JP2016054256A5 - - Google Patents

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Publication number
JP2016054256A5
JP2016054256A5 JP2014180254A JP2014180254A JP2016054256A5 JP 2016054256 A5 JP2016054256 A5 JP 2016054256A5 JP 2014180254 A JP2014180254 A JP 2014180254A JP 2014180254 A JP2014180254 A JP 2014180254A JP 2016054256 A5 JP2016054256 A5 JP 2016054256A5
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JP
Japan
Prior art keywords
suction
absorbing material
holes
vibration absorbing
temperature range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014180254A
Other languages
English (en)
Japanese (ja)
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JP2016054256A (ja
JP6382039B2 (ja
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Publication date
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Priority claimed from JP2014180254A external-priority patent/JP6382039B2/ja
Priority to JP2014180254A priority Critical patent/JP6382039B2/ja
Priority to CN201510490571.2A priority patent/CN105405805A/zh
Priority to TW104126196A priority patent/TWI566291B/zh
Priority to KR1020150117404A priority patent/KR20160028953A/ko
Priority to MYPI2015002168A priority patent/MY173967A/en
Publication of JP2016054256A publication Critical patent/JP2016054256A/ja
Publication of JP2016054256A5 publication Critical patent/JP2016054256A5/ja
Publication of JP6382039B2 publication Critical patent/JP6382039B2/ja
Application granted granted Critical
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Anticipated expiration legal-status Critical

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JP2014180254A 2014-09-04 2014-09-04 切断装置並びに吸着機構及びこれを用いる装置 Active JP6382039B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014180254A JP6382039B2 (ja) 2014-09-04 2014-09-04 切断装置並びに吸着機構及びこれを用いる装置
CN201510490571.2A CN105405805A (zh) 2014-09-04 2015-08-11 切断装置、吸附机构及具备吸附机构的装置
TW104126196A TWI566291B (zh) 2014-09-04 2015-08-12 A cutting device, an adsorption mechanism and a device having an adsorption mechanism
KR1020150117404A KR20160028953A (ko) 2014-09-04 2015-08-20 절단 장치, 흡착 기구 및 흡착 기구를 구비하는 장치
MYPI2015002168A MY173967A (en) 2014-09-04 2015-09-03 Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014180254A JP6382039B2 (ja) 2014-09-04 2014-09-04 切断装置並びに吸着機構及びこれを用いる装置

Publications (3)

Publication Number Publication Date
JP2016054256A JP2016054256A (ja) 2016-04-14
JP2016054256A5 true JP2016054256A5 (enrdf_load_stackoverflow) 2017-08-24
JP6382039B2 JP6382039B2 (ja) 2018-08-29

Family

ID=55471207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014180254A Active JP6382039B2 (ja) 2014-09-04 2014-09-04 切断装置並びに吸着機構及びこれを用いる装置

Country Status (5)

Country Link
JP (1) JP6382039B2 (enrdf_load_stackoverflow)
KR (1) KR20160028953A (enrdf_load_stackoverflow)
CN (1) CN105405805A (enrdf_load_stackoverflow)
MY (1) MY173967A (enrdf_load_stackoverflow)
TW (1) TWI566291B (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101899653B1 (ko) * 2016-10-05 2018-09-18 주식회사 포스코 소재 안착장치
JP6791581B2 (ja) * 2016-11-11 2020-11-25 株式会社ディスコ パッケージ基板切断用治具テーブル
JP6626027B2 (ja) * 2017-03-16 2019-12-25 Ｔｏｗａ株式会社 製造装置および電子部品の製造方法
JP2019016700A (ja) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持装置、搬送装置及び電子部品の製造装置
JP6886379B2 (ja) * 2017-09-28 2021-06-16 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、検査装置及び切断装置
JP7102157B2 (ja) * 2018-02-08 2022-07-19 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
CN108435714B (zh) * 2018-04-12 2023-08-29 环维电子(上海)有限公司 一种新型干冰清洗底座及其清洗方法
JP6746756B1 (ja) * 2019-05-24 2020-08-26 Ｔｏｗａ株式会社 吸着プレート、切断装置および切断方法
JP7390855B2 (ja) * 2019-10-24 2023-12-04 株式会社ディスコ 切削装置のチャックテーブル
JP7423161B2 (ja) * 2020-06-30 2024-01-29 株式会社ディスコ チャックテーブル
KR20230135661A (ko) * 2021-03-18 2023-09-25 토와 가부시기가이샤 가공 장치 및 가공품의 제조 방법
US11993066B2 (en) * 2021-03-31 2024-05-28 Taiwan Semiconductor Manufacturing Company, Ltd. Chuck, lamination process, and manufacturing method of semiconductor package using the same
CN118235234B (zh) * 2022-10-21 2025-02-21 株式会社东光高岳 工件检查装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62234686A (ja) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp 加工材料の切断方法
JPS62234685A (ja) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp 加工材料の切断方法
KR20040084128A (ko) * 2003-03-26 2004-10-06 한미반도체 주식회사 반도체 쏘잉장치의 척테이블
JP2004330417A (ja) * 2003-04-30 2004-11-25 Towa Corp 基板の切断方法、切断装置および基板吸着固定機構
JP2006229129A (ja) * 2005-02-21 2006-08-31 Fujitsu Ltd 真空吸着装置
JP2006344827A (ja) * 2005-06-09 2006-12-21 Renesas Technology Corp 半導体装置の製造方法
FR2893873B1 (fr) * 2005-11-25 2008-12-12 Air Liquide Procede de coupage avec un laser a fibre d'acier inoxydable
JP2008221391A (ja) * 2007-03-13 2008-09-25 Matsushita Electric Ind Co Ltd 基板吸着固定機構
JP5086690B2 (ja) * 2007-05-18 2012-11-28 日本特殊陶業株式会社 セラミック基板の製造方法
JP5117772B2 (ja) * 2007-06-28 2013-01-16 株式会社ディスコ 切削装置
JP2011040542A (ja) 2009-08-10 2011-02-24 Disco Abrasive Syst Ltd パッケージ基板の分割方法
JP2011216704A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体ウェハ加工用粘着テープ

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