JP2016201557A5 - - Google Patents
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- Publication number
- JP2016201557A5 JP2016201557A5 JP2016135649A JP2016135649A JP2016201557A5 JP 2016201557 A5 JP2016201557 A5 JP 2016201557A5 JP 2016135649 A JP2016135649 A JP 2016135649A JP 2016135649 A JP2016135649 A JP 2016135649A JP 2016201557 A5 JP2016201557 A5 JP 2016201557A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- amide group
- structural unit
- containing polymer
- main chain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000003368 amide group Chemical group 0.000 claims 5
- 229920000642 polymer Polymers 0.000 claims 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 4
- 125000004432 carbon atom Chemical group C* 0.000 claims 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 4
- 238000005498 polishing Methods 0.000 claims 4
- 229910052710 silicon Inorganic materials 0.000 claims 4
- 239000010703 silicon Substances 0.000 claims 4
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 125000003156 secondary amide group Chemical group 0.000 claims 2
- 125000003142 tertiary amide group Chemical group 0.000 claims 2
- 239000006061 abrasive grain Substances 0.000 claims 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000000304 alkynyl group Chemical group 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims 1
- 125000001309 chloro group Chemical group Cl* 0.000 claims 1
- 125000004093 cyano group Chemical group *C#N 0.000 claims 1
- VILAVOFMIJHSJA-UHFFFAOYSA-N dicarbon monoxide Chemical group [C]=C=O VILAVOFMIJHSJA-UHFFFAOYSA-N 0.000 claims 1
- 125000001028 difluoromethyl group Chemical group [H]C(F)(F)* 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013120328 | 2013-06-07 | ||
| JP2013120328 | 2013-06-07 | ||
| JP2014010836 | 2014-01-23 | ||
| JP2014010836 | 2014-01-23 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015521346A Division JP6037416B2 (ja) | 2013-06-07 | 2014-05-02 | シリコンウエハ研磨用組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016201557A JP2016201557A (ja) | 2016-12-01 |
| JP2016201557A5 true JP2016201557A5 (enExample) | 2017-04-13 |
| JP6360108B2 JP6360108B2 (ja) | 2018-07-18 |
Family
ID=52007952
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015521346A Active JP6037416B2 (ja) | 2013-06-07 | 2014-05-02 | シリコンウエハ研磨用組成物 |
| JP2016135649A Active JP6360108B2 (ja) | 2013-06-07 | 2016-07-08 | シリコンウエハ研磨用組成物 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015521346A Active JP6037416B2 (ja) | 2013-06-07 | 2014-05-02 | シリコンウエハ研磨用組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US20160122591A1 (enExample) |
| EP (1) | EP3007213B1 (enExample) |
| JP (2) | JP6037416B2 (enExample) |
| KR (1) | KR102239045B1 (enExample) |
| CN (1) | CN105264647B (enExample) |
| SG (1) | SG11201508398TA (enExample) |
| TW (1) | TWI650410B (enExample) |
| WO (1) | WO2014196299A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6403324B2 (ja) * | 2014-12-25 | 2018-10-10 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| JP6366139B2 (ja) * | 2014-12-25 | 2018-08-01 | 花王株式会社 | シリコンウェーハ用研磨液組成物の製造方法 |
| US10748778B2 (en) | 2015-02-12 | 2020-08-18 | Fujimi Incorporated | Method for polishing silicon wafer and surface treatment composition |
| JP6705757B2 (ja) * | 2015-02-12 | 2020-06-03 | 株式会社フジミインコーポレーテッド | シリコンウェーハの研磨方法および表面処理組成物 |
| JP6654696B2 (ja) * | 2015-07-10 | 2020-02-26 | フエロ コーポレーション | 有機ポリマー系眼用基材を研磨するためのスラリー組成物及び方法、並びに眼用レンズ |
| JP6801964B2 (ja) * | 2016-01-19 | 2020-12-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びシリコン基板の研磨方法 |
| WO2017150118A1 (ja) | 2016-02-29 | 2017-09-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびこれを用いた研磨方法 |
| WO2018055941A1 (ja) * | 2016-09-21 | 2018-03-29 | 株式会社フジミインコーポレーテッド | 表面処理組成物 |
| EP3605588A4 (en) * | 2017-03-31 | 2021-01-13 | Fujimi Incorporated | POLISHING COMPOSITION |
| JP6916039B2 (ja) * | 2017-06-05 | 2021-08-11 | Ａｔシリカ株式会社 | 研磨用組成物 |
| CN111315835B (zh) * | 2017-11-06 | 2022-08-26 | 福吉米株式会社 | 研磨用组合物及其制造方法 |
| JP7353051B2 (ja) * | 2019-03-26 | 2023-09-29 | 株式会社フジミインコーポレーテッド | シリコンウェーハ研磨用組成物 |
| JP7356248B2 (ja) * | 2019-03-28 | 2023-10-04 | 株式会社フジミインコーポレーテッド | リンス用組成物およびリンス方法 |
| CN110922897B (zh) * | 2019-11-18 | 2024-03-08 | 宁波日晟新材料有限公司 | 一种用于硅化合物的低雾值无损伤抛光液及其制备方法 |
| JP7512035B2 (ja) * | 2019-12-24 | 2024-07-08 | ニッタ・デュポン株式会社 | 研磨用組成物 |
| EP4119292B1 (en) * | 2020-03-13 | 2026-02-18 | Fujimi Incorporated | Polishing composition and polishing method |
| WO2021182276A1 (ja) * | 2020-03-13 | 2021-09-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP7562453B2 (ja) | 2021-03-12 | 2024-10-07 | キオクシア株式会社 | 研磨液、研磨装置、及び研磨方法 |
| US20220396715A1 (en) * | 2021-06-14 | 2022-12-15 | Entegris, Inc. | Grinding of hard substrates |
| WO2023181928A1 (ja) | 2022-03-23 | 2023-09-28 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| WO2024195575A1 (ja) * | 2023-03-20 | 2024-09-26 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| WO2024263357A1 (en) * | 2023-06-21 | 2024-12-26 | Corning Incorporated | Coated articles, methods of polishing, and methods of making the same |
| WO2025115883A1 (ja) * | 2023-11-28 | 2025-06-05 | 大阪有機化学工業株式会社 | 研磨組成物 |
| WO2026083982A1 (ja) * | 2024-10-16 | 2026-04-23 | 大阪有機化学工業株式会社 | 研磨組成物および共重合体 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100447551B1 (ko) * | 1999-01-18 | 2004-09-08 | 가부시끼가이샤 도시바 | 복합 입자 및 그의 제조 방법, 수계 분산체, 화학 기계연마용 수계 분산체 조성물 및 반도체 장치의 제조 방법 |
| KR20010046395A (ko) * | 1999-11-12 | 2001-06-15 | 안복현 | 연마용 조성물 |
| TWI276169B (en) * | 2003-01-31 | 2007-03-11 | Hitachi Chemical Co Ltd | CMP abrasive and polishing method |
| US20090093118A1 (en) | 2005-04-14 | 2009-04-09 | Showa Denko K.K. | Polishing composition |
| WO2007055278A1 (ja) | 2005-11-11 | 2007-05-18 | Hitachi Chemical Co., Ltd. | 酸化ケイ素用研磨剤、添加液および研磨方法 |
| JPWO2008013226A1 (ja) * | 2006-07-28 | 2009-12-17 | 昭和電工株式会社 | 研磨組成物 |
| JP2008091524A (ja) * | 2006-09-29 | 2008-04-17 | Fujifilm Corp | 金属用研磨液 |
| JP2008181955A (ja) * | 2007-01-23 | 2008-08-07 | Fujifilm Corp | 金属用研磨液及びそれを用いた研磨方法 |
| JP2009123880A (ja) * | 2007-11-14 | 2009-06-04 | Showa Denko Kk | 研磨組成物 |
| US10144849B2 (en) * | 2008-02-01 | 2018-12-04 | Fujimi Incorporated | Polishing composition and polishing method using the same |
| KR101563023B1 (ko) * | 2008-02-18 | 2015-10-23 | 제이에스알 가부시끼가이샤 | 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법 |
| US8652350B2 (en) * | 2008-02-27 | 2014-02-18 | Jsr Corporation | Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method using the same, and method of recycling chemical mechanical polishing aqueous dispersion |
| CN102766407B (zh) * | 2008-04-23 | 2016-04-27 | 日立化成株式会社 | 研磨剂及使用该研磨剂的基板研磨方法 |
| WO2010122985A1 (ja) * | 2009-04-20 | 2010-10-28 | 日立化成工業株式会社 | 半導体基板用研磨液及び半導体基板の研磨方法 |
| KR20120048562A (ko) * | 2009-07-15 | 2012-05-15 | 램 리써치 코포레이션 | 진보된 기판 세정을 위한 재료 및 시스템 |
| KR101359092B1 (ko) * | 2009-11-11 | 2014-02-05 | 가부시키가이샤 구라레 | 화학적 기계적 연마용 슬러리 및 그것을 이용하는 기판의 연마 방법 |
| JP4772156B1 (ja) | 2010-07-05 | 2011-09-14 | 花王株式会社 | シリコンウエハ用研磨液組成物 |
| US20140030897A1 (en) * | 2011-02-03 | 2014-01-30 | Sumco Corporation | Polishing composition and polishing method using the same |
| CN104137232A (zh) * | 2012-02-21 | 2014-11-05 | 日立化成株式会社 | 研磨剂、研磨剂组和基体的研磨方法 |
| JP5822356B2 (ja) * | 2012-04-17 | 2015-11-24 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
-
2014
- 2014-05-02 KR KR1020157034595A patent/KR102239045B1/ko active Active
- 2014-05-02 US US14/895,318 patent/US20160122591A1/en not_active Abandoned
- 2014-05-02 SG SG11201508398TA patent/SG11201508398TA/en unknown
- 2014-05-02 EP EP14807048.5A patent/EP3007213B1/en active Active
- 2014-05-02 CN CN201480032514.3A patent/CN105264647B/zh active Active
- 2014-05-02 WO PCT/JP2014/062176 patent/WO2014196299A1/ja not_active Ceased
- 2014-05-02 JP JP2015521346A patent/JP6037416B2/ja active Active
- 2014-05-21 TW TW103117769A patent/TWI650410B/zh active
-
2016
- 2016-07-08 JP JP2016135649A patent/JP6360108B2/ja active Active
-
2017
- 2017-05-23 US US15/602,679 patent/US10745588B2/en active Active