JP2016143738A5 - - Google Patents

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Publication number
JP2016143738A5
JP2016143738A5 JP2015017642A JP2015017642A JP2016143738A5 JP 2016143738 A5 JP2016143738 A5 JP 2016143738A5 JP 2015017642 A JP2015017642 A JP 2015017642A JP 2015017642 A JP2015017642 A JP 2015017642A JP 2016143738 A5 JP2016143738 A5 JP 2016143738A5
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JP
Japan
Prior art keywords
plasma processing
regression equation
processing apparatus
combination
emission intensity
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JP2015017642A
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English (en)
Japanese (ja)
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JP6310866B2 (ja
JP2016143738A (ja
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Priority claimed from JP2015017642A external-priority patent/JP6310866B2/ja
Priority to JP2015017642A priority Critical patent/JP6310866B2/ja
Application filed filed Critical
Priority to KR1020150106692A priority patent/KR101746044B1/ko
Priority to US14/825,098 priority patent/US10408762B2/en
Priority to TW104126399A priority patent/TWI546638B/zh
Publication of JP2016143738A publication Critical patent/JP2016143738A/ja
Publication of JP2016143738A5 publication Critical patent/JP2016143738A5/ja
Publication of JP6310866B2 publication Critical patent/JP6310866B2/ja
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Priority to US16/272,354 priority patent/US12442770B2/en
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JP2015017642A 2015-01-30 2015-01-30 プラズマ処理装置及びプラズマ処理方法並びに解析方法 Active JP6310866B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015017642A JP6310866B2 (ja) 2015-01-30 2015-01-30 プラズマ処理装置及びプラズマ処理方法並びに解析方法
KR1020150106692A KR101746044B1 (ko) 2015-01-30 2015-07-28 플라즈마 처리 장치 및 플라즈마 처리 방법과 해석 장치 및 해석 방법
US14/825,098 US10408762B2 (en) 2015-01-30 2015-08-12 Plasma processing apparatus, plasma processing method and plasma processing analysis method
TW104126399A TWI546638B (zh) 2015-01-30 2015-08-13 電漿處理裝置及電漿處理方法以及解析方法
US16/272,354 US12442770B2 (en) 2015-01-30 2019-02-11 Plasma processing apparatus, plasma processing method and plasma processing analysis method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015017642A JP6310866B2 (ja) 2015-01-30 2015-01-30 プラズマ処理装置及びプラズマ処理方法並びに解析方法

Publications (3)

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JP2016143738A JP2016143738A (ja) 2016-08-08
JP2016143738A5 true JP2016143738A5 (enExample) 2017-04-20
JP6310866B2 JP6310866B2 (ja) 2018-04-11

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US (2) US10408762B2 (enExample)
JP (1) JP6310866B2 (enExample)
KR (1) KR101746044B1 (enExample)
TW (1) TWI546638B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112018014159A2 (pt) * 2016-05-16 2018-12-11 Sintokogio Ltd método de processamento de tratamento de superfície e dispositivo de processamento de tratamento de superfície
JP6730941B2 (ja) * 2017-01-10 2020-07-29 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP6875224B2 (ja) 2017-08-08 2021-05-19 株式会社日立ハイテク プラズマ処理装置及び半導体装置製造システム
JP7058129B2 (ja) 2018-01-17 2022-04-21 株式会社日立ハイテク プラズマ処理装置
JP7075771B2 (ja) * 2018-02-08 2022-05-26 株式会社Ｓｃｒｅｅｎホールディングス データ処理方法、データ処理装置、データ処理システム、およびデータ処理プログラム
JP7074490B2 (ja) * 2018-02-08 2022-05-24 株式会社Ｓｃｒｅｅｎホールディングス データ処理方法、データ処理装置、データ処理システム、およびデータ処理プログラム
JP7080065B2 (ja) 2018-02-08 2022-06-03 株式会社Ｓｃｒｅｅｎホールディングス データ処理方法、データ処理装置、データ処理システム、およびデータ処理プログラム
JP7038563B2 (ja) * 2018-02-15 2022-03-18 東京エレクトロン株式会社 基板処理装置、流量制御方法及び流量制御プログラム
JP7108562B2 (ja) * 2019-02-22 2022-07-28 株式会社日立製作所 処理の制御パラメータの決定方法、及び計測システム
JP2020181959A (ja) * 2019-04-26 2020-11-05 東京エレクトロン株式会社 学習方法、管理装置および管理プログラム
US20250006478A1 (en) * 2023-06-28 2025-01-02 Mks Instruments, Inc. Pulse-Shaping Using A Sub-Region Tuning Apparatus And Method

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5170367A (en) * 1990-04-25 1992-12-08 The Expert System Technologies, Inc. Nondestructive determination of phase fractions of composite materials
JPH08330278A (ja) * 1995-05-30 1996-12-13 Anelva Corp 表面処理方法および表面処理装置
JP2927226B2 (ja) * 1995-12-18 1999-07-28 日本電気株式会社 形状シミュレーション方法
US5904487A (en) * 1996-10-08 1999-05-18 Advanced Micro Devices, Inc. Electrode reshaping in a semiconductor etching device
JP4227301B2 (ja) * 1998-02-03 2009-02-18 東京エレクトロンＡｔ株式会社 半導体プラズマ処理における終点検出方法
US7138156B1 (en) * 2000-09-26 2006-11-21 Myrick Michael L Filter design algorithm for multi-variate optical computing
US7297287B2 (en) * 2001-03-23 2007-11-20 Tokyo Electron Limited Method and apparatus for endpoint detection using partial least squares
JP3708031B2 (ja) * 2001-06-29 2005-10-19 株式会社日立製作所 プラズマ処理装置および処理方法
JP2003197609A (ja) * 2001-12-27 2003-07-11 Tokyo Electron Ltd プラズマ処理装置の監視方法及びプラズマ処理装置
AU2003235901A1 (en) * 2002-05-16 2003-12-02 Tokyo Electron Limited Method of predicting processing device condition or processed result
US7505879B2 (en) * 2002-06-05 2009-03-17 Tokyo Electron Limited Method for generating multivariate analysis model expression for processing apparatus, method for executing multivariate analysis of processing apparatus, control device of processing apparatus and control system for processing apparatus
US7712056B2 (en) * 2002-06-07 2010-05-04 Cadence Design Systems, Inc. Characterization and verification for integrated circuit designs
WO2004003969A2 (en) * 2002-06-28 2004-01-08 Tokyo Electron Limited Method and system for predicting process performance using material processing tool and sensor data
JP4464276B2 (ja) * 2002-08-13 2010-05-19 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US6830939B2 (en) * 2002-08-28 2004-12-14 Verity Instruments, Inc. System and method for determining endpoint in etch processes using partial least squares discriminant analysis in the time domain of optical emission spectra
JP4448335B2 (ja) * 2004-01-08 2010-04-07 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US7821655B2 (en) * 2004-02-09 2010-10-26 Axcelis Technologies, Inc. In-situ absolute measurement process and apparatus for film thickness, film removal rate, and removal endpoint prediction
US7079984B2 (en) * 2004-03-03 2006-07-18 Fisher-Rosemount Systems, Inc. Abnormal situation prevention in a process plant
US7533140B2 (en) * 2004-04-13 2009-05-12 Jaber Associates, L.L.C. Method and apparatus for enhancing processing speed for performing a least mean square operation by parallel processing
US7630064B2 (en) * 2006-03-16 2009-12-08 Tokyo Electron Limited Prediction method and apparatus for substrate processing apparatus
US7502709B2 (en) * 2006-03-28 2009-03-10 Tokyo Electron, Ltd. Dynamic metrology sampling for a dual damascene process
JP5192850B2 (ja) 2008-02-27 2013-05-08 株式会社日立ハイテクノロジーズ エッチング終点判定方法
US8396582B2 (en) * 2008-03-08 2013-03-12 Tokyo Electron Limited Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool
JP5334787B2 (ja) * 2009-10-09 2013-11-06 株式会社日立ハイテクノロジーズ プラズマ処理装置
US8489218B2 (en) * 2010-10-15 2013-07-16 Taiwan Semiconductor Manufacturing Company, Ltd. Chamber match using important variables filtered by dynamic multivariate analysis
US8883024B2 (en) * 2010-10-18 2014-11-11 Tokyo Electron Limited Using vacuum ultra-violet (VUV) data in radio frequency (RF) sources
JP2012190842A (ja) * 2011-03-08 2012-10-04 Renesas Electronics Corp 半導体装置の製造方法
US12002545B2 (en) * 2011-08-03 2024-06-04 ExSano, Inc. Technique for identifying features
JP5779482B2 (ja) * 2011-11-15 2015-09-16 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
JP2013161913A (ja) 2012-02-03 2013-08-19 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
US9240360B2 (en) * 2012-07-25 2016-01-19 International Business Machines Corporation Run-to-run control utilizing virtual metrology in semiconductor manufacturing
US9177875B2 (en) * 2013-11-15 2015-11-03 Taiwan Seminconductor Manufacturing Co., Ltd. Advanced process control method for controlling width of spacer and dummy sidewall in semiconductor device
US9256702B2 (en) * 2013-12-18 2016-02-09 Johnson Controls Technology Company Systems and methods for determining an appropriate model parameter order
JP6504770B2 (ja) * 2014-06-30 2019-04-24 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP6220319B2 (ja) * 2014-07-17 2017-10-25 株式会社日立ハイテクノロジーズ データ解析方法及びプラズマエッチング方法並びにプラズマ処理装置

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