JP2016515298A - 電磁干渉軽減特性を有するポリマー複合物 - Google Patents

電磁干渉軽減特性を有するポリマー複合物 Download PDF

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JP2016515298A
JP2016515298A JP2015558903A JP2015558903A JP2016515298A JP 2016515298 A JP2016515298 A JP 2016515298A JP 2015558903 A JP2015558903 A JP 2015558903A JP 2015558903 A JP2015558903 A JP 2015558903A JP 2016515298 A JP2016515298 A JP 2016515298A
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polymer matrix
particles
composite
lossy
polymer
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JP2016515298A5 (OSRAM
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ディパンカー ゴーシュ，
ディパンカー ゴーシュ，
ビプラブ ケー． ロイ，
ビプラブ ケー． ロイ，
ニティン エス． サターカー，
ニティン エス． サターカー，
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2248—Oxides; Hydroxides of metals of copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/046—Carbon nanorods, nanowires, nanoplatelets or nanofibres

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
JP2015558903A 2013-02-21 2014-02-18 電磁干渉軽減特性を有するポリマー複合物 Pending JP2016515298A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361767482P 2013-02-21 2013-02-21
US61/767,482 2013-02-21
PCT/US2014/016828 WO2014130431A2 (en) 2013-02-21 2014-02-18 Polymer composites with electromagnetic interference mitigation properties

Related Child Applications (1)

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JP2019071096A Division JP2019143149A (ja) 2013-02-21 2019-04-03 電磁干渉軽減特性を有するポリマー複合物

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JP2016515298A true JP2016515298A (ja) 2016-05-26
JP2016515298A5 JP2016515298A5 (OSRAM) 2017-03-09

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JP2015558903A Pending JP2016515298A (ja) 2013-02-21 2014-02-18 電磁干渉軽減特性を有するポリマー複合物
JP2019071096A Pending JP2019143149A (ja) 2013-02-21 2019-04-03 電磁干渉軽減特性を有するポリマー複合物

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US (3) US9704613B2 (OSRAM)
EP (1) EP2959490A2 (OSRAM)
JP (2) JP2016515298A (OSRAM)
CN (1) CN105009225B (OSRAM)
WO (1) WO2014130431A2 (OSRAM)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018081735A (ja) * 2016-11-18 2018-05-24 独立行政法人国立高等専門学校機構 複合素子の製造方法
JP6733857B1 (ja) * 2019-02-20 2020-08-05 住友金属鉱山株式会社 電磁波吸収材料及び電磁波吸収体
JP6733858B1 (ja) * 2019-04-15 2020-08-05 住友金属鉱山株式会社 電磁波吸収材料及び電磁波吸収体
WO2020170608A1 (ja) * 2019-02-20 2020-08-27 住友金属鉱山株式会社 電磁波吸収材料及び電磁波吸収体
WO2020213215A1 (ja) * 2019-04-15 2020-10-22 住友金属鉱山株式会社 電磁波吸収材料及び電磁波吸収体
EP4159816A4 (en) * 2020-05-29 2024-11-06 Kyocera Corporation Resin composition and electronic component

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CN110915814B (zh) 2012-08-09 2022-07-22 卡普龙股份有限公司 抗微生物固体表面及其处理和制备方法
JP2017502513A (ja) 2013-12-18 2017-01-19 スリーエム イノベイティブ プロパティズ カンパニー 一酸化チタン（ｔｉｏ）系材料を用いる電磁干渉（ｅｍｉ）シールド用製品
WO2016039830A1 (en) * 2014-09-12 2016-03-17 Sabic Global Technologies B.V. Use of ambient-robust solution processing for preparing nanoscale organic ferroelectric films
CN107736085B (zh) * 2015-06-09 2019-11-29 3M创新有限公司 高频电磁干扰（emi）复合材料
WO2017116656A1 (en) 2015-12-29 2017-07-06 3M Innovative Properties Company Composites for high frequency electromagnetic interference (emi) applications
AT518664B1 (de) * 2016-04-22 2017-12-15 Trench Austria Gmbh HGÜ-Luftdrosselspule und Verfahren zur Herstellung
WO2018081394A1 (en) 2016-10-31 2018-05-03 3M Innovative Properties Company High-dielectric-loss composites for electromagnetic interference (emi) applications
CN106793727A (zh) * 2016-12-13 2017-05-31 苏州城邦达力材料科技有限公司 一种电磁屏蔽膜及其制备方法
US11434381B2 (en) 2017-03-06 2022-09-06 Bic-Violex Sa Coating
CN107129736B (zh) * 2017-04-17 2019-11-12 中国人民解放军61489部队 一种具有辐射屏蔽能力的放射性沾染控制与清除材料
CN107249291B (zh) * 2017-06-22 2019-02-05 朱勇 电力调度自动化系统用电磁屏蔽材料
CN107135641A (zh) * 2017-07-11 2017-09-05 苏州城邦达力材料科技有限公司 一种新型非金属体系的电磁屏蔽膜及其制备方法
CN107172873A (zh) * 2017-07-11 2017-09-15 苏州城邦达力材料科技有限公司 一种导电高分子材料电磁屏蔽膜及其制备方法
KR102451386B1 (ko) * 2018-03-30 2022-10-07 다이킨 고교 가부시키가이샤 전파 흡수 재료 및 전파 흡수 시트
EP3776728A1 (en) 2018-04-06 2021-02-17 3M Innovative Properties Company Radar standing wave dampnening components and systems
JP6588596B2 (ja) * 2018-05-07 2019-10-09 藤森工業株式会社 粘着剤層及び粘着フィルム
US11873403B2 (en) 2018-05-16 2024-01-16 3M Innovative Properties Company Electric field grading composition, methods of making the same, and composite articles including the same
JP7264391B2 (ja) * 2018-07-11 2023-04-25 北川工業株式会社 熱伝導組成物
CN108912966A (zh) * 2018-08-06 2018-11-30 广州市花林景观工程有限公司 用于卫生间的多功能涂料的制备方法
CN109111873A (zh) * 2018-08-06 2019-01-01 广州市花林景观工程有限公司 具有电磁屏蔽效果的建筑用塑料卷材
CN109021854A (zh) * 2018-08-06 2018-12-18 广州市花林景观工程有限公司 一种半导电塑料卷材结构
US12022642B2 (en) 2018-08-21 2024-06-25 Laird Technologies, Inc. Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes
WO2020041320A1 (en) * 2018-08-21 2020-02-27 Laird Technologies, Inc. Patterned materials and films and systems and methods for making the same
US11875919B2 (en) 2019-03-18 2024-01-16 3M Innovative Properties Company Multilayer electric field grading article, methods of making the same, and articles including the same
CN110157346B (zh) * 2019-05-06 2021-05-07 费植煌 一种含石墨烯的装饰膜
JP2019206726A (ja) * 2019-09-12 2019-12-05 藤森工業株式会社 粘着剤層及び粘着フィルム
CN111826617A (zh) * 2019-11-06 2020-10-27 深圳科诺桥科技股份有限公司 电磁波屏蔽膜及其制备方法
CN112920451B (zh) * 2021-02-09 2021-11-16 复旦大学 一种金属碳化物太赫兹电磁屏蔽复合材料及其制备方法
KR20230138492A (ko) 2021-02-25 2023-10-05 미쯔이가가꾸가부시끼가이샤 전자파 흡수 열전도성 재료 및 전자파 흡수 열전도성 하우징
WO2022214886A1 (en) 2021-04-08 2022-10-13 3M Innovative Properties Company Anti-reflective assemblies
CN116162373B (zh) * 2022-11-01 2023-11-10 开滦（集团）有限责任公司 一种基于二茂铁基聚合物包覆MXene复合材料的聚甲醛涂料及制备方法和应用
EP4421866A1 (en) * 2023-02-24 2024-08-28 Infineon Technologies AG Radio frequency semiconductor device and method for fabricating a radio frequency semiconductor device
CN116675560A (zh) * 2023-05-24 2023-09-01 中国人民解放军海军工程大学 一种高温泡沫陶瓷复合结构吸波材料及其制备方法

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Publication number Priority date Publication date Assignee Title
JP2018081735A (ja) * 2016-11-18 2018-05-24 独立行政法人国立高等専門学校機構 複合素子の製造方法
JP6733857B1 (ja) * 2019-02-20 2020-08-05 住友金属鉱山株式会社 電磁波吸収材料及び電磁波吸収体
WO2020170608A1 (ja) * 2019-02-20 2020-08-27 住友金属鉱山株式会社 電磁波吸収材料及び電磁波吸収体
JP6733858B1 (ja) * 2019-04-15 2020-08-05 住友金属鉱山株式会社 電磁波吸収材料及び電磁波吸収体
WO2020213215A1 (ja) * 2019-04-15 2020-10-22 住友金属鉱山株式会社 電磁波吸収材料及び電磁波吸収体
EP4159816A4 (en) * 2020-05-29 2024-11-06 Kyocera Corporation Resin composition and electronic component

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Publication number Publication date
JP2019143149A (ja) 2019-08-29
WO2014130431A2 (en) 2014-08-28
US9704613B2 (en) 2017-07-11
US20170271040A1 (en) 2017-09-21
US20160019996A1 (en) 2016-01-21
CN105009225B (zh) 2019-08-16
WO2014130431A3 (en) 2014-11-20
EP2959490A2 (en) 2015-12-30
US10340054B2 (en) 2019-07-02
CN105009225A (zh) 2015-10-28
US20190279783A1 (en) 2019-09-12

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