumina abrasive
polishing composition
Prior art date
Application number
TW105120783A
Other languages
English (en)
Chinese (zh)
Inventor
髙橋修平
戶松正利
Original Assignee
福吉米股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 福吉米股份有限公司 filed Critical 福吉米股份有限公司
Publication of TW201706392A publication Critical patent/TW201706392A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW105120783A 2015-06-30 2016-06-30 研磨用組成物 TW201706392A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015131086A JP6622991B2 (ja) 2015-06-30 2015-06-30 研磨用組成物

Publications (1)

Publication Number Publication Date
TW201706392A true TW201706392A (zh) 2017-02-16

Family

ID=57608367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105120783A TW201706392A (zh) 2015-06-30 2016-06-30 研磨用組成物

Country Status (3)

Country Link
JP (1) JP6622991B2 (https=)
TW (1) TW201706392A (https=)
WO (1) WO2017002705A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109571240A (zh) * 2017-09-29 2019-04-05 台湾积体电路制造股份有限公司 化学机械研磨浆料及化学机械研磨方法
CN115678438A (zh) * 2018-03-28 2023-02-03 福吉米株式会社 研磨用组合物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109233646A (zh) * 2018-11-02 2019-01-18 长沙县新光特种陶瓷有限公司 一种抛光蜡及其制备方法
JP7431038B2 (ja) * 2019-12-27 2024-02-14 ニッタ・デュポン株式会社 研磨用スラリー
JP2022039461A (ja) * 2020-08-28 2022-03-10 株式会社フジミインコーポレーテッド 研磨用組成物およびその濃縮液ならびにこれを用いた研磨方法
KR102620964B1 (ko) * 2021-07-08 2024-01-03 에스케이엔펄스 주식회사 반도체 공정용 연마 조성물 및 이를 이용한 연마된 물품의 제조방법
CN119773078B (zh) * 2025-03-01 2025-11-07 东莞励治研磨科技有限公司 一种蓝宝石衬底的加工工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4339034B2 (ja) * 2003-07-01 2009-10-07 花王株式会社 研磨液組成物
JP5381701B2 (ja) * 2007-02-27 2014-01-08 日立化成株式会社 金属用研磨液及び研磨方法
JP5461772B2 (ja) * 2007-12-14 2014-04-02 花王株式会社 研磨液組成物
JP5536433B2 (ja) * 2009-12-11 2014-07-02 花王株式会社 ハードディスク基板用研磨液組成物
TWI605112B (zh) * 2011-02-21 2017-11-11 福吉米股份有限公司 研磨用組成物
CN102572863B (zh) * 2012-02-03 2015-10-21 中兴通讯股份有限公司 一种无线通信覆盖的方法及系统
WO2013133198A1 (ja) * 2012-03-05 2013-09-12 株式会社 フジミインコーポレーテッド 研磨用組成物、及び当該研磨用組成物を用いた化合物半導体基板の製造方法
WO2014061417A1 (ja) * 2012-10-16 2014-04-24 日立化成株式会社 Ｃｍｐ用研磨液、貯蔵液及び研磨方法
US10450651B2 (en) * 2013-01-18 2019-10-22 Fujimi Incorporated Article comprising metal oxide-containing coating

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109571240A (zh) * 2017-09-29 2019-04-05 台湾积体电路制造股份有限公司 化学机械研磨浆料及化学机械研磨方法
US11117239B2 (en) 2017-09-29 2021-09-14 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing composition and method
TWI743398B (zh) * 2017-09-29 2021-10-21 台灣積體電路製造股份有限公司 化學機械研磨方法
CN115678438A (zh) * 2018-03-28 2023-02-03 福吉米株式会社 研磨用组合物

Also Published As

Publication number Publication date
WO2017002705A1 (ja) 2017-01-05
JP2017014362A (ja) 2017-01-19
JP6622991B2 (ja) 2019-12-18

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