JP2016178225A - 異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤 - Google Patents

異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤 Download PDF

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Publication number
JP2016178225A
JP2016178225A JP2015058068A JP2015058068A JP2016178225A JP 2016178225 A JP2016178225 A JP 2016178225A JP 2015058068 A JP2015058068 A JP 2015058068A JP 2015058068 A JP2015058068 A JP 2015058068A JP 2016178225 A JP2016178225 A JP 2016178225A
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JP
Japan
Prior art keywords
anisotropic conductive
terminal
base substrate
conductive adhesive
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015058068A
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English (en)
Japanese (ja)
Inventor
裕樹 大関
Hiroki Ozeki
裕樹 大関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2015058068A priority Critical patent/JP2016178225A/ja
Priority to CN202210519422.4A priority patent/CN115151035A/zh
Priority to PCT/JP2016/057473 priority patent/WO2016152543A1/ja
Priority to KR1020177024611A priority patent/KR101991191B1/ko
Priority to CN201680014182.5A priority patent/CN107432084A/zh
Priority to TW105108116A priority patent/TWI690250B/zh
Publication of JP2016178225A publication Critical patent/JP2016178225A/ja
Priority to HK18104540.7A priority patent/HK1245567A1/zh
Priority to JP2020151670A priority patent/JP7386773B2/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
JP2015058068A 2015-03-20 2015-03-20 異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤 Pending JP2016178225A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2015058068A JP2016178225A (ja) 2015-03-20 2015-03-20 異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤
CN202210519422.4A CN115151035A (zh) 2015-03-20 2016-03-09 各向异性导电连接结构体、各向异性导电连接方法和各向异性导电粘接剂
PCT/JP2016/057473 WO2016152543A1 (ja) 2015-03-20 2016-03-09 異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤
KR1020177024611A KR101991191B1 (ko) 2015-03-20 2016-03-09 이방성 도전 접속 구조체, 이방성 도전 접속 방법 및 이방성 도전 접착제
CN201680014182.5A CN107432084A (zh) 2015-03-20 2016-03-09 各向异性导电连接结构体、各向异性导电连接方法和各向异性导电粘接剂
TW105108116A TWI690250B (zh) 2015-03-20 2016-03-16 異方向性導電連接結構體、異方向性導電連接方法及異方向性導電接著劑
HK18104540.7A HK1245567A1 (zh) 2015-03-20 2018-04-06 各向異性導電連接結構體、各向異性導電連接方法和各向異性導電粘接劑
JP2020151670A JP7386773B2 (ja) 2015-03-20 2020-09-09 異方性導電接着剤、接続構造体、異方性導電接続方法、及び接続構造体の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015058068A JP2016178225A (ja) 2015-03-20 2015-03-20 異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020151670A Division JP7386773B2 (ja) 2015-03-20 2020-09-09 異方性導電接着剤、接続構造体、異方性導電接続方法、及び接続構造体の製造方法

Publications (1)

Publication Number Publication Date
JP2016178225A true JP2016178225A (ja) 2016-10-06

Family

ID=56977311

Family Applications (1)

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JP2015058068A Pending JP2016178225A (ja) 2015-03-20 2015-03-20 異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤

Country Status (6)

Country Link
JP (1) JP2016178225A (ko)
KR (1) KR101991191B1 (ko)
CN (2) CN115151035A (ko)
HK (1) HK1245567A1 (ko)
TW (1) TWI690250B (ko)
WO (1) WO2016152543A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016221703A (ja) * 2015-05-27 2016-12-28 ブラザー工業株式会社 液体吐出装置、液体吐出装置の製造方法、配線部材、及び、配線部材の製造方法
WO2018101003A1 (ja) * 2016-11-29 2018-06-07 デクセリアルズ株式会社 異方性導電接着剤

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2539684B (en) 2015-06-24 2018-04-04 Dst Innovations Ltd Method of surface-mounting components
CN113168935B (zh) * 2018-11-21 2023-06-30 三井化学株式会社 各向异性导电片、各向异性导电复合片、各向异性导电片组、电气检查装置及电气检查方法
JP2021036575A (ja) * 2018-12-17 2021-03-04 東芝ホクト電子株式会社 発光装置、接合部の保護方法、発光装置の製造方法、及び、車両用灯具
WO2023171294A1 (ja) * 2022-03-08 2023-09-14 株式会社村田製作所 伸縮性デバイス

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541091U (ja) * 1991-10-31 1993-06-01 住友ベークライト株式会社 異方導電圧着装置
JP2000165009A (ja) * 1998-11-30 2000-06-16 Optrex Corp 電極端子接続構造
JP2006022230A (ja) * 2004-07-08 2006-01-26 Sumitomo Bakelite Co Ltd 異方導電性接着剤および異方導電性接着剤フィルム
WO2010038753A1 (ja) * 2008-09-30 2010-04-08 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤及びそれを用いた接続構造体の製造方法
JP2010199527A (ja) * 2009-03-31 2010-09-09 Sony Chemical & Information Device Corp 接合体及びその製造方法
JP2012175004A (ja) * 2011-02-23 2012-09-10 Sekisui Chem Co Ltd 接続構造体の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3792554B2 (ja) 2001-03-26 2006-07-05 シャープ株式会社 表示モジュール及びフレキシブル配線板の接続方法
JP2009135388A (ja) 2007-10-30 2009-06-18 Hitachi Chem Co Ltd 回路接続方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541091U (ja) * 1991-10-31 1993-06-01 住友ベークライト株式会社 異方導電圧着装置
JP2000165009A (ja) * 1998-11-30 2000-06-16 Optrex Corp 電極端子接続構造
JP2006022230A (ja) * 2004-07-08 2006-01-26 Sumitomo Bakelite Co Ltd 異方導電性接着剤および異方導電性接着剤フィルム
WO2010038753A1 (ja) * 2008-09-30 2010-04-08 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤及びそれを用いた接続構造体の製造方法
JP2010199527A (ja) * 2009-03-31 2010-09-09 Sony Chemical & Information Device Corp 接合体及びその製造方法
JP2012175004A (ja) * 2011-02-23 2012-09-10 Sekisui Chem Co Ltd 接続構造体の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016221703A (ja) * 2015-05-27 2016-12-28 ブラザー工業株式会社 液体吐出装置、液体吐出装置の製造方法、配線部材、及び、配線部材の製造方法
WO2018101003A1 (ja) * 2016-11-29 2018-06-07 デクセリアルズ株式会社 異方性導電接着剤
JP2018088498A (ja) * 2016-11-29 2018-06-07 デクセリアルズ株式会社 異方性導電接着剤
CN109997237A (zh) * 2016-11-29 2019-07-09 迪睿合株式会社 各向异性导电粘接剂
JP2021168387A (ja) * 2016-11-29 2021-10-21 デクセリアルズ株式会社 異方性導電接着剤
JP7359804B2 (ja) 2016-11-29 2023-10-11 デクセリアルズ株式会社 異方性導電接着剤、発光装置及び発光装置の製造方法

Also Published As

Publication number Publication date
HK1245567A1 (zh) 2018-08-24
TW201644337A (zh) 2016-12-16
WO2016152543A1 (ja) 2016-09-29
CN107432084A (zh) 2017-12-01
CN115151035A (zh) 2022-10-04
KR101991191B1 (ko) 2019-06-19
TWI690250B (zh) 2020-04-01
KR20170113622A (ko) 2017-10-12

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