JP6622991B2 - 研磨用組成物 - Google Patents

研磨用組成物 Download PDF

Info

Publication number
JP6622991B2
JP6622991B2 JP2015131086A JP2015131086A JP6622991B2 JP 6622991 B2 JP6622991 B2 JP 6622991B2 JP 2015131086 A JP2015131086 A JP 2015131086A JP 2015131086 A JP2015131086 A JP 2015131086A JP 6622991 B2 JP6622991 B2 JP 6622991B2
Authority
JP
Japan
Prior art keywords
polishing
abrasive grains
alumina
alumina abrasive
polishing composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015131086A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017014362A5 (https=
JP2017014362A (ja
Inventor
修平 ▲高▼橋
修平 ▲高▼橋
正利 戸松
正利 戸松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Priority to JP2015131086A priority Critical patent/JP6622991B2/ja
Priority to PCT/JP2016/068701 priority patent/WO2017002705A1/ja
Priority to TW105120783A priority patent/TW201706392A/zh
Publication of JP2017014362A publication Critical patent/JP2017014362A/ja
Publication of JP2017014362A5 publication Critical patent/JP2017014362A5/ja
Application granted granted Critical
Publication of JP6622991B2 publication Critical patent/JP6622991B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2015131086A 2015-06-30 2015-06-30 研磨用組成物 Active JP6622991B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2015131086A JP6622991B2 (ja) 2015-06-30 2015-06-30 研磨用組成物
PCT/JP2016/068701 WO2017002705A1 (ja) 2015-06-30 2016-06-23 研磨用組成物
TW105120783A TW201706392A (zh) 2015-06-30 2016-06-30 研磨用組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015131086A JP6622991B2 (ja) 2015-06-30 2015-06-30 研磨用組成物

Publications (3)

Publication Number Publication Date
JP2017014362A JP2017014362A (ja) 2017-01-19
JP2017014362A5 JP2017014362A5 (https=) 2018-06-14
JP6622991B2 true JP6622991B2 (ja) 2019-12-18

Family

ID=57608367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015131086A Active JP6622991B2 (ja) 2015-06-30 2015-06-30 研磨用組成物

Country Status (3)

Country Link
JP (1) JP6622991B2 (https=)
TW (1) TW201706392A (https=)
WO (1) WO2017002705A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11117239B2 (en) 2017-09-29 2021-09-14 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing composition and method
JP7084176B2 (ja) * 2018-03-28 2022-06-14 株式会社フジミインコーポレーテッド 研磨用組成物
CN109233646A (zh) * 2018-11-02 2019-01-18 长沙县新光特种陶瓷有限公司 一种抛光蜡及其制备方法
JP7431038B2 (ja) * 2019-12-27 2024-02-14 ニッタ・デュポン株式会社 研磨用スラリー
JP2022039461A (ja) * 2020-08-28 2022-03-10 株式会社フジミインコーポレーテッド 研磨用組成物およびその濃縮液ならびにこれを用いた研磨方法
KR102620964B1 (ko) * 2021-07-08 2024-01-03 에스케이엔펄스 주식회사 반도체 공정용 연마 조성물 및 이를 이용한 연마된 물품의 제조방법
CN119773078B (zh) * 2025-03-01 2025-11-07 东莞励治研磨科技有限公司 一种蓝宝石衬底的加工工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4339034B2 (ja) * 2003-07-01 2009-10-07 花王株式会社 研磨液組成物
JP5381701B2 (ja) * 2007-02-27 2014-01-08 日立化成株式会社 金属用研磨液及び研磨方法
JP5461772B2 (ja) * 2007-12-14 2014-04-02 花王株式会社 研磨液組成物
JP5536433B2 (ja) * 2009-12-11 2014-07-02 花王株式会社 ハードディスク基板用研磨液組成物
TWI605112B (zh) * 2011-02-21 2017-11-11 福吉米股份有限公司 研磨用組成物
CN102572863B (zh) * 2012-02-03 2015-10-21 中兴通讯股份有限公司 一种无线通信覆盖的方法及系统
WO2013133198A1 (ja) * 2012-03-05 2013-09-12 株式会社 フジミインコーポレーテッド 研磨用組成物、及び当該研磨用組成物を用いた化合物半導体基板の製造方法
WO2014061417A1 (ja) * 2012-10-16 2014-04-24 日立化成株式会社 Ｃｍｐ用研磨液、貯蔵液及び研磨方法
US10450651B2 (en) * 2013-01-18 2019-10-22 Fujimi Incorporated Article comprising metal oxide-containing coating

Also Published As

Publication number Publication date
WO2017002705A1 (ja) 2017-01-05
JP2017014362A (ja) 2017-01-19
TW201706392A (zh) 2017-02-16

Similar Documents

Publication Publication Date Title
JP6670587B2 (ja) 研磨方法およびポリシング用組成物
JP7373403B2 (ja) 研磨用組成物
JP6622991B2 (ja) 研磨用組成物
JP6788988B2 (ja) 研磨用組成物
WO2023189512A1 (ja) 研磨用組成物
CN111868201B (zh) 研磨用组合物
JP6694745B2 (ja) 研磨用組成物
CN107109191B (zh) 研磨用组合物
WO2023054385A1 (ja) 研磨用組成物
WO2025205564A1 (ja) 研磨用組成物
WO2025205563A1 (ja) 研磨用組成物
WO2025205562A1 (ja) 研磨用組成物

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180502

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180502

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190411

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190604

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20191031

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20191125

R150 Certificate of patent or registration of utility model

Ref document number: 6622991

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250