JP2016520678A - 硬化性組成物 - Google Patents
硬化性組成物 Download PDFInfo
- Publication number
- JP2016520678A JP2016520678A JP2016506248A JP2016506248A JP2016520678A JP 2016520678 A JP2016520678 A JP 2016520678A JP 2016506248 A JP2016506248 A JP 2016506248A JP 2016506248 A JP2016506248 A JP 2016506248A JP 2016520678 A JP2016520678 A JP 2016520678A
- Authority
- JP
- Japan
- Prior art keywords
- polyorganosiloxane
- sio
- chemical formula
- group
- curable composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000203 mixture Substances 0.000 title claims abstract description 126
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 239000000126 substance Substances 0.000 claims description 133
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 26
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- 238000002834 transmittance Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
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Abstract
Description
(R1 3SiO1/2)a(R2 2SiO2/2)b(R3SiO3/2)c(SiO4/2)d(OR)e
(R4 3SiO1/2)f(R5 2SiO2/2)g(R6SiO3/2)h(SiO4/2)i(OR)j
化学式3でnは、例えば、1〜8、1〜6、1〜4、1〜3または1〜2であることができる。
(HR1 2SiO1/2)3(R2SiO3/2)
(HR2SiO)a(RSiO3/2)b(R2SiO2/2)c
R3SiO(HRSiO)r(R2SiO)sOSiR3
(R1 3SiO1/2)a(R2 2SiO2/2)b(R3 1SiO3/2)c(SiO4/2)d
化学式8〜10で、Rf〜Riの具体的な種類やo、p及びqの具体的な数値、そして混合物内での各成分の比率は、目的するポリオルガノシロキサン(E)の構造によって定められることができる。
[RjSiO3/2]
[RkRl 2SiO1/2]p[RmSiO3/2]q
(RnRo 2Si)2O
化学式13で、1価炭化水素基の具体的な種類や混合物内での配合比率は、目的するポリオルガノシロキサン(E)によって定められることができる。
0.02〜0.5,0.08〜0.5,0.1〜0.5または0.1〜0.4の範囲内であり、全ケイ素原子(Si)に対してアリール基(Ar)のモル比(Ar/Si)が0.9以下、0.8以下、0.7以下、0.6以下、0.5以下、0.4以下、0.3以下、0.2以下、0.1以下または0.05以下であり、全ケイ素原子(Si)に対してエポキシ基(Ep)のモル比(Ep/Si)が0.01〜0.5,0.05〜0.5,0.1〜0.5または0.1〜0.45の範囲内のポリオルガノシロキサンであることができる。
(R1 3SiO1/2)a(R2 2SiO2/2)b(R3SiO3/2)c(SiO4/2)d(OR)e
ポリフタルアミド(PPA)で製造された5630 LEDパッケージを使用して素子信頼性を評価する。ポリフタルアミドカップ内に硬化性組成物をディスペンシングし、60℃で1時間維持し、さらに80℃で1時間維持した後、さらに150℃で4時間維持することによって硬化させて、表面実装型LEDを製造する。その後、製造されたLEDを85℃温度条件で維持した状態で120mAの電流を流しながら500時間動作させる。引き続いて、動作前の初期輝度に対して動作後の輝度減少率を測定し、下記基準で評価する。
〈評価基準〉
A:輝度減少率が5%以下の場合
B:輝度減少率が5%を超過し、7%以下の場合
C:輝度減少率が7%を超過する場合
それぞれ公知の方法で製造された下記の化学式A〜Dで表示される化合物を混合し、混合物(配合量:化学式A:15g、化学式B:85g、化学式C:28g、化学式D:1.0g)を製造し、Pt(0)の含量が2ppmになる量で触媒(Platinum(0)−1、3−divinyl−1、1、3、3−tetramethyldisiloxane)を配合し、硬化性組成物を製造した。
[化学式A]
(ViMe2SiO1/2)(Me3SiO1/2)5(Me2SiO2/2)1.5(PhSiO3/2)0.5(SiO4/2)3.5
[化学式B]
(ViMe2SiO1/2)2(Me2SiO2/2)1.5(PhSiO3/2)6.5
[化学式C]
(HMe2SiO1/2)2(Ph2SiO2/2)
[化学式D]
(ViMe2SiO1/2)2(Me3SiO1/2)2(EpMeSiO3/2)2.5(SiO4/2)
それぞれ公知の方法で製造された下記の化学式E〜G及び上記化学式Dで表示される化合物を混合し、混合物(配合量:化学式E:30g、化学式F:70g、化学式G:24g、化学式D:1.0g)を製造し、Pt(0)の含量が2ppmになる量で触媒(Platinum(0)−1、3−divinyl−1、1、3、3−tetramethyldisiloxane)を配合し、硬化性組成物を製造した。
[化学式E]
(ViMe2SiO1/2)(Me3SiO1/2)4(PhMeSiO2/2)(SiO4/2)4.0
[化学式F]
(ViMe2SiO1/2)2(Me2SiO2/2)2(PhSiO3/2)5
[化学式G]
(HMe2SiO1/2)2(MePhSiO2/2)
それぞれ公知の方法で製造された下記の化学式A〜Dで表示される化合物を混合し、混合物(配合量:化学式A:5g、化学式B:95g、化学式C:28g、化学式D:1.0g)を製造し、Pt(0)の含量が2ppmになる量で触媒(Platinum(0)−1、3−divinyl−1、1、3、3−tetramethyldisiloxane)を配合し、硬化性組成物を製造した。
[化学式A]
(ViMe2SiO1/2)4(SiO4/2)
[化学式B]
(ViMe2SiO1/2)2(Me2SiO2/2)1.5(PhSiO3/2)6.5
[化学式C]
(HMe2SiO1/2)2(Ph2SiO2/2)
[化学式D]
(ViMe2SiO1/2)2(Me3SiO1/2)2(EpMeSiO3/2)2.5(SiO4/2)
それぞれ公知の方法で製造された下記の化学式A〜Dで表示される化合物を混合し、混合物(配合量:化学式A:10g、化学式B:90g、化学式C:28g、化学式D:1.0g)を製造し、Pt(0)の含量が2ppmになる量で触媒(Platinum(0)−1、3−divinyl−1、1、3、3−tetramethyldisiloxane)を配合し、硬化性組成物を製造した。
[化学式A]
(ViMe2SiO1/2)4(PhSiO3/2)0.2(SiO4/2)0.8
[化学式B]
(ViMe2SiO1/2)2(Me2SiO2/2)1.5(PhSiO3/2)6.5
[化学式C]
(HMe2SiO1/2)2(Ph2SiO2/2)
[化学式D]
(ViMe2SiO1/2)2(Me3SiO1/2)2(EpMeSiO3/2)2.5(SiO4/2)
化学式Cの化合物を使用せず、下記化学式Hの化合物11gを使用したこと以外には、実施例1と同一に硬化性組成物を製造した。
[化学式H]
(Me3SiO1/2)(HMeSiO2/2)20
化学式Cの化合物を使用せず、下記化学式Iの化合物19gを使用したこと以外には、実施例1と同一に硬化性組成物を製造した。
[化学式I]
(HMe2SiO1/2)3(PhSiO3/2)
それぞれ公知の方法で製造された下記の化学式J〜Lで表示される化合物を混合し、混合物(配合量:化学式J:15g、化学式K:1g、化学式L:1.0g)を製造し、Pt(0)の含量が2ppmになる量で触媒(Platinum(0)−1、3−divinyl−1、1、3、3−tetramethyldisiloxane)を配合し、硬化性組成物を製造した。
[化学式J]
(ViMe2SiO1/2)(Me3SiO1/2)5(Me2SiO2/2)1.5(SiO4/2)4.5
[化学式K]
(Me3SiO1/2)(HMeSiO2/2)20
[化学式L]
(ViMe2SiO1/2)2(Me3SiO1/2)2(EpMeSiO2/2)2.5(SiO4/2)
それぞれ公知の方法で製造された下記の化学式M〜Oで表示される化合物を混合し、混合物(配合量:化学式M:100g、化学式N:20g、化学式O:1.0g)を製造し、Pt(0)の含量が2ppmになる量で触媒(Platinum(0)−1、3−divinyl−1、1、3、3−tetramethyldisiloxane)を配合し、硬化性組成物を製造した。
[化学式M]
(ViMe2SiO1/2)2(Me2SiO2/2)1.5(PhSiO3/2)6.5
[化学式N]
(HMe2SiO1/2)3(PhSiO3/2)
[化学式O]
(ViMe2SiO1/2)2(Me3SiO1/2)2(EpMeSiO2/2)2.5(SiO4/2)
それぞれ公知の方法で製造された下記の化学式A〜Dで表示される化合物を混合し、混合物(配合量:化学式A:15g、化学式B:85g、化学式C:28g、化学式D:1.0g)を製造し、Pt(0)の含量が2ppmになる量で触媒(Platinum(0)−1、3−divinyl−1、1、3、3−tetramethyldisiloxane)を配合し、硬化性組成物を製造した。
[化学式A]
(ViMe2SiO1/2)(Me3SiO1/2)2(PhSiO3/2)3.5(SiO4/2)0.5
[化学式B]
(ViMe2SiO1/2)2(Me2SiO2/2)1.5(PhSiO3/2)6.5
[化学式C]
(HMe2SiO1/2)2(Ph2SiO2/2)
[化学式D]
(ViMe2SiO1/2)2(Me3SiO1/2)2(EpMeSiO3/2)2.5(SiO4/2)
Claims (19)
- (A)脂肪族不飽和結合を有し、全ケイ素原子(Si)に対するアリール基(Ar)のモル比(Ar/Si)が0.3以下の第1の架橋型ポリオルガノシロキサン;
(B)脂肪族不飽和結合を有し、全ケイ素原子(Si)に対するアリール基(Ar)のモル比(Ar/Si)が第1の架橋型ポリオルガノシロキサン(A)とは異なっていて0.3以上である、第2の架橋型ポリオルガノシロキサン;及び
(C)ケイ素原子に結合している水素原子及びアリール基を含み、ケイ素原子(Si)に対してアリール基(Ar)のモル比が0.3以上であり、3個〜10個のケイ素原子を有するポリオルガノシロキサン
を含む硬化性組成物。 - 第1の架橋型ポリオルガノシロキサン(A)及び第2の架橋型ポリオルガノシロキサン(B)は、それぞれ全ケイ素原子(Si)のモル数に対するアルケニル基(Ak)のモル数の比(Ak/Si)が0.01〜0.4である、請求項1に記載の硬化性組成物。
- 第1の架橋型ポリオルガノシロキサン(A)は、下記化学式1の平均組成式を有する、請求項1に記載の硬化性組成物:
[化学式1]
(R1 3SiO1/2)a(R2 2SiO2/2)b(R3SiO3/2)c(SiO4/2)d(OR)e
化学式1でR1〜R3は、それぞれ独立に、エポキシ基または1価炭化水素基であり、且つR1〜R3のうち少なくとも1つは、アルケニル基であり、Rは、1価炭化水素基であり、a、b、c、d及びeは、それぞれ独立に、0または正の数であり、d/(c+d)は、0.3以上であり、且つe/(c+d)は、0.2以下である。 - 第2の架橋型ポリオルガノシロキサン(B)は、下記化学式2の平均組成式を有する、請求項1に記載の硬化性組成物:
[化学式2]
(R4 3SiO1/2)f(R5 2SiO2/2)g(R6SiO3/2)h(SiO4/2)i(OR)j
化学式2でR4〜R5は、それぞれ独立に、エポキシ基または1価炭化水素基であり、且つR4〜R5のうち少なくとも1つは、アルケニル基であり、R4〜R5のうち少なくとも1つは、アリール基であり、Rは、水素または1価炭化水素基であり、f、g、h、i及びjは、それぞれ独立に、0または正の数であり、h/(h+i)は、0.7以上であり、j/(h+i)は、0.2以下である。 - ポリオルガノシロキサン(C)の全ケイ素原子(Si)のモル数に対するケイ素原子結合水素原子(H)のモル数の比(H/Si)は、0.2〜0.8である、請求項1に記載の硬化性組成物。
- ポリオルガノシロキサン(C)は、25℃における粘度が300mPa・s以下である、請求項1に記載の硬化性組成物。
- ポリオルガノシロキサン(C)の分子量は、1,000未満である、請求項1に記載の硬化性組成物。
- ケイ素原子に結合している水素原子を含み、ケイ素原子(Si)に対するアリール基(Ar)のモル比が0.3以下であり、10個〜50個のケイ素原子を含むポリオルガノシロキサンをさらに含む、請求項1に記載の硬化性組成物。
- 下記化学式5の平均組成式の化合物をさらに含む、請求項1に記載の硬化性組成物:
[化学式5]
(HR2SiO1/2)a(RSiO3/2)b(R2SiO2/2)c
化学式5でRは、それぞれ独立に、1価の炭化水素基であり、Rのうち少なくとも1つは、アリール基であり、a、b及びcの総和(a+b+c)は、1であり、aは、0.3〜0.8であり、bは、0.2〜0.7であり、cは、0〜0.5である。 - 下記化学式6の化合物をさらに含む、請求項1に記載の硬化性組成物:
[化学式6]
R3SiO(HRSiO)r(R2SiO)sOSiR3
化学式6でRは、それぞれ独立に、水素、エポキシまたは1価の炭化水素基であり、rは、5〜100であり、sは、0〜100である。 - 線形ポリオルガノシロキサン、または、2官能性シロキサン単位(D)、3官能性シロキサン単位(T)及び4官能性シロキサン単位(Q)の合計に対する全2官能性シロキサン単位(D)のモル比(D/(D+T+Q))が0.7以上の部分架橋型ポリオルガノシロキサンをさらに含む、請求項1に記載の硬化性組成物。
- 前記線形ポリオルガノシロキサンまたは前記部分架橋型ポリオルガノシロキサンは、全ケイ素原子(Si)に対するアリール基(Ar)のモル比(Ar/Si)が0.3以下である、請求項12に記載の硬化性組成物。
- 前記線形ポリオルガノシロキサンまたは前記部分架橋型ポリオルガノシロキサンは、全ケイ素原子(Si)に対してアリール基(Ar)のモル比(Ar/Si)が0.3以上である、請求項12に記載の硬化性組成物。
- ケイ素原子に結合されたアルケニル基とエポキシ基を含み、全ケイ素原子(Si)に対するアルケニル基(Ak)のモル比(Ak/Si)が0.02〜0.5であり、全ケイ素原子(Si)に対するアリール基(Ar)のモル比(Ar/Si)が0.9以下であり、全ケイ素原子(Si)に対するエポキシ基(Ep)のモル比(Ep/Si)が0.01〜0.5であるポリオルガノシロキサンをさらに含む、請求項1に記載の硬化性組成物。
- 請求項1に記載の硬化性組成物の硬化物を含む封止材で封止された半導体素子。
- 請求項1に記載の硬化性組成物の硬化物を含む封止材で封止された光半導体素子。
- 請求項17に記載の光半導体素子を含む液晶表示装置。
- 請求項17に記載の光半導体素子を含む照明。
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WO2018131545A1 (ja) * | 2017-01-16 | 2018-07-19 | 株式会社ダイセル | 硬化性樹脂組成物、その硬化物、及び半導体装置 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005042099A (ja) * | 2003-07-09 | 2005-02-17 | Shin Etsu Chem Co Ltd | シリコーンゴム組成物並びに発光半導体被覆保護材及び発光半導体装置 |
JP2010001335A (ja) * | 2008-06-18 | 2010-01-07 | Dow Corning Toray Co Ltd | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
WO2011090362A2 (ko) * | 2010-01-25 | 2011-07-28 | (주)Lg화학 | 실리콘 수지 |
JP2011225715A (ja) * | 2010-04-20 | 2011-11-10 | Shin-Etsu Chemical Co Ltd | 硬化性オルガノポリシロキサン組成物 |
US20120184663A1 (en) * | 2011-01-17 | 2012-07-19 | Shin-Etsu Chemical Co., Ltd. | Silicone resin composition and an optical semiconductor device making use of the composition |
JP2012251116A (ja) * | 2011-06-07 | 2012-12-20 | Shin-Etsu Chemical Co Ltd | シリコーンゲル組成物及び該組成物の硬化物で封止された電子回路 |
WO2013015591A2 (ko) * | 2011-07-22 | 2013-01-31 | 주식회사 엘지화학 | 경화성 조성물 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3241338B2 (ja) | 1998-01-26 | 2001-12-25 | 日亜化学工業株式会社 | 半導体発光装置 |
JP2001196151A (ja) | 2000-01-12 | 2001-07-19 | Takazono Sangyo Kk | 発熱体装置及び発熱体温度制御方法 |
JP2002226551A (ja) | 2001-01-31 | 2002-08-14 | Matsushita Electric Ind Co Ltd | 発光ダイオード |
JP4908736B2 (ja) * | 2003-10-01 | 2012-04-04 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
CN101356214B (zh) * | 2006-01-17 | 2011-05-18 | 陶氏康宁公司 | 热稳定的透明有机硅树脂组合物及其制备方法和用途 |
KR101395027B1 (ko) * | 2006-10-19 | 2014-05-22 | 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 | 경화성 폴리오르가노실록산 조성물 |
KR20090077995A (ko) | 2008-01-14 | 2009-07-17 | 주성대학산학협력단 | 친환경 중소형 쇼케이스 혼합냉매 조성물 |
JP2009173773A (ja) | 2008-01-24 | 2009-08-06 | Toshiba Corp | シリコーン樹脂組成物および半導体装置 |
JP5000566B2 (ja) * | 2008-03-27 | 2012-08-15 | 信越化学工業株式会社 | 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置 |
JP5170471B2 (ja) * | 2010-09-02 | 2013-03-27 | 信越化学工業株式会社 | 低ガス透過性シリコーン樹脂組成物及び光半導体装置 |
KR20140006786A (ko) * | 2010-10-19 | 2014-01-16 | 세키스이가가쿠 고교가부시키가이샤 | 광반도체 장치용 밀봉제 및 그것을 이용한 광반도체 장치 |
TWI435914B (zh) * | 2010-12-31 | 2014-05-01 | Eternal Chemical Co Ltd | 可固化之有機聚矽氧烷組合物及其製法 |
-
2014
- 2014-04-04 JP JP2016506248A patent/JP6237879B2/ja active Active
- 2014-04-04 EP EP14779609.8A patent/EP2982716B1/en active Active
- 2014-04-04 WO PCT/KR2014/002942 patent/WO2014163439A1/ko active Application Filing
- 2014-04-04 CN CN201480018907.9A patent/CN105121554B/zh active Active
- 2014-04-04 KR KR1020140040824A patent/KR101591170B1/ko active IP Right Grant
- 2014-04-07 TW TW103112708A patent/TWI529218B/zh active
- 2014-08-11 US US14/456,656 patent/US9249302B2/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005042099A (ja) * | 2003-07-09 | 2005-02-17 | Shin Etsu Chem Co Ltd | シリコーンゴム組成物並びに発光半導体被覆保護材及び発光半導体装置 |
JP2010001335A (ja) * | 2008-06-18 | 2010-01-07 | Dow Corning Toray Co Ltd | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
WO2011090362A2 (ko) * | 2010-01-25 | 2011-07-28 | (주)Lg화학 | 실리콘 수지 |
JP2011225715A (ja) * | 2010-04-20 | 2011-11-10 | Shin-Etsu Chemical Co Ltd | 硬化性オルガノポリシロキサン組成物 |
US20120184663A1 (en) * | 2011-01-17 | 2012-07-19 | Shin-Etsu Chemical Co., Ltd. | Silicone resin composition and an optical semiconductor device making use of the composition |
JP2012149131A (ja) * | 2011-01-17 | 2012-08-09 | Shin-Etsu Chemical Co Ltd | シリコーン樹脂組成物及び当該組成物を使用した光半導体装置 |
JP2012251116A (ja) * | 2011-06-07 | 2012-12-20 | Shin-Etsu Chemical Co Ltd | シリコーンゲル組成物及び該組成物の硬化物で封止された電子回路 |
WO2013015591A2 (ko) * | 2011-07-22 | 2013-01-31 | 주식회사 엘지화학 | 경화성 조성물 |
US20140132892A1 (en) * | 2011-07-22 | 2014-05-15 | Lg Chem, Ltd. | Curable composition |
EP2735590A2 (en) * | 2011-07-22 | 2014-05-28 | LG Chem, Ltd. | Curable composition |
JP2014520946A (ja) * | 2011-07-22 | 2014-08-25 | エルジー・ケム・リミテッド | 硬化性組成物 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018131545A1 (ja) * | 2017-01-16 | 2018-07-19 | 株式会社ダイセル | 硬化性樹脂組成物、その硬化物、及び半導体装置 |
KR20190103366A (ko) * | 2017-01-16 | 2019-09-04 | 주식회사 다이셀 | 경화성 수지 조성물, 그의 경화물 및 반도체 장치 |
JPWO2018131545A1 (ja) * | 2017-01-16 | 2019-11-07 | 株式会社ダイセル | 硬化性樹脂組成物、その硬化物、及び半導体装置 |
KR102518155B1 (ko) * | 2017-01-16 | 2023-04-06 | 니치아 카가쿠 고교 가부시키가이샤 | 경화성 수지 조성물, 그의 경화물 및 반도체 장치 |
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